MODIFIED POLYCARBODIIMIDE COMPOUND, CURING AGENT, AND THERMOSETTING RESIN COMPOSITION

• US 20180094095A1
• Filed: 03/30/2016
• Published: 04/05/2018
• Est. Priority Date: 04/06/2015
• Status: Active Grant

• Current Assignee: Nisshinbo Chemical Inc. (Nisshinbo Holdings Incorporated)
• Original Assignee: Nisshinbo Chemical Inc. (Nisshinbo Holdings Incorporated)
• Inventors: TAKAHASHI, Ikuo, ITOH, Takahiko, SASAKI, Takahiro
• Granted Patent: US 10,457,768 B2
• Time in Patent Office: Days
• CPC Class Codes: C08G 18/025 the polymeric products containing carbodiimide groups
• CPC Class Codes: C08G 18/095 oligomerisation to carbodiimide or uretone-imine groups
• CPC Class Codes: C08G 18/168 Organic compounds
• CPC Class Codes: C08G 18/44 Polycarbonates
• CPC Class Codes: C08G 18/71 Monoisocyanates or monoisothiocyanates
• CPC Class Codes: C08G 18/76 aromatic
• CPC Class Codes: C08G 18/7621 being toluene diisocyanate including isomer mixtures
• CPC Class Codes: C08G 18/797 containing carbodiimide and/or uretone-imine groups
• CPC Class Codes: C08G 18/83 Chemically modified polymers
• CPC Class Codes: C08G 18/833 by nitrogen containing compounds by azo compounds C08G18/85
• CPC Class Codes: C08J 2300/24 Thermosetting resins
• CPC Class Codes: C08L 101/08 Carboxyl groups
• CPC Class Codes: C08L 63/00 Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• CPC Class Codes: C08L 79/08 Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
• CPC Class Codes: C09D 175/04 Polyurethanes

Abstract

The modified polycarbodiimide compound of the present invention is obtained by modifying a polycarbodiimide compound derived from a diisocyanate compound with at least one aliphatic amine selected from the group consisting of diethylamine, methylisopropylamine, tert-butylethylamine, di-sec-butylamine, dicyclohexylamine, 2-methylpiperidine and 2,6-dimethylpiperidine. The curing agent of the present invention comprises the modified polycarbodiimide compound of the present invention. The thermosetting resin composition of the present invention comprises a carboxyl group-containing resin having a carboxyl group in a molecule or an epoxy resin having two or more epoxy groups in one molecule, and the curing agent of the present invention. Thus, a modified polycarbodiimide compound that can allow a resin composition to be cured at a relatively low temperature and that can suppress curing of a resin composition in a drying step before a thermal curing step of a resin composition, a curing agent comprising the modified polycarbodiimide compound, and a thermosetting resin composition comprising the curing agent can be provided.

Claims

1. A modified polycarbodiimide compound obtained by modifying a polycarbodiimide compound derived from a diisocyanate compound with at least one aliphatic amine selected from the group consisting of diethylamine, methylisopropylamine, tert-butylethylamine, di-sec-butylamine, dicyclohexylamine, 2-methylpiperidine and 2,6-dimethylpiperidine.

2. The modified polycarbodiimide compound according to claim 1, wherein the aliphatic amine is at least one aliphatic amine selected from the group consisting of diethylamine, tert-butylethylamine, di-sec-butylamine, dicyclohexylamine, 2-methylpiperidine and 2,6-dimethylpiperidine.

3. The modified polycarbodiimide compound according to claim 2, wherein the aliphatic amine is at least one aliphatic amine selected from the group consisting of diethylamine, tert-butylethylamine, di-sec-butylamine, dicyclohexylamine and 2-methylpiperidine.

4. The modified polycarbodiimide compound according to claim 3, wherein the aliphatic amine is di-sec-butylamine.

5. The modified polycarbodiimide compound according to claim 1, wherein the diisocyanate compound is an aromatic diisocyanate compound.

6. The modified polycarbodiimide compound according to claim 5, wherein the aromatic diisocyanate compound is at least one aromatic diisocyanate compound selected from the group consisting of 4,4′

-diphenylmethane diisocyanate, 2,4-tolylene diisocyanate and 2,6-tolylene diisocyanate.

7. A curing agent comprising the modified polycarbodiimide compound according to claim 1.

8. A thermosetting resin composition comprising:

a carboxyl group-containing resin having a carboxyl group in a molecule or an epoxy resin having two or more epoxy groups in one molecule; and

the curing agent according to claim 7.

9. The thermosetting resin composition according to claim 8, wherein the carboxyl group-containing resin is at least one resin selected from the group consisting of a polyurethane resin, a polyamide resin, an acrylic resin, a vinyl acetate resin, a polyolefin resin and a polyimide resin.