ONE-PART WATER-BASED ADHESIVE COMPOSITION

• US 20180118987A1
• Filed: 02/26/2016
• Published: 05/03/2018
• Est. Priority Date: 03/30/2015
• Status: Active Grant

• Current Assignee: Cemedine Co. Ltd. (Kaneka Corporation)
• Original Assignee: Cemedine Co. Ltd. (Kaneka Corporation)
• Inventors: SAITO, Tomonori
• Granted Patent: US 10,450,487 B2
• Time in Patent Office: Days
• CPC Class Codes: C08G 18/0866 the dispersing or dispersed phase being an aqueous medium
• CPC Class Codes: C08G 2170/80 Compositions for aqueous adhesives
• CPC Class Codes: C08K 5/5419 containing at least one Si—C bond
• CPC Class Codes: C09D 5/024 characterised by the additives
• CPC Class Codes: C09D 5/027 Dispersing agents anti-settling agents C09D7/45
• CPC Class Codes: C09J 11/06 organic
• CPC Class Codes: C09J 175/04 Polyurethanes
• CPC Class Codes: C09J 175/06 from polyesters
• CPC Class Codes: C09J 175/08 from polyethers

Abstract

Provided is a one-part water-based adhesive composition which suffers no yellowing and is excellent in adhesiveness and durability. The one-part water-based adhesive composition includes (A) an aqueous dispersion of a polyurethane resin and (B) a silane compound obtained by reacting a specific epoxysilane compound with an aminosilane compound represented by the following Formula (2), the amount of the epoxysilane compound being in the range of 1.5 to 10 mol per 1 mol of the aminosilane compound, at a reaction temperature of 40 to 100° C.

(In Formula (2), R⁷ to R¹² are each a hydrogen atom or an alkyl group, R¹³ is a monovalent hydrocarbon group, R¹⁴ is an alkyl group, and b is 0 or 1.)

Claims

1. A one-part water-based adhesive composition comprising:

(A) an aqueous dispersion of a polyurethane resin; and

(B) a silane compound obtained by reacting an epoxysilane compound represented by Formula (1) with an aminosilane compound represented by Formula (2), the amount of the epoxysilane compound being in the range of 1.5 to 10 mol per 1 mol of the aminosilane compound, at a reaction temperature of 40 to 100°

C.;