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SUBSTRATE PROCESSING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME

  • US 20180073131A1
  • Filed: 06/22/2017
  • Published: 03/15/2018
  • Est. Priority Date: 09/09/2016
  • Status: Active Grant
First Claim
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1. A substrate processing apparatus, comprising:

  • a chamber accommodating a substrate;

    a substrate support in the chamber, the substrate support supporting the substrate;

    a gas injector to inject an oxidizing gas for oxidizing a metal layer to be disposed on the substrate;

    a cooler under the substrate to cool the substrate;

    a target mount disposed on the substrate, the target mount including a target for performing a sputtering process; and

    a blocker between the target and the gas injector, the blocker shielding the target from the oxidizing gas injected from the gas injector.

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