ELECTRONIC DEVICE, ELECTRONIC DEVICE APPARATUS, ELECTRONIC APPARATUS, AND MOVING OBJECT

• US 20180095105A1
• Filed: 09/21/2017
• Published: 04/05/2018
• Est. Priority Date: 09/30/2016
• Status: Active Grant

• Current Assignee: Seiko Epson Corporation (Seiko Group)
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: KAWANO, Shuichi
• Granted Patent: US 10,641,788 B2
• Time in Patent Office: Days
• CPC Class Codes: G01C 19/5783 Mountings or housings not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719
• CPC Class Codes: G01P 15/08 with conversion into electric or magnetic values
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: G01P 15/125 by capacitive pick-up
• CPC Class Codes: G01P 2015/0814 for translational movement of the mass, e.g. shuttle type
• CPC Class Codes: G01P 3/44 for measuring angular speed G01P3/56 takes precedence
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48463 the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
• CPC Class Codes: H01L 2224/49109 outside the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 29/84 controllable by variation of applied mechanical force, e.g. of pressure
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H05K 1/118 specially for flexible printed circuits, e.g. using folded portions

Abstract

An electronic device includes a base body, a functional element disposed on the base body, a wiring disposed on the base body and electrically connected to the functional element, and a terminal disposed on the base body and electrically connected to the wiring, wherein the terminal includes a non-overlapping region which does not overlap with the wiring. Further, the terminal includes an overlapping region which overlaps with the wiring.

Claims

1. An electronic device, comprising:

a base body;

a functional element disposed on the base body;

a wiring disposed on the base body and electrically connected to the functional element; and

a terminal disposed on the base body and electrically connected to the wiring, wherein

the terminal includes a non-overlapping region which does not overlap with the wiring.

2. The electronic device according to claim 1, wherein the terminal includes an overlapping region which overlaps with the wiring.

3. The electronic device according to claim 2, wherein the overlapping region is disposed so as to surround the non-overlapping region.

4. The electronic device according to claim 1, wherein an intermediate layer is disposed between the wiring and the overlapping region.

5. The electronic device according to claim 4, wherein the intermediate layer is also disposed between the base body and the non-overlapping region.

6. The electronic device according to claim 4, wherein

the wiring includes

a foundation layer formed on the surface of the base body, and

an electrode layer stacked on the surface of the foundation layer on the opposite side of the base body side, and

the foundation layer is composed of Ti or an alloy containing Ti, and

the electrode layer is composed of Pt, Au, Ag, Pd, Rh, Ir, Ru, Os, or an alloy containing any of these metals.

7. The electronic device according to claim 6, wherein the terminal is composed of Au, Cu, Al, or an alloy containing any of these metals.

8. The electronic device according to claim 7, wherein the intermediate layer is composed of Ti, W, Ta, Ni, Co, Cr, Mo, or an alloy containing any of these metals.

9. The electronic device according to claim 1, wherein the surface of the base body on which the wiring and the terminal are disposed contains an insulating oxide.

10. The electronic device according to claim 1, wherein the functional element is at least any of an acceleration sensor element, an angular velocity sensor element, a pressure sensor element, and a magnetic sensor element.

11. An electronic device apparatus, comprising:

the electronic device according to claim 1;

a circuit element; and

a bonding wire electrically connecting the terminal of the electronic device to the circuit element, wherein

the bonding wire is connected to the non-overlapping region of the terminal.

12. An electronic device apparatus, comprising:

the electronic device according to claim 2;

a circuit element; and

a bonding wire electrically connecting the terminal of the electronic device to the circuit element, wherein

the bonding wire is connected to the non-overlapping region of the terminal.

13. An electronic device apparatus, comprising:

the electronic device according to claim 3;

a circuit element; and

a bonding wire electrically connecting the terminal of the electronic device to the circuit element, wherein

the bonding wire is connected to the non-overlapping region of the terminal.

14. The electronic device apparatus according to claim 11, wherein the non-overlapping region and the bonding wire contain the same material.

15. The electronic device apparatus according to claim 12, wherein the same material is any of Au, Cu, and Al.

16. An electronic apparatus, comprising the electronic device according to claim 6.

17. A moving object, comprising:

the electronic device according to claim 1; and

a posture control device.

18. A moving object, comprising:

the electronic device according to claim 2; and

a posture control device.

19. A moving object, comprising:

the electronic device according to claim 3; and

a posture control device.

20. A moving object, comprising:

the electronic device according to claim 4; and

a posture control device.