STACKED CIRCUIT BOARD ARCHITECTURE IN AN ELECTRONIC DEVICE
First Claim
1. A circuit board assembly for an electronic device, the circuit board assembly comprising:
- a first circuit board having a first mounting surface;
a first operational component located on the first mounting surface, the first operational component including a recess;
a second circuit board electrically coupled to the first circuit board, the second circuit board having a second mounting surface; and
a second operational component located on the second mounting surface, the second operational component having a protrusion, wherein the first circuit board is positioned with respect to the second circuit board such that the protrusion at least partially extends into the recess.
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Accused Products
Abstract
A circuit board assembly in an electronic is disclosed. To conserve space in the electronic device, the circuit board assembly includes stacked circuit boards in electrical communication with each other, such as a first circuit board stacked over a second circuit board. Each circuit board may include multiple surfaces that carry operational components. Moreover, the first circuit board may include a first surface and the second circuit board may include a second surface facing the first surface. The first and second surfaces may include operational components in corresponding locations. Also, the operational components may include corresponding shapes such that one component is positioned in another component. The components may electrically connect to each other. Also, the circuit board assembly may include EMI shields around an outer perimeter in order to shield the operational components form EMI and to components in the electronic device from EMI emanating from the operational components.
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Citations
20 Claims
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1. A circuit board assembly for an electronic device, the circuit board assembly comprising:
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a first circuit board having a first mounting surface; a first operational component located on the first mounting surface, the first operational component including a recess; a second circuit board electrically coupled to the first circuit board, the second circuit board having a second mounting surface; and a second operational component located on the second mounting surface, the second operational component having a protrusion, wherein the first circuit board is positioned with respect to the second circuit board such that the protrusion at least partially extends into the recess. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. An electronic device, comprising:
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an enclosure that defines an internal volume; a stacked circuit board assembly disposed in the internal volume, the stacked circuit board assembly comprising; a first circuit board that carries a first operational component on a first mounting surface, the first circuit board further carrying a second operational component on a second mounting surface that is opposite the first mounting surface, a second circuit board that is overlaid by the first circuit board, the second circuit board carrying a third operational component on a third mounting surface that faces the second mounting surface, a first shielding element that covers the first circuit board and provides a first electromagnetic interference (EMI) shield for the first operational component, and a second shielding element positioned between the first circuit board and the second circuit board, the second shielding element providing a second EMI shield for the second component. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A method for forming a circuit board assembly, the method comprising:
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providing a first circuit board that includes a first operational component, the first operational component having a recess; securing a second circuit board with the first circuit board such that the first circuit overlays the second circuit board, the second circuit board including a second operational component having a protrusion; and positioning the protrusion at least partially in the recess. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification