SEMICONDUCTOR DEVICE, SYSTEM IN PACKAGE, AND SYSTEM IN PACKAGE FOR VEHICLE

• US 20180090424A1
• Filed: 07/24/2017
• Published: 03/29/2018
• Est. Priority Date: 09/27/2016
• Status: Active Grant

• Current Assignee: Renesas Electronics Corporation
• Original Assignee: Renesas Electronics Corporation
• Inventors: BETSUI, Takafumi
• Granted Patent: US 10,249,560 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 23/49816 Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 23/49833 the chip support structure consisting of a plurality of insulating substrates
• CPC Class Codes: H01L 23/49838 Geometry or layout
• CPC Class Codes: H01L 23/50 for integrated circuit devices, e.g. power bus, number of leadsH01L23/482 - H01L23/498 take precedence
• CPC Class Codes: H01L 23/5385 Assembly of a plurality of insulating substrates
• CPC Class Codes: H01L 23/5386 Geometry or layout of the interconnection structure
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate

Abstract

The object is to suppress rupture of the soldering balls when an atmosphere varying from a high temperature to a low temperature is repeated. A semiconductor device includes a semiconductor integrated circuit and a substrate. The semiconductor integrated circuit is, for example, a semiconductor chip. The coefficient of thermal expansion is different between the semiconductor integrated circuit and the substrate. The substrate includes a plurality of soldering balls on the opposite surface to the surface where the semiconductor integrated circuit is mounted. The substrate does not have the soldering balls at a position corresponding to at least one side of the fringe of the semiconductor integrated circuit.

Claims

1. A semiconductor device comprising:

a semiconductor integrated circuit; and

a substrate to mount the semiconductor integrated circuit thereon,

wherein coefficient of thermal expansion is different between the semiconductor integrated circuit and the substrate,

wherein the substrate includes electrodes for a plurality of soldering balls on a surface opposite to a surface where the semiconductor integrated circuit is mounted,

wherein the substrate does not have the electrodes for the soldering balls at a position corresponding to at least one side of a fringe of the semiconductor integrated circuit.

2. The device according to claim 1,

wherein the semiconductor integrated circuit is flip-chip mounted on the substrate using a soldering bump.

3. The device according to claim 1,

wherein the semiconductor integrated circuit includes a semiconductor element and another substrate to mount the semiconductor element thereon.

4. A semiconductor system in package comprising:

at least one semiconductor integrated circuit; and

a package substrate to mount at least one semiconductor element thereon,

wherein coefficient of thermal expansion of the semiconductor integrated circuit is different from the coefficient of thermal expansion of the package substrate,

wherein the package substrate includes electrodes for a plurality of soldering balls on a surface opposite to a surface where at least the semiconductor integrated circuit is mounted, and

wherein the package substrate does not have the electrodes for the soldering balls at a position corresponding to at least one side of a fringe of the at least one semiconductor integrated circuit.

5. The system in package according to claim 4,

wherein the package substrate does not have the electrodes for the soldering balls at a position corresponding to at least a farthest side from a center of the package substrate, of the fringe of the semiconductor integrated circuit.

6. The system in package according to claim 4,

wherein the package substrate does not have the electrodes for the soldering balls at a position corresponding to an inner side of the fringe of the semiconductor integrated circuit.

7. The system in package according to claim 4,

wherein viewed from a position corresponding to the fringe of the semiconductor integrated circuit, a distance between the electrode for the soldering ball existing nearest to the center in a direction of going toward the center of the package substrate and a position corresponding to the fringe of the semiconductor integrated circuit is longer than a distance between the electrode for the soldering ball existing nearest in an opposite direction to the center of the package substrate and the position corresponding to the fringe of the semiconductor integrated circuit.

8. The system in package according to claim 4,

wherein the semiconductor integrated circuit includes a semiconductor element and a substrate to mount the semiconductor element thereon.

9. The system in package according to claim 4,

wherein the electrodes for the soldering balls are arranged along the fringe of the package substrate to surround the center of the package substrate, except for the position corresponding to at least one side of the fringe of the semiconductor integrated circuit.

10. The system in package according to claim 4,

wherein the electrodes for the soldering balls are arranged on the whole surface of the package substrate, except for the position corresponding to at least one side of the fringe of the semiconductor integrated circuit.

11. The system in package according to claim 4,

wherein the package substrate further includes electrodes for soldering balls used as dummy terminals at the position corresponding to at least one side of the fringe of the semiconductor integrated circuit.

12. A semiconductor system in package for vehicle comprising:

a semiconductor integrated circuit which receives sensor information from at least one on-vehicle sensor;

at least one memory element used by the semiconductor integrated circuit; and

a package substrate to mount the semiconductor integrated circuit and the at least one memory element thereon,

wherein coefficient of thermal expansion of the semiconductor integrated circuit is different from coefficient of thermal expansion of the package substrate,

wherein the package substrate includes electrodes for a plurality of soldering balls on a surface opposite to a surface where the semiconductor integrated circuit and the at least one memory element are mounted, and

wherein the package substrate does not have the electrodes for the soldering balls at a position corresponding to at least one side of a fringe of the semiconductor integrated circuit.