GRINDING WHEEL AND GRINDING APPARATUS

• US 20180079046A1
• Filed: 09/19/2017
• Published: 03/22/2018
• Est. Priority Date: 09/20/2016
• Status: Active Grant

• Current Assignee: Disco Corporation
• Original Assignee: Disco Corporation
• Inventors: Qiu, Xiaoming
• Granted Patent: US 10,639,761 B2
• Time in Patent Office: Days
• CPC Class Codes: B24B 1/04 subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency polishing or abrading surfaces on work by means of tumbling apparatus B24B31/00, involving oscillating or vibrating containers B24B31/06; superfinishing surfaces on work, e.g. by means of abrading blocks reciprocating with high frequency, B24B35/00
• CPC Class Codes: B24B 7/04 involving a rotary work-table
• CPC Class Codes: B24B 7/228 for grinding thin, brittle parts, e.g. semiconductors, wafers grinding edges of thin, brittle parts B24B9/065

Abstract

A grinding wheel for grinding a wafer held on a holding table includes: a first circular annular plate mounted to a mount of a grinding apparatus; a tubular body extending downward from an outer circumference of the first circular annular plate; a second circular annular plate connected to a lower end of the tubular body; a plurality of grindstones arranged in an annular pattern on a lower surface of the second circular annular plate; an annular ultrasonic oscillation section disposed on an upper surface of the second circular annular plate so as to surround an opening; and an ultrasonic reception section that receives an ultrasonic vibration transmitted from the ultrasonic oscillation section to the grindstones.

Claims

1. A grinding wheel for grinding a wafer held on a holding table by transmitting an ultrasonic vibration to a plurality of grindstones arranged in an annular pattern, the grinding wheel comprising:

a first circular annular plate having an annular mounted surface to be mounted to a mount of a grinding apparatus;

a tubular body extending downward from an outer circumference of the first circular annular plate;

a second circular annular plate connected to a lower end of the tubular body and having an opening in a center;

the plurality of grindstones arranged in the annular pattern on a lower surface of the second circular annular plate;

an annular ultrasonic oscillation section disposed on an upper surface of the second circular annular plate so as to surround the opening; and

an ultrasonic reception section for receiving the ultrasonic vibration transmitted from the ultrasonic oscillation section to the grindstones, the ultrasonic reception section being disposed on the upper surface of the second circular annular plate.

2. A grinding apparatus comprising:

a holding table that holds a wafer by a holding surface;

a grinding unit for grinding the wafer held by the holding table, the grinding unit having a mount to which a grinding wheel is mounted rotatably; and

a grinding feeding unit for grinding feed of the grinding unit in a vertical direction relative to the holding surface,

wherein the grinding wheel includes;

a first circular annular plate having an annular mounted surface to be mounted to a mount of a grinding apparatus;

a tubular body extending downward from an outer circumference of the first circular annular plate;

a second circular annular plate connected to a lower end of the tubular body and having an opening in a center;

a plurality of grindstones arranged in an annular pattern on a lower surface of the second circular annular plate;

an annular ultrasonic oscillation section disposed on an upper surface of the second circular annular plate so as to surround the opening; and

an ultrasonic reception section that receives the ultrasonic vibration transmitted from the ultrasonic oscillator to the grindstones, the ultrasonic reception section being disposed on the upper surface of the second circular annular plate, and

the grinding apparatus further comprises;

a high-frequency power source that supplies high-frequency electric power to the ultrasonic oscillator section of the grinding wheel; and

a control unit that controls the electric power supplied from the high-frequency power source according to amplitude of the ultrasonic vibration that is oscillated by the ultrasonic oscillation section, is transmitted to the grindstones and is received by the ultrasonic reception section.