THERMAL DISTRIBUTION ASSEMBLY IN AN ELECTRONIC DEVICE
First Claim
1. A portable electronic device, comprising:
- a back wall and sidewalls that, in cooperation with the back wall, define a cavity that carries components, wherein the back wall includes a material having a first thermal conductivity and wherein the sidewalls includes a material having a second thermal conductivity greater than the first thermal conductivity such that the sidewalls have a greater ability to conduct thermal energy than does the back wall, wherein the components include;
a heat-generating component that is capable of generating heat,a thermal distribution assembly capable of directing at least some of heat generated by the heat-generating component away from the back wall and towards the sidewalls, the thermal distribution assembly comprising;
a first layer having a first contact surface in direct thermal contact with the heat-generating component, the first layer comprising a material having a first heat transfer characteristic that promotes a heat flow from the heat-generating component in a direction away from and generally perpendicular to the first contact surface,a second layer having a second contact surface at least a portion of which is in direct thermal contact with the first layer, the second layer comprising a material having a second heat transfer characteristic that promotes the heat flow in a direction generally parallel to the second contact surface, the second heat transfer characteristic different from the first heat transfer characteristic, anda third layer having a third contact surface in direct thermal contact with the second layer and a sidewall contact surface of at least one of the sidewalls such that the heat flow from the second layer flows generally perpendicular to and away from the second contact surface to the sidewall contact surface such that the sidewalls act as a distributed heat sink thereby preventing heat trapping in the back wall and avoiding formation of a thermal hot spot.
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Accused Products
Abstract
A thermal distribution assembly for an electronic device is disclosed. The electronic device includes an enclosure defined by a metal band and a non-metal bottom wall formed by glass, sapphire, or plastic. In this regard, the enclosure may include a relatively low thermal conductivity. However, the thermal distribution assembly provides heat transfer capabilities that offset thermal conductivity losses by using a non-metal bottom wall, and also provides added structural support. The thermal distribution assembly may include a first layer, a second layer, and a third layer. The first and third layers provide structural support, while the second layer provides a relatively high thermally conductive layer. The thermal distribution assembly includes sidewalls engaging and thermally coupling to the metal band, allowing the thermal distribution assembly to draw heat from a heat-generating component, and pass the heat to the metal band while minimizing or preventing temperature increases along the non-metal bottom wall.
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Citations
20 Claims
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1. A portable electronic device, comprising:
a back wall and sidewalls that, in cooperation with the back wall, define a cavity that carries components, wherein the back wall includes a material having a first thermal conductivity and wherein the sidewalls includes a material having a second thermal conductivity greater than the first thermal conductivity such that the sidewalls have a greater ability to conduct thermal energy than does the back wall, wherein the components include; a heat-generating component that is capable of generating heat, a thermal distribution assembly capable of directing at least some of heat generated by the heat-generating component away from the back wall and towards the sidewalls, the thermal distribution assembly comprising; a first layer having a first contact surface in direct thermal contact with the heat-generating component, the first layer comprising a material having a first heat transfer characteristic that promotes a heat flow from the heat-generating component in a direction away from and generally perpendicular to the first contact surface, a second layer having a second contact surface at least a portion of which is in direct thermal contact with the first layer, the second layer comprising a material having a second heat transfer characteristic that promotes the heat flow in a direction generally parallel to the second contact surface, the second heat transfer characteristic different from the first heat transfer characteristic, and a third layer having a third contact surface in direct thermal contact with the second layer and a sidewall contact surface of at least one of the sidewalls such that the heat flow from the second layer flows generally perpendicular to and away from the second contact surface to the sidewall contact surface such that the sidewalls act as a distributed heat sink thereby preventing heat trapping in the back wall and avoiding formation of a thermal hot spot. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. An electronic device, comprising:
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a band formed from a metal, the band including a first sidewall component and a second sidewall component; a protective layer formed from a transparent material and secured with the band, wherein the band and the protective layer define an internal volume; a heat-generating component disposed in the internal volume; and a thermal distribution assembly disposed in the internal volume and thermally coupled to the heat-generating component, the thermal distribution assembly engaging the first sidewall component and the second sidewall component, the thermal distribution assembly receiving heat from the heat-generating component and passing the heat to at least one of the first sidewall component and the second sidewall component. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A method for making a thermal distribution assembly for removing heat from a heat-generating component in an electronic device having an enclosure sidewall, the method comprising:
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securing a first layer with a second layer, the first layer including a first bottom wall and a first sidewall extending from the first bottom wall, the second layer including a second bottom wall engaging the first bottom wall, the second layer further including a second sidewall extending from the second bottom wall and engaging the first sidewall; and securing a third layer with the second layer, the third layer including a third bottom wall engaging the second bottom wall, the third layer further including a third sidewall extending from the third bottom wall and engaging the second sidewall and the enclosure sidewall, wherein the first layer distributes heat from the heat-generating component to the second layer, and wherein the heat passes from the second layer through the third sidewall to the enclosure sidewall. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification