Electronic Device Having a Composite Structure

• US 20180084653A1
• Filed: 05/26/2017
• Published: 03/22/2018
• Est. Priority Date: 09/21/2016
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Misra, Abhijeet, Osborne, Steven J., Spraggs, Ian A., Rammah, Marwan, Counts, William A.
• Granted Patent: US 10,447,834 B2
• Time in Patent Office: Days
• CPC Class Codes: G06F 1/1626 with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
• CPC Class Codes: G06F 1/163 Wearable computers, e.g. on a belt
• CPC Class Codes: G06F 1/1656 Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories mounting of accessories to a computer display G06F1/1607; display hoods G06F1/1603; cooling arrangements for portable computers G06F1/203
• CPC Class Codes: H04M 1/0249 Details of the mechanical connection between the housing parts or relating to the method of assembly
• CPC Class Codes: H04M 1/026 Details of the structure or mounting of specific components
• CPC Class Codes: H04M 1/0283 for providing a decorative aspect, e.g. customization of casings, exchangeable faceplate
• CPC Class Codes: H04M 1/185 Improving the rigidity of the casing or resistance to shocks

Abstract

Embodiments are directed to an enclosure for an electronic device. In one aspect, an embodiment includes an enclosure having an enclosure component and an internal component that may be affixed along a bonding region. The enclosure component may be formed from an enclosure material and defines an exterior surface of the enclosure and an opening configured to receive a display. The internal component may be formed from a metal material different than the enclosure material. The bonding region may include an interstitial material that has a melting temperature that is less than a melting temperature of either one of the enclosure material or the metal material. The bonding region may also include one or more of the enclosure material or the metal material.

Claims

1. An enclosure for an electronic device, comprising:

an enclosure component formed from an enclosure material and having sidewalls that define an internal volume and a top surface that defines an opening configured to receive a touch-sensitive display;

a structural member formed from a steel-based material;

a first interstitial material affixed to a first surface of the enclosure component; and

a second interstitial material affixed to a second surface of the structural member, wherein;

a portion of the first and second interstitial materials form a blended melt layer joining the enclosure component and the structural member within the internal volume of the enclosure; and

a melting temperature of each of the first and second interstitial materials is less than a melting temperature of the steel-based material.

2. The enclosure of claim 1, wherein the blended melt layer is formed, in part, from the enclosure material of the enclosure component.

3. The enclosure of claim 1, wherein:

the structural member defines a threaded feature;

the structural member is configured to secure a printed circuit board (PCB) to the enclosure component by receiving a fastener that extends through the PCB; and

the PCB includes a processing unit configured to control a function of the electronic device.

4. The enclosure of claim 1, wherein:

the structural member is a rib extending between the sidewalls of the enclosure; and

the rib is configured to provide rigidity to an exterior surface of the enclosure.

5. The enclosure of claim 4, wherein:

the rib separates the internal volume into discrete compartments;

one of the discrete compartments is configured to receive a printed circuit board (PCB); and

the rib defines a passage configured to receive a set of wires extending from the PCB and between the discrete compartments of the internal volume.

6. An enclosure for an electronic device, comprising:

an enclosure component formed from an enclosure material and defining an exterior surface of the enclosure and an opening configured to receive a display; and

an internal component formed from a metal material different than the enclosure material and affixed to the enclosure component along a bonding region, the bonding region comprising;

an interstitial material having a melting temperature less than a melting temperature of either one of the enclosure material or the metal material; and

one or more of the enclosure material or the metal material.

7. The enclosure of claim 6, wherein:

the bonding region includes a blended melt layer formed from;

the interstitial material; and

the one or more of the enclosure material or the metal material; and

the blended melt layer is affixed to both of the enclosure component and the internal component.

8. The enclosure of claim 6, wherein:

the enclosure material is aluminum; and

the metal material is steel.

9. The enclosure of claim 6, wherein:

the enclosure material is a ceramic; and

the metal material is steel.

10. The enclosure of claim 6, wherein the interstitial material comprises at least one of nickel, zinc, or aluminum alloy.

11. The enclosure of claim 6, wherein:

the enclosure is configured to receive a printed circuit board (PCB); and

the internal component is configured to electrically conduct a signal received from the PCB.

12. The enclosure of claim 6, wherein the internal component forms an electrical shield along an interior surface of the enclosure.

13. A method of manufacturing a device enclosure, comprising:

abutting an enclosure component and an internal component along a bonding region; and

affixing the enclosure component to the internal component by heating the bonding region to a temperature that is less than a melting temperature of one of the enclosure component or the internal component, wherein;

the internal component includes an interstitial material at the bonding region; and

the interstitial material and the enclosure component form a blended melt layer within the bonding region in response to the heating.

14. The method of claim 13, wherein:

the internal component defines a threaded feature; and

the method further comprises;

attaching a printed circuit board (PCB) to the enclosure component by advancing a fastener through the PCB and into the threaded feature.

15. The method of claim 13, wherein the method further comprises:

anodizing at least one of the enclosure component or the internal component prior to affixing the enclosure component and the internal component.

16. The method of claim 13, wherein the interstitial material comprises one of nickel, zinc, or aluminum alloy.

17. The method of claim 13, wherein the interstitial material coats the internal component prior to affixing the enclosure component and the internal component.

18. The method of claim 13, wherein:

the interstitial material is a first interstitial material;

the enclosure component includes a second interstitial material at the bonding region; and

the first and second interstitial materials and the enclosure component form the blended melt layer within the bonding region in response to the heating.

19. The method of claim 13, wherein affixing further comprises:

compressing the enclosure component and the internal component.

20. The method of claim 13, wherein heating the bonding region further comprises:

applying an ultrasonic vibration to at least one of the enclosure component and the internal component.