BEND SENSOR

• US 20180113003A1
• Filed: 09/18/2017
• Published: 04/26/2018
• Est. Priority Date: 10/21/2016
• Status: Active Grant

• Current Assignee: Taiwan Alpha Electronic Co Ltd
• Original Assignee: Taiwan Alpha Electronic Co Ltd
• Inventors: HUANG, TZU-HSUAN, LIU, WEI-LIANG, CHAN, HUANG-CHAO
• Granted Patent: US 10,302,459 B2
• Time in Patent Office: Days
• CPC Class Codes: G01B 7/20 formed by printed-circuit technique
• CPC Class Codes: G01D 5/16 by varying resistance
• CPC Class Codes: H05K 1/028 Bending or folding regions of flexible printed circuits H05K1/0283 takes precedence
• CPC Class Codes: H05K 1/111 Pads for surface mounting, e.g. lay-out
• CPC Class Codes: H05K 2201/10151 Sensor

Abstract

A bend sensor includes a flexible circuit substrate, an insulation pad and a flexible conductive substrate. The flexible circuit substrate includes an insulating body, a first circuit and a second circuit. The first and second circuits are disposed on opposing sides of the insulating body. The first circuit has first fingers, while the second circuit has second fingers. The insulation pad disposed on the insulating body exposes the first and second fingers. The flexible conductive substrate disposed on the insulating pad has a conductive layer separated from the first fingers and the second fingers. While the bend sensor is bent, the conductive layer on the flexible conductive substrate would deform toward the flexible circuit substrate so as to form multiple contacts with the first and second fingers. Through these contacts, a number of resistors are formed to contribute a detectable resistance for the corresponding bending amplitude to be further realized.

Claims

1. A bend sensor, comprising:

a flexible circuit substrate, including;

an insulating body, extending in a first direction;

a first circuit, disposed on the insulating body, including;

a first bus portion, disposed at one side of the insulating body, extending in the first direction; and

a plurality of first fingers, extending from the first bus portion in a second direction different from the first direction; and

a second circuit, disposed on the insulating body, including;

a second bus portion, disposed at another side of the insulating body by opposing to the first bus portion, extending in the first direction; and

a plurality of second fingers, extending from the second bus portion in a reverse direction of the second direction, alternately arranged with the plurality of first fingers;

an insulation pad, disposed at the insulating body, furnished with a central hollow portion for exposing therefrom the plurality of first fingers and the plurality of second fingers; and

a flexible conductive substrate, adhered to the insulation pad to sandwich the insulation pad in between with the flexible circuit substrate so as to form a central empty space at the central hollow portion, furnished with a conductive layer exposed to the central empty space and facing the plurality of first fingers and the plurality of second fingers;

wherein, when the bend sensor is bent at both ends thereof to produce a bending deformation in the first direction, the conductive layer alters a total contact number of the plurality of first fingers and the plurality of second fingers with the conductive layer according to the bending deformation of the bend sensor, such that an equivalent resistance between the first circuit and the second circuit would vary accordingly, and the bending deformation can thus be realized by detecting the equivalent resistance.

2. The bend sensor of claim 1, wherein the second direction is perpendicular to the first direction.

3. The bend sensor of claim 1, wherein the insulating body has a first end and a second end, and the first end is extended to the second end in the first direction.

4. The bend sensor of claim 3, wherein the first circuit further includes a first transmission portion, the second circuit further includes a second transmission portion, the first transmission portion is formed by extending from the first bus portion to the first end, and the second transmission portion is formed by extending from the second bus portion to the first end.

5. The bend sensor of claim 1, wherein the insulation pad includes:

a first lateral-side supportive portion, disposed at one side of the insulating body, located between the insulating body and the flexible conductive substrate;

a second lateral-side supportive portion, disposed at another side of the insulating body by opposing to the first lateral-side supportive portion, located between the insulating body and the flexible conductive substrate; and

an end supportive portion, disposed at one end of the insulating body, integrated as a unique piece with the first lateral-side supportive portion and the second lateral-side supportive portion, such that the first lateral-side supportive portion, the second lateral-side supportive portion and the end supportive portion are integrated to form thereinside the central hollow portion.

6. The bend sensor of claim 5, wherein the first lateral-side supportive portion further has a first end supportive portion, the second lateral-side supportive portion further has a second end supportive portion, and an aperture for communicating spatially the central empty space with the atmosphere is formed between the first end supportive portion and the second end supportive portion at another end of the insulating body by opposing to the end supportive portion.

7. The bend sensor of claim 1, further including a reinforcing plate adhered to the flexible conductive substrate.