INTEGRATED SENSING MODULE, INTEGRATED SENSING ASSEMBLY AND METHOD OF MANUFACTURING THE INTEGRATED SENSING MODULE

• US 20180069048A1
• Filed: 09/01/2017
• Published: 03/08/2018
• Est. Priority Date: 09/07/2016
• Status: Active Grant

• Current Assignee: Mei-Yen Lee
• Original Assignee: Mei-Yen Lee
• Inventors: WU, HSIEN-MING
• Granted Patent: US 10,332,929 B2
• Time in Patent Office: Days
• CPC Class Codes: G02B 5/208 for use with infrared or ultraviolet radiation, e.g. for separating visible light from infrared and/or ultraviolet radiation
• CPC Class Codes: G06V 40/1318 using electro-optical elements or layers, e.g. electroluminescent sensing
• CPC Class Codes: G06V 40/1329 Protecting the fingerprint sensor against damage caused by the finger
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/1462 Coatings
• CPC Class Codes: H01L 27/14632 Wafer-level processed structures
• CPC Class Codes: H01L 27/14636 Interconnect structures
• CPC Class Codes: H01L 27/14678 Contact-type imagers
• CPC Class Codes: H01L 27/14687 Wafer level processing
• CPC Class Codes: H01L 27/156 two-dimensional arrays
• CPC Class Codes: H10K 59/65 OLEDs integrated with inorganic image sensors

Abstract

An integrated sensing module includes: an image sensing chip including photo sensing units arranged in a two-dimensional array; a micro-hole layer disposed on the image sensing chip and having one or multiple micro holes corresponding to the photo sensing units, wherein the photo sensing units sense an optical image of an object through the one or multiple micro holes; and a transparent cover or a transparent cover assembly disposed over the micro-hole layer. An integrated sensing assembly and a method of manufacturing the integrated sensing module are also provided.

Claims

1. An integrated sensing module, comprising:

an image sensing chip comprising photo sensing units arranged in a two-dimensional array;

a micro-hole layer disposed on the image sensing chip and having one or multiple micro holes corresponding to the photo sensing units, wherein the photo sensing units sense an optical image of an object through the one or multiple micro holes; and

a transparent cover or a transparent cover assembly disposed over the micro-hole layer.

2. The integrated sensing module according to claim 1, wherein the image sensing chip comprises:

a substrate;

the photo sensing units formed in the substrate;

an inter-metal dielectric layer set and a metal connection layer disposed on the substrate and the photo sensing units;

an upper metal layer disposed on the inter-metal dielectric layer set; and

a protection layer disposed on the inter-metal dielectric layer set and the upper metal layer, wherein the upper metal layer obstructs partial light rays from the one or multiple micro holes to the photo sensing units.

3. The integrated sensing module according to claim 1, wherein the micro-hole layer comprises a patterned optical substrate.

4. The integrated sensing module according to claim 3, wherein the micro-hole layer further comprises an optical filter, wherein the optical filter is disposed in or over the patterned optical substrate, or between the image sensing chip and the patterned optical substrate.

5. The integrated sensing module according to claim 1, wherein the micro holes correspond to the photo sensing units in a many-to-one manner.

6. The integrated sensing module according to claim 1, wherein the micro holes corresponds to the photo sensing units in a one-to-one manner.

7. The integrated sensing module according to claim 1, wherein a first portion of a patterned optical substrate corresponding to the micro holes has a light converging or diverging effect, and a second portion of the patterned optical substrate corresponding to the micro holes does not have the light converging or diverging effect, so that the integrated sensing module senses different depths of images.

8. The integrated sensing module according to claim 1, wherein the micro holes have multiple sets of apertures and are staggered, and work in conjunction with different wavelengths of light sources, so that the integrated sensing module senses different depths of images.

9. The integrated sensing module according to claim 1, wherein the micro holes correspond to multiple overlapped sensing ranges.

10. The integrated sensing module according to claim 1, wherein the micro hole corresponds to the photo sensing units in a one-to-many manner, and the photo sensing units obtains the optical image according to an imaging principle of the one micro hole.

11. The integrated sensing module according to claim 10, wherein the photo sensing units sense the optical image of the object disposed on or over the transparent cover assembly through the micro hole.

12. The integrated sensing module according to claim 1, wherein the transparent cover assembly is a portion of an organic light emitting diode (OLED) display or a micro light-emitting diode (LED) display.

13. The integrated sensing module according to claim 1, wherein the image sensing chip further comprises multiple additional photo sensing units disposed on one or multiple sides of the photo sensing units.

14. The integrated sensing module according to claim 1, wherein the image sensing chip comprises:

a substrate, in which the photo sensing units are formed;

an inter-metal dielectric layer set formed on the substrate; and

a first protection layer formed on the inter-metal dielectric layer set.

15. The integrated sensing module according to claim 14, wherein the micro-hole layer comprises:

a patterned optical substrate bonded to the first protection layer.

16. The integrated sensing module according to claim 15, wherein the inter-metal dielectric layer set, and an obstructing glue is coated around the first protection layer and the patterned optical substrate to form a darkroom.

17. The integrated sensing module according to claim 1, wherein the transparent cover assembly comprises:

a transparent cover; and

an adhesive layer adhering the transparent cover to the micro-hole layer, wherein an upper surface of the transparent cover touches or approximates the object.

18. The integrated sensing module according to claim 1, wherein the transparent cover assembly and the micro-hole layer constitute a portion of an organic light emitting diode (OLED) display or micro light-emitting diode (LED) display.

19. The integrated sensing module according to claim 18, wherein the transparent cover assembly comprises:

an adhesive layer;

a lower glass plate adhered to a protection layer of the micro-hole layer by the adhesive layer;

a thin film transistor (TFT) layer set disposed on the lower glass plate;

a cathode layer disposed on the TFT layer set and having a stop;

an organic active layer or a micro LED layer disposed on the cathode layer;

an indium tin oxide (ITO) anode layer disposed on the organic active layer or the micro LED layer;

an upper glass plate disposed on the ITO anode layer;

a polarizer layer disposed on the upper glass plate;

an adhesive layer disposed on the polarizer layer; and

a transparent cover disposed on the adhesive layer, wherein the adhesive layer adheres the polarizer layer to the transparent cover.

20. The integrated sensing module according to claim 18, wherein the micro-hole layer comprises:

an adhesive layer;

a lower glass plate, wherein the adhesive layer adheres the lower glass plate to a protection layer of the image sensing chip;

a thin film transistor (TFT) layer set disposed on the lower glass plate; and

a cathode layer having the micro hole, wherein the transparent cover assembly comprises;

an organic active layer or a micro LED layer formed on the cathode layer;

an indium tin oxide (ITO) anode layer formed on the organic active layer or the micro LED layer;

an upper glass plate formed on the ITO anode layer;

a polarizer layer disposed on the upper glass plate;

an adhesive layer disposed on the polarizer layer; and

a transparent cover disposed on the adhesive layer, wherein the adhesive layer adheres the transparent cover to the polarizer layer.

21. The integrated sensing module according to claim 20, wherein the micro hole is formed on and between neighboring two electrode plates of the cathode layer or is formed in on single electrode plate of the cathode layer.

22. An integrated sensing assembly, comprising:

a circuit board;

a light source disposed on the circuit board;

the integrated sensing module according to claim 1, wherein the integrated sensing module is disposed on the circuit board and electrically connected to the circuit board, the light source is disposed on one or multiple sides of the transparent cover or the transparent cover assembly, and light rays of the light source projects from a side surface of the transparent cover or the transparent cover assembly onto the object.

23. A method of manufacturing an integrated sensing module, comprising:

providing an image sensing chip comprising photo sensing units arranged in a two-dimensional array;

forming a patterned optical substrate on the image sensing chip, wherein the patterned optical substrate is a portion of a micro-hole layer, the micro-hole layer is disposed on the image sensing chip and has one or multiple micro holes corresponding to the photo sensing units, wherein the photo sensing units sense an optical image of an object through the one or multiple micro holes; and

forming a transparent cover or a transparent cover assembly over the micro-hole layer, wherein the photo sensing units sense the optical image of the object, disposed on or over the transparent cover or the transparent cover assembly, through the micro hole or micro holes.

24. The method of manufacturing the integrated sensing module according to claim 23, wherein the one or multiple micro holes of the patterned optical substrate are formed by:

(a) etching through an optical substrate;

(b) etching an optical substrate without etching through the optical substrate;

or

(c) covering a patterned light-obstructing layer on an optical substrate.