VERTICAL AND HORIZONTAL CIRCUIT ASSEMBLIES

• US 20180068935A1
• Filed: 08/31/2017
• Published: 03/08/2018
• Est. Priority Date: 09/06/2016
• Status: Active Grant

• Current Assignee: Semiconductor Components Industries LLC (ON Semiconductor Corporation)
• Original Assignee: Fairchild Semiconductor Corporation (ON Semiconductor Corporation)
• Inventors: TEYSSEYRE, Jerome, MANATAD, Romel, WU, Chung-Lin, DOSDOS, Bigildis, ALMAGRO, Erwin Ian, Estacio, Maria Cristina
• Granted Patent: US 10,256,178 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 23/495 Lead-frames or other flat leads H01L23/498 takes precedence; lead frame interconnections between components H01L23/52
• CPC Class Codes: H01L 23/49575 Assemblies of semiconductor devices on lead frames
• CPC Class Codes: H01L 23/49586 Insulating layers on lead frames
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence

Abstract

In a general aspect, an apparatus can include a leadframe including a plurality of leads configured to be coupled with a printed circuit board. The plurality of leads can be disposed along a single edge of the apparatus. The apparatus can also include an assembly including a substrate and a plurality of semiconductor die disposed on the substrate. The assembly can being mounted on the leadframe. The apparatus can further include an inductor having a first terminal and a second terminal. The first terminal of the inductor can being coupled with the leadframe via a first contact pad, and the second terminal of the inductor can be coupled with the leadframe via a second contact pad. The leadframe, the assembly and the inductor can be arranged in a stacked configuration.

Claims

1. An apparatus comprising:

a leadframe including a plurality of leads configured to be coupled with a printed circuit board, the plurality of leads being disposed along a single edge of the apparatus;

an assembly including a substrate and a plurality of semiconductor die disposed on the substrate, the assembly being mounted on the leadframe; and

an inductor having a first terminal and a second terminal,

the first terminal of the inductor being coupled with the leadframe via a first contact pad, and the second terminal of the inductor being coupled with the leadframe via a second contact pad, and

the leadframe, the assembly and the inductor being arranged in a stacked configuration.

2. The apparatus of claim 1, wherein the substrate includes one of a ceramic substrate or a multi-chip package.

3. The apparatus of claim 1, further comprising a molding compound, the leadframe being disposed in the molding compound.

4. The apparatus of claim 3, wherein the assembly is disposed in the molding compound.

5. The apparatus of claim 4, wherein the output inductor is disposed in the molding compound.

6. The apparatus of claim 4, wherein a surface of the substrate of the assembly is exposed through the molding compound.

7. The apparatus of claim 3, wherein the first contact pad and the second contact pad are included in the leadframe, respective surfaces of the first contact pad and the second contact pad being exposed through the molding compound.

8. The apparatus of claim 1, further comprising at least one passive device coupled with the leadframe.

9. The apparatus of claim 1, wherein the plurality of leads includes at least one straight lead and at least one bent lead, the at least one straight lead being configured to be coupled with a through-hole of the printed circuit board and the at least one bent lead being configured to be mounted on a surface of the printed circuit board.

10. The apparatus of claim 1, wherein the first contact pad and the second contact pad include, respectively, a first copper pedestal coupled with the leadframe and a second copper pedestal coupled with the leadframe.

11. The apparatus of claim 1, wherein the first contact pad and the second contact pad include, respectively, a first copper clip coupled with the leadframe and a second copper clip coupled with the leadframe.

12. The apparatus of claim 1, wherein the first terminal of the output inductor and the second terminal of the output inductor are soldered, respectively, to the first contact pad and the second contact pad.

13. The apparatus of claim 1, wherein the first terminal of the output inductor and the second terminal of the output inductor are frictionally held in contact with, respectively, the first contact pad and the second contact pad.

14. The apparatus of claim 1, wherein:

the assembly is mounted on a first side of the leadframe; and

the first terminal of the output inductor and the second terminal of the output inductor are coupled with a second side of the leadframe, the second side being opposite the first side.

15. The apparatus of claim 1, wherein the first terminal of the output inductor and the second terminal of the output inductor are coupled with a same side of the leadframe on which the assembly is mounted.

16. An apparatus comprising:

a leadframe including a plurality of leads configured to be coupled with a printed circuit board, the plurality of leads being disposed along a single edge of the apparatus;

an assembly including a substrate and a plurality of semiconductor die disposed on the substrate, the assembly being mounted on the leadframe; and

an inductor having a first terminal and a second terminal,

the first terminal of the inductor being coupled with the leadframe via a first contact pad, and the second terminal of the inductor being coupled with the leadframe via a second contact pad, and

the leadframe being disposed between the assembly and the inductor.

17. The apparatus of claim 16, further comprising a molding compound, at least one of the leadframe, the assembly and/or the output inductor being disposed in the molding compound.

18. The apparatus of claim 16, wherein the plurality of leads includes at least one straight lead and at least one bent lead, the at least one straight lead being configured to be coupled with a through-hole of the printed circuit board and the at least one bent lead being configured to be mounted on a surface of the printed circuit board.

19. The apparatus of claim 16, wherein the first contact pad and the second contact pad include, respectively, a first copper pedestal coupled with the leadframe and a second copper pedestal coupled with the leadframe.

20. The apparatus of claim 16, wherein the first contact pad and the second contact pad include, respectively, a first copper clip coupled with the leadframe and a second copper clip coupled with the leadframe.