METHOD OF MANUFACTURING PRESSURE SENSOR, DEPOSITION SYSTEM, AND ANNEALING SYSTEM

• US 20180076385A1
• Filed: 11/07/2017
• Published: 03/15/2018
• Est. Priority Date: 03/19/2014
• Status: Abandoned Application

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: FUJI, Yoshihiko, Fukuzawa, Hideaki, Kaji, Shiori
• Application Number:
  US15/805,389
• Publication Number:
  US 20180076385A1
• Time in Patent Office: Days
• CPC Class Codes: C23C 14/50 Substrate holders
• CPC Class Codes: C23C 16/458 characterised by the method used for supporting substrates in the reaction chamber
• CPC Class Codes: G01L 1/125 by using magnetostrictive means magnetostrictive sensors H10N35/101
• CPC Class Codes: G01L 9/0042 Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms details about the integration or bonding of piezoresistor in or on the diaphragm G01L9/0052 and G01L9/0057 respectively
• CPC Class Codes: G01L 9/16 by making use of variations in the magnetic properties of material resulting from the application of stress
• CPC Class Codes: G03F 7/707 Chucks, e.g. chucking or un-chucking operations or structural details
• CPC Class Codes: H01L 21/67288 Monitoring of warpage, curvature, damage, defects or the like
• CPC Class Codes: H01L 21/6838 with gripping and holding devices using a vacuum; Bernoulli devices
• CPC Class Codes: H01L 21/68728 characterised by a plurality of separate clamping members, e.g. clamping fingers
• CPC Class Codes: H01L 21/68742 characterised by a lifting arrangement, e.g. lift pins
• CPC Class Codes: H01L 21/6875 characterised by a plurality of individual support members, e.g. support posts or protrusions
• CPC Class Codes: H10N 50/01 Manufacture or treatment

Abstract

A method of manufacturing a pressure sensor comprises: above a film portion formed on one surface of a substrate, depositing a first magnetic layer, a second magnetic layer and an intermediate layer between the first and second magnetic layers on one surface of a substrate; removing the deposited layers leaving a part thereof; and removing a part of the substrate from another surface of the substrate. By removing the deposited layers leaving apart thereof, a strain detecting element is formed in a part of a first region, the strain detecting element comprising the first magnetic layer, the second magnetic layer and the intermediate layer. By removing a part of the substrate, a part of the first region of the substrate is removed. In addition, the deposition of the first magnetic layer is performed with the substrate being bended.

Claims

1. A method of manufacturing a pressure sensor comprising:

bending a substrate by pressing a first surface of the substrate with a member extending in a first direction;

depositing a first magnetic layer on a second surface of the substrate while the substrate is bended, a magnetization direction of the first magnetic layer being variable;

depositing an intermediate layer on the first magnetic layer;

depositing a second magnetic layer on the intermediate layer; and

fixing a magnetization direction to a second direction crossing the first direction by an annealing process while a magnetic field is applied in the second direction,

an initial magnetization direction of the first magnetic layer being neither parallel with nor orthogonal to the second direction.

2. The method of manufacturing a pressure sensor according to claim 1, further comprising

releasing the bend of the substrate before the intermediate layer is deposited on the first magnetic layer.

3. The method of manufacturing a pressure sensor according to claim 1, further comprising

releasing the bend of the substrate after the intermediate layer is deposited on the first magnetic layer.

4. The method of manufacturing a pressure sensor according to claim 1, further comprising:

removing a part of the substrate in an area; and

removing the first magnetic layer, the intermediate layer and the second magnetic layer so that apart of the first magnetic layer, the intermediate layer and the second magnetic layer being left in the area.

5. The method of manufacturing a pressure sensor according to claim 1,

the first direction being not orthogonal to the second direction.

6. A method of manufacturing a pressure sensor comprising:

depositing a first magnetic layer on a first surface of a substrate;

depositing an intermediate layer on the first magnetic layer;

bending the substrate by pressing a second surface of the substrate with a member extending in a first direction;

depositing a second magnetic layer on the intermediate layer while the substrate is bended, a magnetization direction of the second magnetic layer being variable; and

fixing a magnetization direction to a second direction crossing the first direction by an annealing process while a magnetic field is applied in the second direction,

an initial magnetization direction of the second magnetic layer being neither parallel with nor orthogonal to the second direction.

7. The method of manufacturing a pressure sensor according to claim 6,

bending the substrate after the intermediate layer is deposited on the first magnetic layer.

8. The method of manufacturing a pressure sensor according to claim 6,

bending the substrate before the intermediate layer is deposited on the first magnetic layer.

9. The method of manufacturing a pressure sensor according to claim 6, further comprising:

removing a part of the substrate in an area; and

removing the first magnetic layer, the intermediate layer and the second magnetic layer so that apart of the first magnetic layer, the intermediate layer and the second magnetic layer being left in the area.

10. The method of manufacturing a pressure sensor according to claim 6,

the first direction being not orthogonal to the second direction.