SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
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Abstract
A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad. The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.
16 Citations
39 Claims
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1-8. -8. (canceled)
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9. A semiconductor light emitting device comprising:
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a first lead including a first thick portion and a first thin portion that is smaller in thickness than the first thick portion; a second lead spaced apart from the first lead in a first direction, the second lead including a second thick portion and a second thin portion that is smaller in thickness than the second thick portion; at least one semiconductor light source bonded on the first thick portion of the first lead, one of the at least one semiconductor light source being electrically connected to the second lead; a resin package supporting the first lead and the second lead, the resin package including an inclined surface that surrounds the at least one semiconductor light source in plan view; and a sealing resin disposed in a space defined by the inclined surface of the resin package, the sealing resin covering the at least one semiconductor light source, wherein the first thick portion, the first thin portion, the second thick portion, and the second thin portion each include an obverse surface and a reverse surface, the obverse surfaces of the first thick portion, the first thin portion, the second thick portion, and the second thin portion being flush with each other, the resin package includes a holding portion that is held in contact with the reverse surfaces of the first thin portion and the second thin portion, the reverse surfaces of the first thick portion and the second thick portion being exposed from the holding portion of the resin package, and the whole reverse surface of the first thick portion is surrounded by the resin package in bottom plan view. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36)
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37. A semiconductor light emitting device comprising:
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a first lead including a first thick portion and a first thin portion that is smaller in thickness than the first thick portion; a second lead spaced apart from the first lead in a first direction, the second lead including a second thick portion and a second thin portion that is smaller in thickness than the second thick portion; at least one semiconductor light source bonded on the first thick portion of the first lead, one of the at least one semiconductor light source being electrically connected to the second lead; a resin package supporting the first lead and the second lead, the resin package including an inclined surface that surrounds the at least one semiconductor light source in plan view; and a sealing resin disposed in a space defined by the inclined surface of the resin package, the sealing resin covering the at least one semiconductor light source, wherein the first thick portion, the first thin portion, the second thick portion, and the second thin portion each include an obverse surface and a reverse surface, the obverse surfaces of the first thick portion, the first thin portion, the second thick portion, and the second thin portion being flush with each other, the resin package includes a holding portion that is held in contact with the reverse surfaces of the first thin portion and the second thin portion, the reverse surfaces of the first thick portion and the second thick portion being exposed from the holding portion of the resin package, the whole reverse surface of the first thick portion is surrounded by the resin package in bottom plan view the first lead includes an outer shape that is non-rectangular in plan view, the resin package includes a side surface, at least a part of the first thin portion is exposed from the side surface of the resin package, the first thin portion includes an end surface that is exposed from the side surface of the resin package, the end surface of the first thin portion being flush with the side surface of the resin package, the resin package includes a reverse surface that is flush with each of the reverse surface of the first thick portion and the reverse surface of the second thick portion, and a whole part of one of the at least one semiconductor light source overlaps with the first thick portion in plan view. - View Dependent Claims (38, 39)
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Specification