FLEXIBLE CONDUCTIVE DIAPHRAGM, FLEXIBLE VIBRATION SENSOR AND PREPARATION METHOD AND APPLICATION THEREOF

• US 20180073917A1
• Filed: 08/13/2015
• Published: 03/15/2018
• Est. Priority Date: 03/17/2015
• Status: Active Grant

• Current Assignee: Suzhou Institute of Nano-Tech and Nano-Bionics
• Original Assignee: Suzhou Institute of Nano-Tech and Nano-Bionics
• Inventors: Zhang, Ting, Gu, Yang
• Granted Patent: US 10,295,401 B2
• Time in Patent Office: Days
• CPC Class Codes: G01H 11/06 by electric means
• CPC Class Codes: G01P 5/08 by measuring variation of an electric variable directly affected by the flow, e.g. by using dynamo-electric effect
• CPC Class Codes: G01P 5/24 by measuring the direct influence of the streaming fluid on the properties of a detecting acoustical wave
• CPC Class Codes: H04R 2307/023 Diaphragms comprising ceramic-like materials, e.g. pure ceramic, glass, boride, nitride, carbide, mica and carbon materials
• CPC Class Codes: H04R 2307/025 Diaphragms comprising polymeric materials
• CPC Class Codes: H04R 7/12 Non-planar diaphragms or cones
• CPC Class Codes: H04R 7/14 corrugated, pleated or ribbed

Abstract

The invention discloses a flexible conductive diaphragm comprising at least one conductive film, and the conductive film comprises a flexible support layer (1), a flexible sensitive layer (2) overlapped on the flexible support layer (1), a flexible conductive layer (3) overlapped on the flexible sensitive layer (2), and an electrode (4) electrically connected with the flexible conductive layer (3). The invention further discloses a method for preparing the flexible conductive diaphragm, and a flexible vibration sensor based on the flexible conductive diaphragm. With the combination of the techniques such as the flexible material, the nano-material and the arrayed micro-structure, the flexible vibration sensor of the present invention has the characteristics of high sensitivity, low preparation cost, light weight, small thickness, small size, and being foldable and flexible, and can be applied in wearable or adherable electronic devices.

Claims

1. A flexible conductive diaphragm, characterized in that:

it comprises at least a conductive film, wherein the conductive film comprises a flexible support layer, a flexible sensitive layer overlapped on the flexible support layer, a flexible conductive layer overlapped on the flexible sensitive layer, and an electrode electrically connected with the flexible conductive layer.

2. The flexible conductive diaphragm according to claim 1, characterized in that:

it comprises more than two conductive films which are overlapped, wherein the flexible conductive layers of adjacent conductive films are contacted with each other to form a contact resistance layer with a resistance being adjustable.

3. The flexible conductive diaphragm according to claim 2, characterized in that:

it comprises a plurality of conductive films which are overlapped, and more than two contact resistance layers are formed between the plurality of conductive films.

4. The flexible conductive diaphragm according to claim 1, characterized in that:

the combining strength between the flexible sensitive layer and the flexible support layer is enough to ensure that the flexible sensitive layer can be removed directly from the template for the flexible sensitive layer without any damage.

5. The flexible conductive diaphragm according to claim 4, characterized in that:

the flexible sensitive layer is adhered and fixed to the flexible support layer;

or, the flexible sensitive layer and the flexible support layer are combined with each other through a polymer cross-linking reaction.

6. The flexible conductive diaphragm according to claim 1, characterized in that:

the flexible sensitive layer has a thickness of 0.1˜

200 μ

m.

7. The flexible conductive diaphragm according to claim 1, characterized in that:

more than one flexible layer is further arranged between the flexible support layer and the flexible sensitive layer and/or between the flexible sensitive layer and the flexible conductive layer.

8. The flexible conductive diaphragm according to claim 1, characterized in that:

an arrayed micro-structure is provided on a surface of the flexible sensitive layer, the micro-structure includes a non-planar micro-structure, and the non-planar micro-structure includes pyramid, rectangular pyramid, triangular pyramid, hemisphere, or cylinder micro-structure.

9. The flexible conductive diaphragm according to claim 8, characterized in that:

the flexible conductive layer is conformally adhered on a surface of the flexible sensitive layer.

10. The flexible conductive diaphragm according to claim 9, characterized in that:

it comprises more than two conductive films which are overlapped, wherein a top point of a non-planar micro-structure of one flexible conductive layer is electrically contacted with another matching flexible conductive layer.

11. The flexible conductive diaphragm according to claim 10, characterized in that:

wherein a top point of a non-planar micro-structure of one flexible conductive layer is electrically contacted with a planar area of another matching flexible conductive layer.

12. The flexible conductive diaphragm according to claim 1, characterized in that:

the material of the flexible sensitive layer or the flexible support layer includes high polymer material which is at least selected from polyethylene terephthalate, polydimethylsiloxane, polyimide, polyurethane, polyvinyl alcohol, polyvinyl formal, and polyethylene.

13. A method for preparing the flexible conductive diaphragm according to claim 1, characterized in that it comprises steps of:

(1) preparing a template for a flexible sensitive layer and forming a flexible sensitive layer on a surface of the template;

(2) forming a flexible support layer on the flexible sensitive layer;

(3) removing the flexible sensitive layer and the flexible support layer from the template;

(4) forming a flexible conductive layer on the flexible sensitive layer, and electrically connecting an electrode to the flexible conductive layer.

14. The method for preparing the flexible conductive diaphragm according to claim 13, characterized in that the step (2) comprises:

performing surface treatment for the flexible support layer or the flexible sensitive layer, then combining the flexible support layer and the flexible sensitive layer, wherein the surface treatment is performed in a manner including strong acid oxidation, plasma treatment, or ultraviolet and ozone treatment.

15. A flexible vibration sensor, characterized in that:

it comprises the flexible conductive diaphragm according to claim 1.

16. (canceled)