SEMICONDUCTOR DEVICE, SYSTEM IN PACKAGE, AND SYSTEM IN PACKAGE FOR VEHICLE
First Claim
1. A semiconductor device comprising:
- a semiconductor integrated circuit; and
a substrate to mount the semiconductor integrated circuit thereon,wherein coefficient of thermal expansion is different between the semiconductor integrated circuit and the substrate,wherein the substrate includes electrodes for a plurality of soldering balls on a surface opposite to a surface where the semiconductor integrated circuit is mounted,wherein the substrate does not have the electrodes for the soldering balls at a position corresponding to at least one side of a fringe of the semiconductor integrated circuit.
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Accused Products
Abstract
The object is to suppress rupture of the soldering balls when an atmosphere varying from a high temperature to a low temperature is repeated. A semiconductor device includes a semiconductor integrated circuit and a substrate. The semiconductor integrated circuit is, for example, a semiconductor chip. The coefficient of thermal expansion is different between the semiconductor integrated circuit and the substrate. The substrate includes a plurality of soldering balls on the opposite surface to the surface where the semiconductor integrated circuit is mounted. The substrate does not have the soldering balls at a position corresponding to at least one side of the fringe of the semiconductor integrated circuit.
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Citations
12 Claims
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1. A semiconductor device comprising:
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a semiconductor integrated circuit; and a substrate to mount the semiconductor integrated circuit thereon, wherein coefficient of thermal expansion is different between the semiconductor integrated circuit and the substrate, wherein the substrate includes electrodes for a plurality of soldering balls on a surface opposite to a surface where the semiconductor integrated circuit is mounted, wherein the substrate does not have the electrodes for the soldering balls at a position corresponding to at least one side of a fringe of the semiconductor integrated circuit. - View Dependent Claims (2, 3)
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4. A semiconductor system in package comprising:
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at least one semiconductor integrated circuit; and a package substrate to mount at least one semiconductor element thereon, wherein coefficient of thermal expansion of the semiconductor integrated circuit is different from the coefficient of thermal expansion of the package substrate, wherein the package substrate includes electrodes for a plurality of soldering balls on a surface opposite to a surface where at least the semiconductor integrated circuit is mounted, and wherein the package substrate does not have the electrodes for the soldering balls at a position corresponding to at least one side of a fringe of the at least one semiconductor integrated circuit. - View Dependent Claims (5, 6, 7, 8, 9, 10, 11)
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12. A semiconductor system in package for vehicle comprising:
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a semiconductor integrated circuit which receives sensor information from at least one on-vehicle sensor; at least one memory element used by the semiconductor integrated circuit; and a package substrate to mount the semiconductor integrated circuit and the at least one memory element thereon, wherein coefficient of thermal expansion of the semiconductor integrated circuit is different from coefficient of thermal expansion of the package substrate, wherein the package substrate includes electrodes for a plurality of soldering balls on a surface opposite to a surface where the semiconductor integrated circuit and the at least one memory element are mounted, and wherein the package substrate does not have the electrodes for the soldering balls at a position corresponding to at least one side of a fringe of the semiconductor integrated circuit.
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Specification