LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF
First Claim
1. A light-emitting device, comprising:
- at least one light-emitting unit, wherein the light-emitting unit has an upper surface and a lower surface opposite to each other, the light-emitting unit comprises two electrode pads, and the two electrode pads are located on the lower surface of the light-emitting unit;
a wavelength conversion adhesive layer, disposed on the upper surface of the light-emitting unit, wherein the wavelength conversion adhesive layer comprises a low-concentration fluorescent adhesive layer and a high-concentration fluorescent adhesive layer, and the high-concentration fluorescent adhesive layer is located between the low-concentration fluorescent adhesive layer and the light-emitting unit; and
a reflective protecting element, covering the light-emitting unit and a portion of the wavelength conversion adhesive layer and at least exposing the two electrode pads of the light-emitting unit and the low-concentration fluorescent layer,wherein a width of the high-concentration fluorescent adhesive layer is WH, a width of the low-concentration fluorescent adhesive layer is WL, a width of the light-emitting unit is WE, and the light-emitting device further satisfies the following inequalities;
WE<
WL, WH<
WL; and
0.8<
WH/WE≤
1.2.
3 Assignments
0 Petitions
Accused Products
Abstract
A light-emitting device including at least one light-emitting unit, a wavelength conversion adhesive layer, and a reflective protecting element is provided. The light-emitting unit has an upper surface and a lower surface opposite to each other. The light-emitting unit includes two electrode pads, and the two electrode pads are located on the lower surface. The wavelength conversion adhesive layer is disposed on the upper surface. The wavelength conversion adhesive layer includes a low-concentration fluorescent layer and a high-concentration fluorescent layer. The high-concentration fluorescent layer is located between the low-concentration fluorescent layer and the light-emitting unit. The width of the high-concentration fluorescent layer is WH. The width of the low-concentration fluorescent layer is WL. The width of the light-emitting unit is WE. The light-emitting device further satisfies the following inequalities: WE<WL, WH<WL and 0.8<WH/WE≤1.2. Furthermore, a manufacturing method of the light-emitting device is also provided.
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Citations
13 Claims
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1. A light-emitting device, comprising:
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at least one light-emitting unit, wherein the light-emitting unit has an upper surface and a lower surface opposite to each other, the light-emitting unit comprises two electrode pads, and the two electrode pads are located on the lower surface of the light-emitting unit; a wavelength conversion adhesive layer, disposed on the upper surface of the light-emitting unit, wherein the wavelength conversion adhesive layer comprises a low-concentration fluorescent adhesive layer and a high-concentration fluorescent adhesive layer, and the high-concentration fluorescent adhesive layer is located between the low-concentration fluorescent adhesive layer and the light-emitting unit; and a reflective protecting element, covering the light-emitting unit and a portion of the wavelength conversion adhesive layer and at least exposing the two electrode pads of the light-emitting unit and the low-concentration fluorescent layer, wherein a width of the high-concentration fluorescent adhesive layer is WH, a width of the low-concentration fluorescent adhesive layer is WL, a width of the light-emitting unit is WE, and the light-emitting device further satisfies the following inequalities;
WE<
WL, WH<
WL; and
0.8<
WH/WE≤
1.2. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A manufacturing method of a light-emitting device, comprising:
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forming a wavelength conversion adhesive layer, wherein the wavelength conversion adhesive layer comprises a low-concentration fluorescent layer and a high-concentration fluorescent layer; providing a plurality of light-emitting units; forming a plurality of trenches in the wavelength conversion adhesive layer to define a plurality of bonding regions between the trenches, wherein in the bonding regions, a width of the high-concentration fluorescent adhesive layer is WH, a width of the low-concentration fluorescent adhesive layer is WL, a width of the light-emitting unit is WE, and the step further satisfies the following inequalities;
WE<
WL, WH<
WL, and 0.8<
WH/WE≤
1.2;respectively bonding the light-emitting units to the high-concentration fluorescent adhesive layers in the bonding regions; forming a reflective protecting element on the wavelength conversion adhesive layer and between the light-emitting units to completely fill the trenches, wherein the reflective protecting element exposes the electrode pads of the light-emitting units; and performing a cutting process along the trenches to form a plurality of light-emitting devices. - View Dependent Claims (10, 11, 12, 13)
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Specification