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Electronic Device and Pressure Sensing Module Thereof

  • US 20180063947A1
  • Filed: 03/27/2017
  • Published: 03/01/2018
  • Est. Priority Date: 08/25/2016
  • Status: Active Grant
First Claim
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1. A pressure sensing module, applied to a circuit board, the pressure sensing module comprising:

  • a conductive pad, connected to the circuit board;

    an elastic cover, connected to the circuit board and located above the conductive pad, wherein the elastic cover comprises a top end;

    a pushing part, connected to the top end; and

    a conductive unit, located above the conductive pad;

    wherein when the pushing part is not under pressure, the conductive unit does not move to touch the conductive pad;

    when the pushing part is under pressure and moves toward the conductive pad, the pushing part causes the conductive unit to move toward the conductive pad such that the conductive unit touches the conductive pad.

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