Package with roughened encapsulated surface for promoting adhesion

• US 20180082921A1
• Filed: 09/20/2017
• Published: 03/22/2018
• Est. Priority Date: 09/21/2016
• Status: Active Grant

• Current Assignee: Hyundai Motor Company (Hyundai Motor Group), Infineon Technologies AG, Kia Motors Corporation (Kia Corp.)
• Original Assignee: Hyundai Motor Company (Hyundai Motor Group), Infineon Technologies AG, Kia Motors Corporation (Kia Corp.)
• Inventors: GRASSMANN, Andreas, HOEGERL, Juergen, JANG, Kiyoung, NIKITIN, Ivan
• Granted Patent: US 10,453,771 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 21/4871 Bases, plates or heatsinks
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/04026 Bonding areas specifically adapted for layer connectors
• CPC Class Codes: H01L 2224/04042 Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
• CPC Class Codes: H01L 2224/2612 Auxiliary members for layer connectors, e.g. spacers
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/33181 On opposite sides of the body
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48106 the connector being orthogonal to a side surface of the semiconductor or solid-state body, e.g. parallel layout
• CPC Class Codes: H01L 2224/4813 Connecting within a semiconductor or solid-state body, i.e. fly wire, bridge wire
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/4846 with multiple bonds on the same bonding area
• CPC Class Codes: H01L 2224/73215 Layer and wire connectors
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/85801 Soldering or alloying
• CPC Class Codes: H01L 2224/92247 the second connecting process involving a wire connector
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/3675 : characterised by the shape of the housing
• CPC Class Codes: H01L 23/3735 : Laminates or multilayers, e.g. direct bond copper ceramic substrates
• CPC Class Codes: H01L 23/4334 : Auxiliary members in encapsulations H01L23/49568 takes precedence
• CPC Class Codes: H01L 23/49531 : the additional leads being a wiring board
• CPC Class Codes: H01L 23/49537 : Plurality of lead frames mounted in one device
• CPC Class Codes: H01L 23/49541 : Geometry of the lead-frame
• CPC Class Codes: H01L 23/49568 : specifically adapted to facilitate heat dissipation
• CPC Class Codes: H01L 23/49575 : Assemblies of semiconductor devices on lead frames
• CPC Class Codes: H01L 24/32 : of an individual layer connector
• CPC Class Codes: H01L 24/33 : of a plurality of layer connectors
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 24/85 : using a wire connector wire bonding in general B23K20/004
• CPC Class Codes: H01L 24/92 : Specific sequence of method steps
• CPC Class Codes: H01L 25/18 : the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1203 : Rectifying Diode
• CPC Class Codes: H01L 2924/13055 : Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/13091 : Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/18301 : being an anchoring portion, i.e. mechanical interlocking between the encapsulation resin and another package part
• CPC Class Codes: H01L 2924/19107 : off-chip wires
• CPC Class Codes: H01L 2924/35121 : Peeling or delaminating

Abstract

A package comprising at least one electronic chip, a first heat removal body thermally coupled to a first main surface of the at least one electronic chip and configured for removing thermal energy from the at least one electronic chip, an encapsulant encapsulating at least part of the at least one electronic chip, and part of the first heat removal body, wherein at least part of a surface of the first heat removal body is roughened.

Claims

1. A package, comprising:

at least one electronic chip;

a first heat removal body thermally coupled to a first main surface of the at least one electronic chip and configured for removing thermal energy from the at least one electronic chip;

an encapsulant encapsulating at least part of the at least one electronic chip, and part of the first heat removal body;

wherein at least part of a surface of the first heat removal body is roughened.

2. The package according to claim 1,

comprising a second heat removal body thermally coupled to a second main surface of the at least one electronic chip or of at least one further electronic chip and configured for removing thermal energy from the at least one electronic chip or of the at least one further electronic chip;

wherein the encapsulant encapsulates part of the second heat removal body; and

wherein at least part of a surface of the second heat removal body is roughened.

3. The package according to claim 1, comprising a chip carrier on which the at least one electronic chip is mounted.

4. The package according to claim 3, wherein the first heat removal body is configured as the chip carrier.

5. The package according to claim 1, wherein at least one of the first heat removal body and the second heat removal body comprises an electrically insulating layer having a first main surface covered by a first electrically conductive layer and having a second main surface covered by a second electrically conductive layer.

6. The package according to claim 1, wherein at least one of the first heat removal body and the second heat removal body is configured as at least one of the group consisting of a Direct Copper Bonding substrate, and a Direct Aluminum Bonding substrate.

7. The package according to claim 1, wherein at least part of an electrically conductive surface of at least one of the first heat removal body and the second heat removal body being in direct contact with the encapsulant is roughened.

8. The package according to claim 1, comprising an electrically conductive contact structure, in particular a leadframe, extending partially within and partially outside of the encapsulant and being electrically coupled with the at least one electronic chip.

9. The package according to claim 8, wherein at least a part of a surface of the electrically conductive contact structure within the encapsulant is roughened.

10. The package according to claim 1, wherein the roughened surface has microstructures with dimensions in a range between 0.25 μ

m and 20 μ

m, in particular in a range between 1 μ

m and 4 μ

m.

14. A vehicle, comprising a package according to claim 1.

24. A method of using a package according to claim 1 for an automotive application, in particular as an inverter circuit for an at least partially electrically driven vehicle.

11. A double-sided cooling package, comprising:

at least one electronic chip from which thermal energy is removable via two opposing main surfaces of the package;

an encapsulant encapsulating at least part of the at least one electronic chip;

an electrically conductive contact structure extending partially within and partially outside of the encapsulant and being electrically coupled with the at least one electronic chip;

wherein at least a part of a surface of the electrically conductive contact structure within the encapsulant is roughened.

12. The package according to claim 11, comprising heat removal bodies thermally coupled to the at least one electronic chip and configured for removing thermal energy from the at least one electronic chip.

13. The package according to claim 12, wherein at least one of the heat removal bodies has an at least partially roughened metal, in particular copper, surface, in particular within the encapsulant.

15. A method of manufacturing a package, wherein the method comprises:

thermally coupling a first heat removal body to a first main surface of at least one electronic chip for removing thermal energy from the at least one electronic chip;

thermally coupling a second heat removal body to a second main surface of the at least one electronic chip or of at least one further electronic chip for removing thermal energy from the at least one electronic chip or from the at least one further electronic chip;

encapsulating at least part of the at least one electronic chip, part of the first heat removal body and part of the second heat removal body by an encapsulant; and

roughening at least part of an encapsulated surface of at least one of the first heat removal body and the second heat removal body.

16. The method according to claim 15, wherein the roughening is carried out before mounting, in particular before at least one of soldering, welding and wire bonding, the at least one electronic chip on a chip carrier, in particular on at least one of the first heat removal body and the second heat removal body.

17. The method according to claim 15, wherein the roughening is carried out after mounting, in particular after at least one of soldering, welding and wire bonding, the at least one electronic chip on a chip carrier, in particular on at least one of the first heat removal body and the second heat removal body.

18. The method according to claim 15, wherein the roughening is carried out by at least one of chemically roughening and mechanically roughening the surface.

19. The method according to claim 15, wherein the roughening is carried out by oxidizing part of a copper surface by a first etching procedure, and by a subsequent treatment with a second etching procedure to obtain a bondable and/or solderable and/or sinterable surface.

20. The method according to claim 15, wherein the surface is cleaned prior to the roughening.

21. The method according to claim 15, wherein an adhesion promoter is applied to the surface.

22. The method according to claim 15, wherein particles are removed from the roughened surface after the roughening, in particular by deoxidizing.

23. A method of manufacturing a package, wherein the method comprises:

configuring at least one electronic chip so that thermal energy is removable from the at least one electronic chip via at least one main surface of the package;

encapsulating at least part of the at least one electronic chip by an encapsulant;

providing an electrically conductive contact structure extending partially within and partially outside of the encapsulant, having a copper surface, and being electrically coupled with the at least one electronic chip;

roughening at least a part of the copper surface of the electrically conductive contact structure within the encapsulant.