METHOD OF INSTALLING ELECTRONIC COMPONENT, DISPLAY DEVICE AND DISPLAY SYSTEM

• US 20180088388A1
• Filed: 09/27/2017
• Published: 03/29/2018
• Est. Priority Date: 09/28/2016
• Status: Active Grant

• Current Assignee: LG Display Co., Ltd.
• Original Assignee: LG Display Co., Ltd.
• Inventors: FURUTA, Kaoru
• Granted Patent: US 10,451,934 B2
• Time in Patent Office: Days
• CPC Class Codes: G02F 1/13336 Combining plural substrates to produce large-area displays, e.g. tiled displays
• CPC Class Codes: G02F 1/13452 Conductors connecting driver circuitry and terminals of panels
• CPC Class Codes: H01L 2224/11 Manufacturing methods
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/81 using a bump connector
• CPC Class Codes: H01L 2924/15173 in a single layer of the multilayer substrate
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 3/3463 Solder compositions in relation to features of the printed circuit board or the mounting process

Abstract

A display device, a display system, and a method of installing an electronic component are disclosed. In one embodiment, the electronic component is junctioned to a display panel of the display device using an auto-agglutination solder. The installation method includes positioning the electronic component having an electronic component side line connection part at a substrate stack that includes two substrates, a line between the two substrates, and a substrate side line connection part at an end of the line; forming an auto-agglutination solder between the electronic component side line connection part and the substrate side line connection part; and pressurizing the electronic component side line connection part and the substrate side line connection part by heating-up the auto-agglutination solder.

Claims

1. A method of installing an electronic component, comprising:

positioning the electronic component including an electronic component side line connection part at a vertical end surface of a substrate stack that includes two substrates, a line between the two substrates, and a substrate side line connection part at an end of the line, the electronic component side line connection part facing the vertical end surface;

forming an auto-agglutination solder between the electronic component side line connection part and the substrate side line connection part, the auto-agglutination solder including a thermosetting resin and one or more solder particles; and

pressurizing the electronic component side line connection part and the substrate side line connection part by heating-up the auto-agglutination solder.

2. The method according to claim 1, wherein the substrate side line connection part is connected to the end of the line and formed along the vertical end surface, and the substrate side line connection part is a connection pad formed of a conductive material.

3. The method according to claim 1, wherein the substrate side line connection part is a portion of the end of the line that is exposed in a space between the two substrates.

4. The method according to claim 1, wherein the electronic component side line connection part has a vertical length that is larger than the substrate side line connection part.

5. The method according to claim 4, wherein the vertical length of the electronic component side line connection part is larger than a reference length that is based on an amount of the solder particles required for soldering of the electronic component side line connection part and the substrate side line connection part, and a gap between the electronic component side line connection part and the substrate side line connection part.

6. The method according to claim 1, wherein the auto-agglutination solder is a paste that is coated on the substrate side line connection part.

7. The method according to claim 6, wherein the auto-agglutination solder is coated by one of a screen printing process, a mesh-mask printing process, and an ink-jet process.

8. The method according to claim 1, wherein the electronic component includes a film substrate including the electronic component side line connection part and a chip component on the film substrate.

9. The method according to claim 1, wherein the line having the substrate side line connection part is formed on at least one of the two substrates.

10. The method according to claim 1, wherein each of the two substrates is a glass substrate, a resin substrate, or a print substrate.

11. A display device, comprising:

a substrate stack including two substrates, a line between the two substrates, and a substrate side line connection part at an end of the line;

an electronic component including an electronic component side line connection part, the electronic component side line connection part facing a vertical end surface of the substrate stack; and

a junction part that electrically joins the vertical end surface and the electronic component,

the junction part including a solder junction part between the substrate side line connection part and the electronic component side line connection part, and a resin junction part at a region outside the solder junction part and that adheres the vertical end surface and the electronic component.

12. The display device according to claim 11, wherein the substrate side line connection part is connected to the end of the line and formed along the vertical end surface, and the substrate side line connection part is a connection pad formed of a conductive material.

13. The display device according to claim 11, wherein the substrate side line connection part is a portion of the end of the line that is exposed in a space between the two substrates.

14. The display device according to claim 11, wherein the electronic component side line connection part has a vertical length that is larger than the substrate side line connection part.

15. The display device according to claim 11, wherein the solder junction part has a thickness that is equal to less than about 20 μ

m.

16. The display device according to claim 11, wherein a distance between adjacent substrate side line connection parts has a range of 10 to 100 μ

m.

17. The display device according to claim 11, wherein at least one of the substrate side line connection part and the electronic component side line connection part includes tin (Sn), lead (Pb), zinc (Zn), silver (Ag), or copper (Cu).

18. A display system, comprising:

a first display device;

a second display device adjacent to the first display device along a first direction; and

a third display device adjacent to the first display device along a second direction,

wherein at least one of the first to third display devices includes;

a substrate stack including two substrates, a line between the two substrates, and a substrate side line connection part at an end of the line;

an electronic component including an electronic component side line connection part, the electronic component side line connection part facing a vertical end surface of the substrate stack; and

a junction part that electrically joins the vertical end surface and the electronic component,

the junction part including a solder junction part between the substrate side line connection part and the electronic component side line connection part, and a resin junction part at a region outside the solder junction part and that adheres the vertical end surface and the electronic component.

19. The display system according to claim 18, wherein the substrate side line connection part is connected to the end of the line and formed along the vertical end surface, and the substrate side line connection part is a connection pad formed of a conductive material.

20. The display system according to claim 18, wherein the substrate side line connection part is a portion of the end of the line that is exposed in a space between the two substrates.