Method And System For A Photonic Interposer

• US 20180069634A1
• Filed: 10/27/2017
• Published: 03/08/2018
• Est. Priority Date: 09/08/2008
• Status: Active Grant

• Current Assignee: Cisco Technology, Inc. (Cisco Systems, Inc.)
• Original Assignee: Luxtera Incorporated (Cisco Systems, Inc.)
• Inventors: Peterson, Mark, Young, Greg, De Dobbelaere, Peter
• Granted Patent: US 10,122,463 B2
• Time in Patent Office: Days
• CPC Class Codes: G02B 2006/12061 Silicon
• CPC Class Codes: G02B 2006/12142 Modulator
• CPC Class Codes: G02B 6/1225 comprising photonic band-gap structures or photonic lattices
• CPC Class Codes: H01L 21/84 the substrate being other than a semiconductor body, e.g. being an insulating body
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 23/49838 Geometry or layout
• CPC Class Codes: H01L 23/49866 characterised by the materials materials of the substrates H01L23/14, of the lead-frames H01L23/49579
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 27/1203 the substrate comprising an insulating body on a semiconductor body, e.g. SOI three-dimensional layout H01L27/0688
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H04B 10/43 using a single component as both light source and receiver, e.g. using a photoemitter as a photoreceiver
• CPC Class Codes: H04B 10/70 Photonic quantum communication
• CPC Class Codes: H04B 10/801 using optical interconnects, e.g. light coupled isolators, circuit board interconnections

Abstract

Methods and systems for a photonic interposer are disclosed and may include receiving one or more continuous wave (CW) optical signals in a silicon photonic interposer from an external optical source, from an optical source assembly via optical fibers coupled to the silicon photonic interposer. A modulated optical signal may be generated by processing the received CW optical signals based on a first electrical signal received from the electronics die. A second electrical signal may be generated in the silicon photonic interposer based on the generated modulated optical signals, and may then be communicated to the electronics die via copper pillars. Optical signals may be communicated into and/or out of the silicon photonic interposer utilizing grating couplers. The electronics die may comprise one or more of: a processor core, a switch core, memory, or a router.

Claims

1. A method for communication, the method comprising:

in an integrated optical communication system comprising a complementary metal-oxide semiconductor (CMOS) electronics die coupled to a silicon photonic interposer;

receiving a continuous wave (CW) optical signal in said silicon photonic interposer from an optical source coupled to said silicon photonic interposer via a first optical fiber;

generating a first modulated optical signal in said silicon photonic interposer by processing said received CW optical signal based on a first electrical signal received from one of said one or more CMOS electronics die;

communicating said first modulated optical signal out of said photonic interposer via a second optical fiber;

receiving a second modulated optical via a third optical fiber; and

generating a second electrical signal in said silicon photonic interposer based on said received second modulated optical signal.

2. The method according to claim 1, comprising communicating said second electrical signal to said CMOS electronics die via copper pillars.

3. The method according to claim 1, comprising generating said CW optical signal in an optical source assembly external to said silicon photonic interposer.

4. The method according to claim 1, wherein said optical source assembly comprises a semiconductor laser.

5. The method according to claim 1, comprising processing said received CW optical signal utilizing an optical modulator in said silicon photonic interposer.

6. The method according to claim 5, wherein said optical modulator comprises a Mach-Zehnder interferometer modulator.

7. The method according to claim 1, comprising generating said second electrical signal in said silicon photonic interposer a photodetector integrated in said silicon photonic interposer.

8. The method according to claim 1, comprising receiving said CW optical source signal and said second modulated optical signal using grating couplers in said silicon photonic interposer.

9. The method according to claim 1, wherein said electronics die comprises one or more of:

a processor core, a switch core, memory, or a router.

10. The method according to claim 1, wherein said integrated optical communication system comprises a plurality of transceivers.

11. A system for communication, the system comprising:

an integrated optical communication system comprising a complementary metal-oxide semiconductor (CMOS) electronics die coupled to a silicon photonic interposer, said integrated optical communication system being operable to;

receive a continuous wave (CW) optical signal in said silicon photonic interposer from an optical source coupled to said silicon photonic interposer via a first optical fiber;

generate a first modulated optical signal by processing said received CW optical signal based on a first electrical signal received from said CMOS electronics die;

communicate said first modulated optical signal out of said photonic interposer via a second optical fiber;

receive a second modulated optical via a third optical fiber; and

generate a second electrical signal in said silicon photonic interposer based on said received second modulated optical signal.

12. The system according to claim 11, wherein said integrated optical communication system is operable to communicate said second electrical signal to said CMOS electronics die via copper pillars.

13. The system according to claim 11, wherein said integrated optical communication system is operable to generate said CW optical signal in an optical source assembly external to said silicon photonic interposer.

14. The system according to claim 13, wherein said optical source assembly comprises a semiconductor laser.

15. The system according to claim 11, wherein said integrated optical communication system is operable to process said received CW optical signal utilizing an optical modulator in said silicon photonic interposer.

16. The system according to claim 15, wherein said optical modulator comprises a Mach-Zehnder interferometer modulator.

17. The system according to claim 11, wherein said integrated optical communication system is operable to generate said second electrical signal in said silicon photonic interposer utilizing a photodetector integrated in said silicon photonic interposer.

18. The system according to claim 11, wherein said integrated optical communication system is operable to receive said CW optical signal via grating couplers in said silicon photonic interposer.

19. The system according to claim 11, wherein said electronics die comprises one or more of:

a processor core, a switch core, memory, or a router.

20. A system for communication, the system comprising:

an integrated optical communication system comprising a complementary metal-oxide semiconductor (CMOS) electronics die coupled to a silicon photonic interposer, said integrated optical communication system being operable to;

receive a continuous wave (CW) optical signal in said photonics die from an optical source coupled to said silicon photonic interposer via an optical fiber;

generate a first modulated optical signal by modulating said received CW optical signal based on a first electrical signal received from said CMOS electronics die;

communicate said first modulated optical signal out of said silicon photonic interposer via a second optical fiber;

receive a second modulated optical signal via a third optical fiber; and

generate a second electrical signal in said silicon photonic interposer based on said received second modulated optical signal.