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CRYOGENIC ELECTRONIC PACKAGES AND METHODS FOR FABRICATING CRYOGENIC ELECTRONIC PACKAGES

  • US 20180102469A1
  • Filed: 08/23/2017
  • Published: 04/12/2018
  • Est. Priority Date: 10/11/2016
  • Status: Active Grant
First Claim
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1. A cryogenic electronic package, comprising:

  • a first superconducting multi-chip module (SMCM) having first and second opposing surfaces;

    a first superconducting interposer having first and second opposing surfaces, wherein the first surface of the first interposer is disposed over and coupled to the second surface of the first SMCM;

    a second SMCM having first and second opposing surfaces, wherein the first surface of the second SMCM is disposed over and coupled to the second surface of the first interposer; and

    a first superconducting semiconductor structure having first and second opposing surfaces, wherein the first surface of the first superconducting semiconductor structure is disposed over and coupled to the second surface of the second SMCM, and the second SMCM and the first superconducting semiconductor structure are electrically coupled to the first SMCM through the first interposer.

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