CHIP PACKAGING STRUCTURE AND CHIP PACKAGING METHOD

• US 20180102261A1
• Filed: 09/06/2017
• Published: 04/12/2018
• Est. Priority Date: 10/10/2016
• Status: Abandoned Application

• Current Assignee: Shenzhen Goodix Technology Co., Ltd.
• Original Assignee: Shenzhen Goodix Technology Co., Ltd.
• Inventors: LONG, Wei, WU, Baoquan, LIU, Xiangying
• Application Number:
  US15/696,177
• Publication Number:
  US 20180102261A1
• Time in Patent Office: Days
• CPC Class Codes: H01L 21/561 Batch processing
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 21/568 Temporary substrate used as encapsulation process aid H01L21/4832 and H01L21/566 take precedence
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/3135 Double encapsulation or coating and encapsulation
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation

Abstract

A chip packaging structure includes: at least one package, each of the at least one package comprising at least one chip; and an expansion body wrapping the package and being cuttable according to a package size requirement. A chip packaging method includes: fixing at least one package to a lower mold surface via a carrier, and sealing an upper mold for the package; and fully filling a cavity between the carrier and the upper mold with an expansion body by plastic injection molding, the expansion body wrapping the at least one package; and releasing the mold to obtain a size-expanded package, and cutting the package according to a package size need. The present application achieves size-variable chip packaging.

Claims

1. A chip packaging structure, comprising:

at least one package, each of the at least one package comprising at least one chip; and

an expansion body wrapping the package and being cuttable according to a package size requirement.

2. The chip packaging structure according to claim 1, wherein the expansion body wraps four side faces of the package.

3. The chip packaging structure according to claim 1, wherein the expansion body is not lower than an upper surface of the package.

4. The chip packaging structure according to claim 3, wherein the expansion body is aligned with the upper surface of the package.

5. The chip packaging structure according to claim 1, wherein the expansion body is made from a plastic injection molding material or a frame filling material.

6. The chip packaging structure according to claim 5, wherein the expansion body has a thermal expansion coefficient that is the same as thermal expansion coefficients of a plastic package of the package, a lead frame, a substrate and a chip silicon material.

7. The chip packaging structure according to claim 1, wherein a surface of the chip packaging structure is provided with an attachment portion configured to enhance an attachment force with a printed circuit board.

8. The chip packaging structure according to claim 1, wherein the expansion body comprises at least one of a discrete device or a conductive vias module.

9. The chip packaging structure according to claim 1, wherein a lower surface of the package is provided with a pad film or sprayed with a water-soluble adhesive.

10. A chip packaging method, comprising:

fixing at least one package to a lower mold surface via a carrier, and sealing an upper mold for the package;

fully filling a cavity between the carrier and the upper mold with an expansion body by plastic injection molding, the expansion body wrapping the at least one package; and

releasing the mold to obtain a size-expanded package, and cutting the package according to a package size need.

11. The chip packaging method according to claim 10, further comprising:

grinding the size-expanded package, such that an upper surface of the expansion body is aligned with an upper surface of the package.

12. The chip packaging method according to claim 10, wherein the fully filling a cavity between the carrier and the upper mold with an expansion body by plastic injection molding, the expansion body wrapping the at least one package comprises:

fully filling the cavity between the carrier and the upper mold with the expansion body by plastic injection molding, the expansion body wrapping one package;

or

fully filling the cavity between the carrier and the upper mold with the expansion body by full-board plastic injection molding, the expansion body wrapping a plurality of packages.

13. The chip packaging method according to claim 10, wherein prior to the fixing at least one package to a lower mold surface via a carrier, and sealing an upper mold for the package, the method further comprises:

attaching the cover on the upper surface of the package.

14. The chip packaging method according to claim 10, wherein upon the releasing the mold to obtain a size-expanded package, the method further comprises:

adding an attachment portion configured to enhance an attachment force with a printed circuit board on a surface of the chip packaging structure.

15. The chip packaging method according to claim 10, wherein prior to the fully filling a cavity between the carrier and the upper mold with an expansion body by plastic injection molding, the expansion body wrapping the at least one package, the method further comprises:

arranging at least one of a discrete device or a conductive vias module in the cavity.

16. The chip packaging method according to claim 10, wherein prior to the fixing at least one package to a lower mold surface via a carrier, and sealing an upper mold for the package, the method further comprises:

adding a pad film or spraying a water-soluble adhesive on a lower surface of the package.