TEMPERATURE DETECTION DEVICE

• US 20180073937A1
• Filed: 04/18/2017
• Published: 03/15/2018
• Est. Priority Date: 09/12/2016
• Status: Active Grant

• Current Assignee: Young Optics, Inc.
• Original Assignee: Young Optics, Inc.
• Inventors: SHIH, Chih-Yung, HUANG, Jia-Bin, HSU, Wen-Hsin
• Granted Patent: US 10,458,859 B2
• Time in Patent Office: Days
• CPC Class Codes: F21V 19/003 Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: G01K 1/16 Special arrangements for conducting heat from the object to the sensitive element
• CPC Class Codes: G01K 7/24 in a specially-adapted circuit, e.g. bridge circuit

Abstract

A temperature detection device includes a circuit board, a temperature sensor, and at least one signal transmission line. The temperature sensor is disposed on the circuit board and overlapped with a light source module, and the temperature sensor and the light source module forms a heat conduction path. The signal transmission line is connected to the circuit board to output a sensing signal of the temperature sensor.

Claims

1. A temperature detection device, comprising:

a circuit board;

a temperature sensor disposed on the circuit board and overlapped with a light source module, the temperature sensor and the light source module forming a heat conduction path; and

at least one signal transmission line connected to the circuit board to output a sensing signal of the temperature sensor.

2. The temperature detection device as claimed in claim 1, wherein the circuit board is a flexible printed circuit board.

3. The temperature detection device as claimed in claim 2, further comprising:

a rigid printed circuit board attached to one side of the flexible printed circuit board.

4. The temperature detection device as claimed in claim 3, wherein the flexible printed circuit board comprises a polyimide substrate.

5. The temperature detection device as claimed in claim 3, wherein the rigid printed circuit board comprises a bakelite substrate or a fiber glass substrate.

6. The temperature detection device as claimed in claim 1, further comprising:

a heat conductive medium disposed between the temperature sensor and a light source of the light source module and in contact with the temperature sensor and the light source.

7. The temperature detection device as claimed in claim 6, wherein the heat conductive medium is a thermally conductive adhesive.

8. The temperature detection device as claimed in claim 1, wherein the light source module is an LED module, and the temperature sensor is a thermistor.

9. The temperature detection device as claimed in claim 1, wherein the circuit board has at least one exposed metal point provided on one side of the circuit board facing a light source of the light source module, and the exposed metal point and the light source forms a part of the heat conduction path.

10. A temperature detection device, comprising:

a circuit board;

a temperature sensor disposed on the circuit board and overlapped with a light source module, the circuit board having at least one pad and at least one trace connected between the pad and the temperature sensor; and

at least one signal transmission line connected to the circuit board through the pad to output a sensing signal of the temperature sensor to a signal processing circuit.

11. The temperature detection device as claimed in claim 10, wherein the circuit board is a flexible printed circuit board.

12. The temperature detection device as claimed in claim 11, further comprising:

a rigid printed circuit board attached to one side of the flexible printed circuit board.

13. The temperature detection device as claimed in claim 12, wherein the flexible printed circuit board comprises a polyimide substrate.

14. The temperature detection device as claimed in claim 12, wherein the rigid printed circuit board comprises a bakelite substrate or a fiber glass substrate.

15. The temperature detection device as claimed in claim 10, further comprising:

a heat conductive medium disposed between the temperature sensor and a light source of the light source module and in contact with the temperature sensor and the light source.

16. The temperature detection device as claimed in claim 15, wherein the heat conductive medium is a thermally conductive adhesive.

17. The temperature detection device as claimed in claim 10, wherein the light source module is an LED module, and the temperature sensor is a thermistor.

18. The temperature detection device as claimed in claim 10, wherein the circuit board has at least one exposed metal point provided on one side of the circuit board facing a light source of the light source module, and the exposed metal point and the light source forms a part of the heat conduction path.

19. A temperature detection device for detecting a temperature of an LED die, the temperature detection device comprising:

a flexible printed circuit board;

a thermistor disposed on the flexible printed circuit board and overlapped with the LED die;

a heat conductive medium disposed between the thermistor and the LED die and in contact with the thermistor and the LED die, and the thermistor, the heat conductive medium and the LED die forming a heat conduction path;

at least one signal transmission line connected to the flexible printed circuit board, the signal transmission line outputting a resistance signal of the thermistor to a signal processing circuit to convert the resistance signal into a corresponding temperature value; and

a rigid printed circuit board attached to one side of the flexible printed circuit board.

20. The temperature detection device as claimed in claim 19, wherein the flexible printed circuit board comprises a polyimide substrate, and the rigid printed circuit board comprises a bakelite substrate or a fiber glass substrate.