LIGHT EMITTING DIODES AND METHODS
First Claim
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1. A light emitting diode (LED) apparatus, comprising:
- a substrate;
one or more light emitting diode (LED) disposed over the substrate; and
an encapsulant layer applied after the one or more LED is disposed over the substrate, wherein the encapsulant layer comprises an underfill layer;
wherein the encapsulant layer is disposed around the one or more LED and at least partially between the one or more LEDs and the substrate,wherein the one or more LED is devoid of any reflective material on a lower surface of the one or more LED facing the substrate.
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Abstract
Light emitting diode (LED) devices, methods and systems are provided. An example apparatus can include an underfill layer separate from a bonding layer. The apparatus can further include a dark encapsulating layer comprising an epoxy-molded compound which is applied using a powder-coating process. A method for providing a powder-coated encapsulation and for producing an LED panel with such an encapsulant is disclosed.
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Citations
41 Claims
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1. A light emitting diode (LED) apparatus, comprising:
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a substrate; one or more light emitting diode (LED) disposed over the substrate; and an encapsulant layer applied after the one or more LED is disposed over the substrate, wherein the encapsulant layer comprises an underfill layer; wherein the encapsulant layer is disposed around the one or more LED and at least partially between the one or more LEDs and the substrate, wherein the one or more LED is devoid of any reflective material on a lower surface of the one or more LED facing the substrate. - View Dependent Claims (2, 3, 4)
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5. A method of controlling light output, comprising
providing a substrate and one or more light emitting diodes (LEDs) disposed over the substrate; -
applying an underfill layer after the one or more LEDs are disposed over the substrate, wherein the underfill layer is disposed at least partially between the one or more LEDs and the substrate; and controlling light output from the one or more LEDs by selectively applying a reflective underfill layer to increase light output from the one or more LEDs or applying a non-reflective or dark underfill layer to decrease light output from the one or more LEDs.
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6. A light emitting diode (LED) apparatus, comprising:
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a substrate; one or more light emitting diodes (LEDs); and a powder-coated material disposed over the substrate. - View Dependent Claims (7, 8, 9, 10, 11)
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12. A light emitting diode (LED) apparatus, comprising:
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a substrate; one or more light emitting diodes (LEDs); one or more light-transmissive layer disposed over the substrate and one or more LEDs; and one or more dark layer disposed over the one or more light-transmissive layer, wherein a region above the one or more LEDs is substantially or completely devoid of the one or more dark layer. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30)
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31. A method of producing a panel of light emitting diodes (LEDs), the method comprising:
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providing a substrate with at least one LED disposed over the substrate; applying one or more light-transmissive layer over the at least one LED; applying one or more dark layer over the light-transmissive layer; and removing at least a portion of the layers in a region above the at least one LED to expose at least a portion of the one or more light-transmissive layer. - View Dependent Claims (32, 33, 34, 35, 36, 37, 38)
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39. A method of encapsulating a light emitting diode (LED) device, the method comprising:
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providing a substrate with at least one LED disposed over the substrate; and powder-coating the substrate and/or the LED with a powder using a powder spray or an electrostatic powder-coating process. - View Dependent Claims (40, 41)
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Specification