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Electronic Device Having a Composite Structure

  • US 20180084653A1
  • Filed: 05/26/2017
  • Published: 03/22/2018
  • Est. Priority Date: 09/21/2016
  • Status: Active Grant
First Claim
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1. An enclosure for an electronic device, comprising:

  • an enclosure component formed from an enclosure material and having sidewalls that define an internal volume and a top surface that defines an opening configured to receive a touch-sensitive display;

    a structural member formed from a steel-based material;

    a first interstitial material affixed to a first surface of the enclosure component; and

    a second interstitial material affixed to a second surface of the structural member, wherein;

    a portion of the first and second interstitial materials form a blended melt layer joining the enclosure component and the structural member within the internal volume of the enclosure; and

    a melting temperature of each of the first and second interstitial materials is less than a melting temperature of the steel-based material.

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