Electronic Device and Pressure Sensing Module Thereof

• US 20180063947A1
• Filed: 03/27/2017
• Published: 03/01/2018
• Est. Priority Date: 08/25/2016
• Status: Active Grant

• Current Assignee: Wistron Corporation
• Original Assignee: Wistron Corporation
• Inventors: TSENG, Tien-Chung, LIEN, Chen-Chieh
• Granted Patent: US 10,111,323 B2
• Time in Patent Office: Days
• CPC Class Codes: G01L 1/20 by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids of piezo-resistive materials G01L1/18; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
• CPC Class Codes: H05K 1/0275 Security details, e.g. tampering prevention or detection
• CPC Class Codes: H05K 1/111 Pads for surface mounting, e.g. lay-out
• CPC Class Codes: H05K 1/16 incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 2201/09236 Parallel layout
• CPC Class Codes: H05K 2201/09263 Meander
• CPC Class Codes: H05K 2201/10053 Switch
• CPC Class Codes: H05K 5/0047 having a two-part housing enclosing a PCB
• CPC Class Codes: H05K 5/0208 Interlock mechanisms; Means for avoiding unauthorised use or function, e.g. tamperproof
• CPC Class Codes: H05K 5/03 Covers
• CPC Class Codes: H05K 7/1427 Housings

Abstract

A pressure sensing module for sensing a pressure applied to a circuit board is disclosed, The pressure sensing module includes a conductive pad, an elastic cover, a pushing part and a conductive unit. The conductive pad is connected to the circuit board. The elastic cover is connected to the circuit board and located on the conductive pad. The elastic cover includes a top end. The pushing part is connected to the top end. The conductive unit is located above the conductive pad. When the pushing part is not under pressure, the conductive unit does not move to touch the conductive pad. When the pushing part is under pressure, the pushing part causes the conductive unit to move toward the conductive pad such that the conductive unit touches the conductive pad.

Claims

1. A pressure sensing module, applied to a circuit board, the pressure sensing module comprising:

a conductive pad, connected to the circuit board;

an elastic cover, connected to the circuit board and located above the conductive pad, wherein the elastic cover comprises a top end;

a pushing part, connected to the top end; and

a conductive unit, located above the conductive pad;

wherein when the pushing part is not under pressure, the conductive unit does not move to touch the conductive pad;

when the pushing part is under pressure and moves toward the conductive pad, the pushing part causes the conductive unit to move toward the conductive pad such that the conductive unit touches the conductive pad.

2. The pressure sensing module as claimed in claim 1, wherein the conductive pad further comprises a first conductive circuit and a second conductive circuit;

when the conductive unit touches the conductive pad, the conductive unit touches the first conductive circuit and the second conductive circuit such that the first conductive circuit and the second conductive circuit are electrically connected to each other.

3. The pressure sensing module as claimed in claim 2, wherein the first conductive circuit further comprises at least one first conductive strip, the second conductive circuit further comprises at least one second conductive strip, and the at least one first conductive strip and the at least one second conductive strip are disposed in a staggered arrangement.

4. The pressure sensing module as claimed in claim 3, wherein the at least one first conductive strip and the at least one second conductive strip are arranged in a parallel configuration or in a spiral configuration.

5. The pressure sensing module as claimed in claim 4, further comprising an elastic unit, and the elastic unit is located between the elastic cover and the conductive pad.

6. The pressure sensing module as claimed in claim 5, further comprising a pressing shell, and the pressing shell is connected to the pushing part.

7. The pressure sensing module as claimed in claim 6, further comprising a protection shell, and the protection shell covers the elastic cover.

8. The pressure sensing module as claimed in claim 7, wherein the protection shell further comprises a guiding hole, and the pushing part passes through the guiding hole.

9. The pressure sensing module as claimed in claim 8, wherein the elastic unit is a sheet-shaped spring or a coil-shaped spring.

10. An electronic device, comprising:

a first case;

a second case;

a circuit board, connected to the second case;

a processor, connected to the circuit board; and

a pressure sensing module, for sensing a pressure applied by the first case, wherein the pressure sensing module comprises;

a conductive pad, connected to the circuit board and electrically connected to the processor;

an elastic cover, connected to the circuit board and located above the conductive pad, wherein the elastic cover comprises a top end;

a pushing part, connected to the top end; and

a conductive unit, located above the conductive pad;

wherein when the first case does not cover the second case, the pushing part is not under the pressure applied by the first case, such that the conductive unit does not move to touch the conductive pad;

when the first case covers the second case and the first case applies pressure to the pushing part, the pushing part moves toward the conductive pad and causes the conductive unit to move toward the conductive pad such that the conductive unit touches the conductive pad;

when the conductive unit touches the conductive pad, the conductive pad sends a conductive information to the processor.

11. The electronic device as claimed in claim 10, wherein the conductive pad further comprises a first conductive circuit and a second conductive circuit;

when the conductive unit touches the conductive pad, the conductive unit touches the first conductive circuit and the second conductive circuit to cause the first conductive circuit and the second conductive circuit to be electrically connected to each other to send the conductive information to the processor.

12. The electronic device as claimed in claim 11, wherein the first conductive circuit further comprises at least one first conductive strip, the second conductive circuit further comprises at least one second conductive strip, and the at least one first conductive strip and the at least one second conductive strip are disposed in a staggered arrangement.

13. The electronic device as claimed in claim 12, wherein the at least one first conductive strip and the at least one second conductive strip are arranged in a parallel configuration or in a spiral configuration.

14. The electronic device as claimed in claim 13, wherein the pressure sensing module further comprises an elastic unit, and the elastic unit is located between the elastic cover and the conductive pad.

15. The electronic device as claimed in claim 14, wherein the pressure sensing module further comprises a pressing shell, and the pressing shell is connected to the pushing part.

16. The electronic device as claimed in claim 15, wherein the pressure sensing module further comprises a protection shell, and the protection shell covers the elastic cover.

17. The electronic device as claimed in claim 16, wherein the protection shell further comprises a guiding hole, and the pushing part passes through the guiding hole.

18. The electronic device as claimed in claim 17, wherein the elastic unit is a sheet-shaped spring or a coil-shaped spring.