IMAGING DEVICE, ENDOSCOPE SYSTEM, AND METHOD OF MANUFACTURING IMAGING DEVICE

• US 20180070799A1
• Filed: 11/20/2017
• Published: 03/15/2018
• Est. Priority Date: 05/29/2015
• Status: Abandoned Application

• Current Assignee: Olympus Corporation
• Original Assignee: Olympus Corporation
• Inventors: SEKIDO, Takanori
• Application Number:
  US15/817,455
• Publication Number:
  US 20180070799A1
• Time in Patent Office: Days
• CPC Class Codes: A61B 1/00045 Display arrangement
• CPC Class Codes: A61B 1/0011 Manufacturing of endoscope parts
• CPC Class Codes: A61B 1/00114 Electrical cables in or with an endoscope
• CPC Class Codes: A61B 1/04 combined with photographic or television appliances
• CPC Class Codes: A61B 1/051 Details of CCD assembly
• CPC Class Codes: A61B 1/06 with illuminating arrangements
• CPC Class Codes: H01L 2224/131 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/1623 the bump connector connecting to a pin of the item
• CPC Class Codes: H01L 2224/16238 the bump connector connecting to a bonding area protruding from the surface of the item
• CPC Class Codes: H01L 2224/1713 Square or rectangular array
• CPC Class Codes: H01L 2224/81 using a bump connector
• CPC Class Codes: H01L 2224/81191 wherein the bump connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/94 at wafer-level, i.e. with connecting carried out on a wafer comprising a plurality of undiced individual devices
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 24/94 at wafer-level, i.e. with connecting carried out on a wafer comprising a plurality of undiced individual devices
• CPC Class Codes: H01L 27/14636 Interconnect structures
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H04N 23/50 Constructional details
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/555 : for picking-up images in sites, inaccessible due to their dimensions or hazardous conditions, e.g. endoscopes or borescopes
• CPC Class Codes: H04N 23/56 : provided with illuminating means

Abstract

An imaging device includes: an image sensor including a light receiving unit, and sensor electrodes; a relay board including at least one rectangular substrate, one or more electronic components, a body part, substrate electrodes, cable electrodes, and pins standing on the substrate and configured to electrically connect the substrate electrodes and the cable electrodes, wherein the substrate electrodes are electrically and mechanically connected with the sensor electrodes; and a cable assembly including cables, and a cable fixing member, wherein cores of the cables exposed on an connection face of the cable fixing member are electrically and mechanically connected with the cable electrodes. A coefficient of thermal expansion of the image sensor, a coefficient of thermal expansion of the relay board, and a coefficient of thermal expansion of the cable assembly vary gradually in descending order or ascending order.

Claims

1. An imaging device comprising:

an image sensor including

a light receiving unit configured to perform photoelectric conversion on incident light to generate in electrical signal, and

a plurality of sensor electrodes formed on a rear face opposite to a face on which the light receiving unit is formed;

a relay board including

at least one rectangular substrate,

one or more electronic components mounted on the substrate,

a body part formed of encapsulating resin encapsulating the electronic components and formed in a quadrangular prism having a cross-section of a same shape as a projection area of the substrate,

substrate electrodes formed on a front face of the relay board,

cable electrodes formed on a rear face of the relay board, and

a plurality of pins standing on the substrate and configured to electrically connect the substrate electrodes and the cable electrodes,

wherein the substrate electrodes are electrically and mechanically connected with the sensor electrodes of the image sensor; and

a cable assembly including

a plurality of cables, and

a cable fixing member fixing the cables,

wherein cores of the cables exposed on an connection face of the cable fixing member are electrically and mechanically connected with the cable electrodes of the relay board,

wherein a coefficient of thermal expansion of the image sensor, a coefficient of thermal expansion of the relay board, and a coefficient of thermal expansion of the cable assembly vary gradually in descending order or ascending order.

2. The imaging device according to claim 1,

wherein the substrate of the relay board is positioned to be perpendicular to an optical axis of the image sensor, and a first relay unit and a second relay unit are formed on a front face and a rear face, respectively, of the substrate,

the first relay unit includes

a first electronic component mounted on the front face of the substrate,

a first body part formed of first encapsulating resin encapsulating the first electronic component,

the substrate electrodes provided on a front face of the first body part, and

a plurality of first pins standing on the front face of the substrate,

the second relay unit includes

a second electronic component mounted on the rear face of the substrate,

a second body part formed of second encapsulating resin encapsulating the second electronic component,

the cable electrodes provided on a rear face of the second body part, and

a plurality of second pins standing on the rear face of the substrate, and

the coefficient of thermal expansion of the image sensor, a coefficient of thermal expansion of the first encapsulating resin, a coefficient of thermal expansion of the second encapsulating resin, and the coefficient of thermal expansion of the cable assembly vary gradually in descending order or ascending order.

3. The imaging device according to claim 2, wherein

the relay board and the cable assembly have sizes that are equal to or smaller than a projection area of the image sensor in an optical axis direction, and

positions of the substrate electrodes and positions from the cable electrodes on a plane perpendicular to the optical axis direction are different from each other.

4. The imaging device according to claim 1, wherein the relay board includes a plurality of dummy pins that are positioned on the substrate, the dummy pins being not electrically connected with the sensor electrodes and/or the cores.

5. The imaging device according to claim 4, wherein the dummy pins stand around an electronic component having a high heat radiation among the one or more electronic components mounted on the substrate.

6. The imaging device according to claim 4, wherein the dummy pins are provided to be exposed at a side face, which is parallel to the optical axis direction, among side faces of the body part.

7. The imaging device according to claim 4, wherein the dummy pins stand on a pattern drawn from an electronic component having a high heat radiation among the one or more electronic components mounted on the substrate.

8. An endoscope system to be inserted into a living body to image an inside of the living body, the endoscope system comprising:

an endoscope including the imaging device according to claim 1 at a distal end portion.

9. A method of manufacturing the imaging device according to claim 1, the method comprising:

a mother board producing step of producing a mother board of the relay board;

a first connection step of connecting sensor electrodes formed on a wafer with substrate electrodes formed on a front face of the mother board, a plurality of light receiving units and the sensor electrodes being formed on the wafer;

a second connection step of connecting the cores of the cables with cable electrodes formed on a rear face of the mother board, the cores being exposed on a connection plane of a large cable assembly including the cable assemblies connected by the cable fixing member; and

a dicing step of dicing the wafer, the mother board, and the large cable assembly in parallel with an optical axis direction of the light receiving units to form the imaging device.