NANOSHEET TRANSISTORS WITH SHARP JUNCTIONS
First Claim
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1. A method for forming a semiconductor device, the method comprising:
- forming a nanosheet stack over a substrate, the nanosheet stack having a plurality of nanosheets alternating with a plurality of sacrificial layers, arranged such that a topmost and a bottommost layer of the nanosheet stack is one of the sacrificial layers;
forming an oxide recess on a first and a second end of each sacrificial layer; and
forming a doped extension region on a first and a second end of each nanosheet.
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Abstract
A method of forming a semiconductor device and resulting structures having nanosheet transistors with sharp junctions by forming a nanosheet stack over a substrate, the nanosheet stack having a plurality of nanosheets alternating with a plurality of sacrificial layers, such that a topmost and a bottommost layer of the nanosheet stack is a sacrificial layer; forming an oxide recess on a first and a second end of each sacrificial layer; and forming a doped extension region on a first and a second end of each nanosheet.
42 Citations
20 Claims
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1. A method for forming a semiconductor device, the method comprising:
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forming a nanosheet stack over a substrate, the nanosheet stack having a plurality of nanosheets alternating with a plurality of sacrificial layers, arranged such that a topmost and a bottommost layer of the nanosheet stack is one of the sacrificial layers; forming an oxide recess on a first and a second end of each sacrificial layer; and forming a doped extension region on a first and a second end of each nanosheet. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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18. A method for forming a semiconductor device, the method comprising:
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forming a nanosheet stack over a substrate, the nanosheet stack having a plurality of silicon nanosheets alternating with a plurality of silicon germanium (SiGe) sacrificial layers, arranged such that a topmost and a bottommost layer of the nanosheet stack is one of the sacrificial layers; oxidizing a first and a second end of each SiGe sacrificial layer to form a silicon oxide (SiO) recess, which causes displacement of germanium in the first and second end of each sacrificial layer to a first and a second end of each silicon nanosheet; and exposing the nanosheet stack to a dopant, the dopant doping a SiGe extension region on the first and second end of each silicon nanosheet, the SiGe extension region defined by the displaced germanium in the first and second end of each silicon nanosheet. - View Dependent Claims (19, 20)
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Specification