LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF

• US 20180076369A1
• Filed: 09/08/2017
• Published: 03/15/2018
• Est. Priority Date: 09/09/2016
• Status: Active Grant

• Current Assignee: Epistar Corporation
• Original Assignee: Epistar Corporation
• Inventors: CHENG, Ching-Tai, LAI, Lung-Kuan, RENN, Yih-Hua, HSIEH, Min-Hsun
• Granted Patent: US 10,381,536 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 2224/11 Manufacturing methods
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2933/0033 relating to semiconductor body packages
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/647 the elements conducting electric current to or from the semiconductor body

Abstract

A light-emitting device includes a light-emitting element, a light pervious layer, an electrode defining layer, a first soldering pad and a second soldering pad. The light-emitting element has an upper surface, a bottom surface, and a lateral surface arranged between the upper surface and the bottom surface. The light pervious layer covers the upper surface and the lateral surface. The electrode defining layer covers a part of the light pervious layer. The first soldering pad and the second soldering pad are surrounded by the electrode defining layer. A gap is located between the first soldering pad and the second soldering pad while the gap remains substantially constant.

Claims

1. A light-emitting device, comprising:

a light-emitting element, comprising a upper surface, a bottom surface and a lateral surface arranged between the upper surface and bottom surface;

a light pervious layer covering the upper surface and the lateral surface;

an electrode defining layer covering a portion of the light pervious layer; and

a first soldering pad and a second soldering pad surrounded by the electrode defining layer,

wherein a gap is located between the first soldering pad and the second soldering pad while the gap remains substantially constant.

2. The light-emitting device according to claim 1, wherein the gap is not greater than 40 μ

m.

3. The light-emitting device according to claim 1, wherein the light-emitting element further comprises a plurality of conductive pads disposed on the same side of the light-emitting element.

4. The light-emitting device according to claim 1, wherein the light-emitting element further comprises a conductive pad corresponding to the first soldering pad.

5. The light-emitting device according to claim 4, wherein the first soldering pad is physically and electrically connected to the conductive pad.

6. The light-emitting device according to claim 4, wherein the first soldering pad has a first projected area and the conductive pad has a second projected area, and a ratio of the first projected area to the second area is not less than 0.9.

7. The light-emitting device according to claim 1, wherein the light pervious layer comprising a wavelength conversion layer and a light-adjusting layer.

8. The light-emitting device according to claim 1, wherein the light-adjusting layer comprises a plurality of light-diffusing particles.

9. The light-emitting device according to claim 1, wherein the electrode defining layer comprises a plurality of recesses, and the first soldering pad and the second soldering pad are respectively arranged in the recesses.

10. The light-emitting device according to claim 1, wherein the electrode defining layer comprises a recess having an shape the same as that of the first soldering pad.

11. The light-emitting device according to claim 1, wherein the electrode defining layer comprises a step structure.

12. The light-emitting device according to claim 1, wherein the electrode defining layer comprises a transparent binder and a plurality of light-reflecting particles dispersed in the transparent binder.

13. The light-emitting device according to claim 1, wherein the first soldering pad includes an area expanded outward from the light-emitting element.

14. The light-emitting device according to claim 1, wherein the first soldering pad, the second soldering pad or both comprises one corner.

15. The light-emitting device according to claim 1, wherein the electrode defining layer comprises a first surface and the first soldering pad comprises a second surface, and the first surface has a different high from the second surface of not greater than 10 μ

m.

16. The light-emitting device according to claim 1, wherein the first soldering pad and the second soldering pad have a melting temperature not greater than 280°

C.

17. The light-emitting device according to claim 1, wherein the first soldering pad comprises a first tin alloy and a second tin alloy, and the first tin alloy has a melting temperature higher than that of the second tin alloy.

18. The light-emitting device according to claim 17, wherein the second tin alloy is closer to the light-emitting element than the first tin alloy.

19. The light-emitting device according to claim 1, wherein the first soldering pad comprises Sn/Sb alloy.

20. The light-emitting device according to claim 1, further comprising a thin metal layer arranged between the electrode defining layer and the first soldering pad.