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METHOD OF INSTALLING ELECTRONIC COMPONENT, DISPLAY DEVICE AND DISPLAY SYSTEM

  • US 20180088389A1
  • Filed: 09/27/2017
  • Published: 03/29/2018
  • Est. Priority Date: 09/28/2016
  • Status: Active Grant
First Claim
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1. A method of installing an electronic component, comprising:

  • positioning the electronic component including an electronic component side line connection part at a vertical end surface of a substrate stack that includes two substrates, a line between the two substrates, and a substrate side line connection part at an end of the line, the electronic component side line connection part facing the vertical end surface;

    forming an auto-agglutination solder between the electronic component side line connection part and the substrate side line connection part, the auto-agglutination solder including a thermosetting resin and one or more solder particles;

    forming a provisional junction substance between the vertical end surface of the substrate stack and the electronic component, the provisional junction substance formed of a material having a melting point lower than the one or more solder particles;

    provisionally junctioning the electronic component and the vertical end surface of the substrate stack by softening the provisional junction substance at a temperature lower than a melting point of the solder particle and the melting point of the provisional junction substance; and

    pressurizing the electronic component side line connection part and the substrate side line connection part by heating-up the auto-agglutination solder and the provisional junction substance.

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