CONFIGURATION ELEMENT FOR PRINTED CIRCUIT BOARD ASSEMBLIES

• US 20180084634A1
• Filed: 09/21/2016
• Published: 03/22/2018
• Est. Priority Date: 09/21/2016
• Status: Active Grant

• Current Assignee: Seagate Technology LLC (Seagate Technology Holdings Plc)
• Original Assignee: Seagate Technology LLC (Seagate Technology Holdings Plc)
• Inventors: Davis, David Michael, Webb, Gary Edward
• Granted Patent: US 10,051,729 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 23/50 for integrated circuit devices, e.g. power bus, number of leadsH01L23/482 - H01L23/498 take precedence
• CPC Class Codes: H05K 1/0243 Printed circuits associated with mounted high frequency components
• CPC Class Codes: H05K 1/0245 Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
• CPC Class Codes: H05K 1/029 having a programmable lay-out, i.e. adapted for choosing between a few possibilities
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 2201/10212 Programmable component
• CPC Class Codes: H05K 2201/10719 Land grid array [LGA]
• CPC Class Codes: H05K 2201/10734 Ball grid array [BGA]; Bump grid array
• CPC Class Codes: H05K 3/3436 having an array of bottom contacts, e.g. pad grid array or ball grid array components

Abstract

A printed circuit board assembly includes a printed circuit board having a plurality of signal lanes. The PCBA also includes at least one application-specific integrated circuit operatively mounted to the printed circuit board and connected with the plurality of signal lanes. The PCBA includes a first configuration element operatively mounted to the printed circuit board in a first orientation and at a first location and having a first bridging element for providing an electrical connection between at least a first pair of signal lanes selected from the plurality of signal lanes. The first configuration element also includes a second bridging element so that if the first configuration element were operatively mounted to the printed circuit board in a different, second orientation relative to the printed circuit board, the second bridging element would provide an electrical connection between at least a second pair of signal lanes.

Claims

1. A printed circuit board assembly, comprising:

a printed circuit board having a plurality of signal lanes;

at least one application-specific integrated circuit operatively mounted to the printed circuit board and connected with the plurality of signal lanes; and

a first configuration element operatively mounted to the printed circuit board in a first orientation and at a first location and having a first bridging element for providing an electrical connection between at least a first pair of signal lanes selected from the plurality of signal lanes;

the first configuration element also including a second bridging element so that if the first configuration element were operatively mounted to the printed circuit board in a different, second orientation relative to the printed circuit board, the second bridging element would provide an electrical connection between at least a second pair of signal lanes selected from the plurality of signal lanes without the first bridging element providing an electrical connection between the at least first pair of signal lanes.

2. The assembly of claim 1, wherein the printed circuit board is configured to operatively mount a second configuration element to the printed circuit board in a third orientation at the first location in place of the first configuration element, and wherein the second configuration element has a third bridging element for connecting at least a third pair of signal lanes selected from the plurality of signal lanes.

3. The assembly of claim 1, wherein the first configuration element is primarily passive.

4. The assembly of claim 1, wherein the first configuration element is operatively mounted to the printed circuit board in the second orientation relative to the printed circuit board, and wherein the first configuration element is operatively mounted to the printed circuit board at the first location.

5. The assembly of claim 1, wherein the first configuration element is operatively mounted to the printed circuit board in the second orientation relative to the printed circuit board at a second, translated location, wherein the first configuration element has a fourth bridging element for providing an electrical connection between at least a different pair of signal lanes selected from the plurality of signal lanes.

6. The assembly of claim 1, wherein the first configuration element includes multiple bridging elements for the first orientation and multiple bridging elements for the second orientation.

7. The assembly of claim 1, wherein the first configuration element can be rotated to change orientation from the first orientation to the second orientation.

8. The assembly of claim 1, wherein the first configuration element includes a stacked layer construction and the multiple bridging elements for use in the first orientation are provided on a different layer than the bridging elements for use in the second orientation.

9. The assembly of claim 1, wherein the application-specific integrated circuit is selected from the group consisting of:

an input/output controller, a serial-attached small computer system interface fanout expander, a central processing unit, and an Ethernet switch.

10. A method of making a printed circuit board assembly comprising the steps of:

mounting at least an application-specific integrated circuit to a printed circuit board and connecting the application-specific integrated circuit with a plurality of signal lanes;

mounting a first configuration element to the printed circuit board in a first orientation, the first configuration element including a first set of bridging elements and a second set of bridging elements; and

electrically connecting at least a bridging element of the first set of bridging elements between at least a pair of signal lanes of the printed circuit board without electrically connecting any bridging element of the second set of bridging elements between any signal lanes of the printed circuit board.

11. The method of claim 10, wherein the printed circuit board is configured to operatively mount a second configuration element to the printed circuit board in a second orientation in place of the first configuration element, and wherein the second configuration element has a third set of bridging elements for electrically connecting at least a different pair of signal lanes selected from the plurality of signal lanes.

12. The method of claim 10, wherein the first configuration element is primarily passive.

13. The method of claim 10, wherein the first set of bridging elements are connected when the first configuration element is mounted in the first orientation, and wherein the second set of bridging elements are connected when the first configuration element is mounted in a second orientation different than the first orientation.

14. The method of claim 10, wherein the application-specific integrated circuit is selected from the group consisting of:

an input/output controller, a serial-attached small computer system interface fanout expander, a central processing unit, and an Ethernet switch.

15. A printed circuit board assembly, comprising:

a printed circuit board having a plurality of signal lanes;

at least one application-specific integrated circuit operatively mounted to the printed circuit board and connected with the plurality of signal lanes; and

a first primarily passive configuration element operatively mounted to the printed circuit board in a first orientation and having a first bridging element for providing an electrical connection between at least a first pair of signal lanes selected from the plurality of signal lanes,

wherein if a second primarily passive configuration element having a different, second bridging element is operatively mounted to the printed circuit board in place of the first configuration element, the second bridging element would provide an electrical connection between at least a second pair of signal lanes selected from the plurality of signal lanes without providing an electrical connection between the at least first pair of signal lanes.

16. The assembly of claim 15, wherein the second configuration element is mounted to the printed circuit board in a second orientation in place of the first configuration element.

17. The assembly of claim 15, wherein the first configuration element utilizes at least one of a land grid array connection and a ball grid array connection with the plurality of signal lanes.

18. The assembly of claim 15, wherein the second configuration element is operatively mounted to the printed circuit at a different, translated location than the first configuration element.

19. The assembly of claim 15, wherein the first configuration element can be rotated to change orientation from the first orientation to the second orientation, wherein the first configuration element has a third bridging element for providing an electrical connection between at least a third pair of signal lanes selected from the plurality of signal lanes,

20. An apparatus comprising:

a configuration module configured for operative mounting to a printed circuit board in a first orientation and at a first location and having a first bridging element for providing electrical connection between at least a first pair of signal lanes selected from a plurality of signal lanes, the configuration module also including a second bridging element configured to provide electrical connection between at least a second pair of signal lanes selected from the plurality of signal lanes when the configuration module is operatively mounted to the printed circuit board in a different, second orientation relative to the printed circuit board without the first bridging element providing an electrical connection between the at least first pair of signal lanes.