METHOD OF INSTALLING ELECTRONIC COMPONENT, DISPLAY DEVICE AND DISPLAY SYSTEM
First Claim
1. A method of installing an electronic component, comprising:
- positioning the electronic component including an electronic component side line connection part at a vertical end surface of a substrate stack that includes two substrates, a line between the two substrates, and a substrate side line connection part at an end of the line, the electronic component side line connection part facing the vertical end surface;
forming an auto-agglutination solder between the electronic component side line connection part and the substrate side line connection part, the auto-agglutination solder including a thermosetting resin and one or more solder particles;
forming a provisional junction substance between the vertical end surface of the substrate stack and the electronic component, the provisional junction substance formed of a material having a melting point lower than the one or more solder particles;
provisionally junctioning the electronic component and the vertical end surface of the substrate stack by softening the provisional junction substance at a temperature lower than a melting point of the solder particle and the melting point of the provisional junction substance; and
pressurizing the electronic component side line connection part and the substrate side line connection part by heating-up the auto-agglutination solder and the provisional junction substance.
1 Assignment
0 Petitions
Accused Products
Abstract
A display device includes a substrate stack including two substrates, a line between the two substrates, and a substrate side line connection part at an end of the line. The display device also includes an electronic component having an electronic component side line connection part. The electronic component side line connection part faces a vertical end surface of the substrate stack. The display device further includes a junction part that electrically joins the vertical end surface and the electronic component. The junction part includes a solder junction part between the substrate side line connection part and the electronic component side line connection part, a resin adhesion part at a region outside the solder junction part that adheres the vertical end surface and the electronic component, and a low-melting junction part between the vertical end surface and the electronic component and formed of a material having a melting point lower than the solder particle.
12 Citations
20 Claims
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1. A method of installing an electronic component, comprising:
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positioning the electronic component including an electronic component side line connection part at a vertical end surface of a substrate stack that includes two substrates, a line between the two substrates, and a substrate side line connection part at an end of the line, the electronic component side line connection part facing the vertical end surface; forming an auto-agglutination solder between the electronic component side line connection part and the substrate side line connection part, the auto-agglutination solder including a thermosetting resin and one or more solder particles; forming a provisional junction substance between the vertical end surface of the substrate stack and the electronic component, the provisional junction substance formed of a material having a melting point lower than the one or more solder particles; provisionally junctioning the electronic component and the vertical end surface of the substrate stack by softening the provisional junction substance at a temperature lower than a melting point of the solder particle and the melting point of the provisional junction substance; and pressurizing the electronic component side line connection part and the substrate side line connection part by heating-up the auto-agglutination solder and the provisional junction substance. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A display device, comprising:
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a substrate stack including two substrates, a line between the two substrates, and a substrate side line connection part at an end of the line; an electronic component including an electronic component side line connection part, the electronic component side line connection part facing a vertical end surface of the substrate stack; and a junction part that electrically joins the vertical end surface and the electronic component, the junction part including a solder junction part between the substrate side line connection part and the electronic component side line connection part, a resin adhesion part at a region outside the solder junction part that adheres the vertical end surface and the electronic component, and a low-melting junction part between the vertical end surface and the electronic component and formed of a material having a melting point lower than the solder particle. - View Dependent Claims (15, 16, 17, 18)
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19. A display system, comprising:
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a first display device; a second display device adjacent to the first display device along a first direction; and a third display device adjacent to the first display device along a second direction, wherein at least one of the first to third display devices includes; a substrate stack including two substrates, a line between the two substrates, and a substrate side line connection part at an end of the line; an electronic component including an electronic component side line connection part, the electronic component side line connection part facing a vertical end surface of the substrate stack; and a junction part that electrically joins the vertical end surface and the electronic component, the junction part including a solder junction part between the substrate side line connection part and the electronic component side line connection part, a resin adhesion part at a region outside the solder junction part that adheres the vertical end surface and the electronic component, and a low-melting junction part between the vertical end surface and the electronic component and formed of a material having a melting point lower than the solder particle. - View Dependent Claims (20)
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Specification