PACKAGING FOR FINGERPRINT SENSORS AND METHODS OF MANUFACTURE
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Accused Products
Abstract
A fingerprint sensor package, including a sensing side for sensing fingerprint information and a separate connection side for electrically connecting the fingerprint sensor package to a host device, is disclosed. The fingerprint sensor package can also include a sensor integrated circuit facing the sensing side and substantially surrounded by a fill material. The fill material includes vias at peripheral locations around the sensor integrated circuit. The fingerprint sensor package can further include a redistribution layer on the sensing side which redistributes connections of the sensor integrated circuit to the vias. The connections can further be directed through the vias to a ball grid array on the connection side. Some aspects also include electrostatic discharge traces positioned at least partially around a perimeter of the connection side. Methods of manufacturing are also disclosed.
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Citations
33 Claims
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1-13. -13. (canceled)
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14. A fingerprint sensor package comprising:
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a sensor die having a die top side, a die bottom side, and die lateral sides; a sensing area on the die top side; a top side trace, at least a portion of which is directly above the sensor die; a bottom side trace, at least a portion of which is directly below the sensor die; a conductive via that electrically connects the top side trace and the bottom side trace, wherein the conductive via is positioned laterally outside of the sensing area; and an encapsulant that covers at least the die lateral sides. - View Dependent Claims (15, 16, 17, 18, 19, 20, 21)
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22. A fingerprint sensor package comprising:
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a sensor die having a die top side, a die bottom side, and die lateral sides; a sensing area on the die top side; a top side trace, at least a portion of which is directly above the sensor die; a bottom side trace, at least a portion of which is directly below the sensor die; a conductive via that electrically connects the top side trace and the bottom side trace; an encapsulant that covers at least the die lateral sides; and a protective layer that covers the sensing area. - View Dependent Claims (23, 24, 25, 26, 27, 28)
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29. A fingerprint sensor package comprising:
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a sensor die having a die top side, a die bottom side, and die lateral sides; a sensing area on the die top side; a top side trace, at least a portion of which is directly above the sensor die; a bottom side trace, at least a portion of which is directly below the sensor die; a conductive via that electrically connects the top side trace and the bottom side trace; and an encapsulant that covers at least a portion of the die bottom side and covers at least a portion of each of the die lateral sides. - View Dependent Claims (30, 31, 32, 33)
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Specification