SYSTEMS AND METHODS OF CONTROLLING ADHESIVE APPLICATION

• US 20180117622A1
• Filed: 10/23/2017
• Published: 05/03/2018
• Est. Priority Date: 10/30/2016
• Status: Active Grant

• Current Assignee: Nordson Corporation
• Original Assignee: Nordson Corporation
• Inventors: Estelle, Peter W.
• Granted Patent: US 11,618,051 B2
• Time in Patent Office: Days
• CPC Class Codes: B05C 11/1002 Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
• CPC Class Codes: B05C 11/1005 responsive to condition of liquid or other fluent material already applied to the surface, e.g. coating thickness, weight or pattern
• CPC Class Codes: B05C 11/1042 provided with means for heating or cooling the liquid or other fluent material in the supplying means upstream of the applying apparatus
• CPC Class Codes: B05C 5/001 incorporating means for heating or cooling the liquid or other fluent material B05C11/1042 takes precedence
• CPC Class Codes: B05C 5/0208 for applying liquid or other fluent material to separate articles B05C5/0204 takes precedence
• CPC Class Codes: C09J 5/00 Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers

Abstract

Systems and methods for controlling adhesive application are disclosed. The systems and methods may include a controller and one or more sensors configured to measure an amount of adhesive applied to a plurality of substrates by a pump, detect a number of the substrates, determine an amount of adhesive applied per substrate, compare the adhesive applied per substrate to a target value, and adjust a pressure of the pump based on the comparison. The sensor(s) may include one or more of a valve sensor coupled to an adhesive supply, a flow rate sensor coupled to a manifold, a flow rate sensor coupled to one or more hoses, and a flow rate sensors coupled to a gun.

Claims

1. A method for controlling adhesive application, the method comprising:

measuring an amount of adhesive applied to a plurality of substrates by a pump;

detecting a number of the substrates;

determining an amount of adhesive applied per substrate;

comparing the adhesive applied per substrate to a target value; and

adjusting a pressure of the pump based on the comparison.

2. The method of claim 1, wherein measuring the amount of adhesive applied includes detecting opening of a valve of a supply.

3. The method of claim 1, wherein measuring the amount of adhesive applied includes detecting a flow rate of the adhesive with a flow sensor.

4. The method of claim 3, wherein detecting the flow rate includes detecting the flow rate in a manifold.

5. The method of claim 3, wherein detecting the flow rate includes detecting the flow rate in a hose in communication with an applicator.

6. The method of claim 1, wherein detecting the number of the substrates includes detecting a number of the substrates on a conveyor belt passing a sensor.

7. The method of claim 1, further comprising receiving the target value with a user interface.

8. A control system for controlling adhesive application, the system comprising:

a first sensor configured to measure an amount of adhesive applied to a plurality of substrates by a pump;

a second sensor configured to detect a number of the substrates;

a controller in communication with the first sensor and the second sensor, the controller being configured to;

determine an amount of adhesive applied per substrate;

compare the adhesive applied per substrate to a target value; and

adjust a pressure of the pump based on the comparison.

9. The system of claim 8, wherein the first sensor is configured to detect opening of a valve of a supply to measure the amount of the adhesive applied.

10. The system of claim 8, wherein the first sensor is configured to detect a flow rate of the adhesive to measure the amount of the adhesive applied.

11. The system of claim 10, wherein the first sensor is configured to detect the flow rate in a manifold.

12. The system of claim 10, wherein the first sensor is configured to detect the flow rate in a hose in communication with an applicator.

13. The system of claim 8, wherein the second sensor is configured to detect a number of the substrates on a conveyor belt.

14. The system of claim 8, further including a user interface configured to receive the target value.

15. A non-transitory computer-readable medium storing instructions which, when executed, cause one or more processors to perform a process for controlling adhesive application, the process comprising:

measuring an amount of adhesive applied to a plurality of substrates by a pump;

detecting a number of the substrates;

determining an amount of adhesive applied per substrate;

comparing the adhesive applied per substrate to a target value; and

adjusting a pressure of the pump based on the comparison.

16. The medium of claim 15, wherein measuring the amount of adhesive applied includes detecting opening of a valve of a supply.

17. The medium of claim 15, wherein measuring the amount of adhesive applied includes detecting a flow rate of the adhesive with a flow sensor.

18. The medium of claim 17, wherein detecting the flow rate includes detecting the flow rate in a manifold.

19. The medium of claim 17, wherein detecting the flow rate includes detecting the flow rate in a hose in communication with an applicator.

20. The medium of claim 15, wherein detecting the number of the substrates includes detecting a number of the substrates on a conveyor belt passing a sensor.