REDUCED ELECTROMAGNETIC INTERFERENCE POWER MODULE SYSTEMS AND METHODS

• US 20180123476A1
• Filed: 10/27/2016
• Published: 05/03/2018
• Est. Priority Date: 10/27/2016
• Status: Active Grant

• Current Assignee: General Electric Company
• Original Assignee: General Electric Company
• Inventors: Schutten, Michael Joseph, Tao, Fengfeng, Harfman-Todorovic, Maja, Raju, Ravisekhar Nadimpalli, Cioffi, Philip Michael, Stevanovic, Ljubisa Dragoljub
• Granted Patent: US 10,404,186 B2
• Time in Patent Office: Days
• CPC Class Codes: H02M 7/537 using semiconductor devices only, e.g. single switched pulse inverters
• CPC Class Codes: H05K 1/0218 by printed shielding conductors, ground planes or power plane H05K1/0236 takes precedence
• CPC Class Codes: H05K 1/0243 Printed circuits associated with mounted high frequency components
• CPC Class Codes: H05K 3/30 Assembling printed circuits with electric components, e.g. with resistor
• CPC Class Codes: H05K 3/36 Assembling printed circuits with other printed circuits H05K7/142 takes precedence

Abstract

A power module includes an input bus, a switching device, and an output bus. The input bus includes a first coating of a high permeability magnetic conductive material and is configured to receive input direct current (DC) electrical power from an electrical power source. The switching device is electrically coupled to the first input bus, and is configured to selectively connect and disconnect to facilitate converting the input DC electrical power into output alternating current (AC) electrical power. The output bus includes a second coating of the high permeability magnetic conductive material, and is electrically coupled to the first switching device. The output bus is configured to supply the output AC electrical power to an electrical load.

Claims

1. A power module, comprising:

a first input bus configured to receive input direct current (DC) electrical power from an electrical power source, wherein the first input bus comprises a first coating of a high permeability magnetic conductive material;

a first switching device electrically coupled to the first input bus, wherein the first switching device is configured to selectively connect and disconnect to facilitate converting the input DC electrical power into output alternating current (AC) electrical power; and

a first output bus electrically coupled to the first switching device, wherein the first output bus is configured to supply the output AC electrical power to an electrical load and the first output bus comprises a second coating of the high permeability magnetic conductive material.

2. The power module of claim 1, comprising a direct bonded copper (DBC) substrate, wherein the DBC substrate comprises:

a ceramic tile;

a copper layer disposed on a first side of the ceramic tile, wherein the copper layer is configured to electrically couple the first switching device to the first input bus or the first output bus; and

a foil layer disposed on a second side of the ceramic tile, wherein the foil layer is configured to capture an electric field generated by selectively connecting and disconnecting the first switching device.

3. The power module of claim 2, comprising a second switching device, wherein a source and a gate of the second switching device face the DBC substrate, and a drain of the second switching device faces away from the DBC substrate.

4. The power module of claim 1, comprising a circuit board coupled to the first switching device, wherein the circuit board comprises an additional copper plane electrically connected to the first input bus, wherein:

the first switching device is configured to generate an electric field when converting the input DC electrical power into the output AC electrical power that induces a current in the floating copper plane; and

the additional copper plane is configured to direct the current to the first input bus.

5. The power module of claim 1, comprising a first magnetic element disposed about the first input bus.

6. The power module of claim 1, comprising:

a housing disposed about the first switching device; and

a copper layer disposed between the housing and the first switching device.

7. The power module of claim 1, wherein the first and second coatings of the high permeability magnetic conductive material are configured to provide a high resistance to high frequency currents and a low resistance to low frequency currents.

8. The power module of claim 1, wherein the first switching device comprises a silicon carbide semiconductor.

9. A power module, comprising:

an input terminal configured to receive an input electrical power;

an output terminal configured to output an output electrical power from the power module; and

a housing disposed about;

a switching device configured to selectively open and close to facilitate converting the input electrical power into the output electrical power;

a positive input bus terminal and a negative input bus terminal that electrically couples the input terminal to the switching device through the housing;

a first capacitor electrically coupled between the positive input current bus terminal and the negative input current bus terminal;

a second capacitor electrically coupled between ground and the positive input current bus terminal or the negative input current bus terminal; and

a metal flashing disposed on an interior surface of the housing and electrically coupled to the positive input bus terminal or the negative input bus terminal.

10. The power module of claim 9, wherein:

the input terminal is configured to receive direct current (DC) electrical power; and

the output terminal is configured to supply alternating current (AC) electrical power.

11. The power module of claim 9, wherein:

the switching device is configured to generate an electric field when selectively opening and closing; and

the metal flashing is configured to direct a current induced in the metal flashing by the electric field to the positive input current bus terminal or the negative input current bus terminal.

12. The power module of claim 9, comprising a direct bonded copper (DBC) substrate, wherein the DBC substrate comprises:

a ceramic tile;

a copper layer disposed on a first side of the ceramic tile, wherein the copper layer is configured to electrically couple the switching device to the positive input bus terminal, the negative input bus terminal, an output bus terminal, or any combination thereof;

a foil layer disposed on a second side of the ceramic tile, wherein the foil layer is configured to capture an electric field generated by selectively connecting and disconnecting the switching device.

13. The power module of claim 9, comprising a circuit board disposed between the DBC and the switching device, wherein the circuit board comprises an additional copper foil configured to capture an electric field generated by selectively connecting and disconnecting the switching device.

14. The power module of claim 9 wherein the power module comprises:

a DC to AC converter; and

an output bus terminal that electrically couples the switching device to the output terminal through the housing.

15. The power module of claim 9, comprising a first magnetic element disposed about the positive input current bus terminal or the negative input current bus terminal.

16. The power module of claim 9, wherein the positive input current bus terminal and the negative input current bus terminal comprise coatings of a high permeability magnetic conductive material, configured to have a high resistance for high frequency currents and a low resistance for low frequency currents.

17. A method, comprising:

coating a positive input bus terminal and a negative input bus terminal of a power model with a high permeability magnetic conductive material;

electrically coupling the positive input bus terminal and the negative input bus terminal to a switching device in the power module to enable the switching device to selectively connect and disconnect to facilitate converting direct current (DC) electrical power into alternating current (AC) electrical power;

electrically coupling a positive output bus terminal and a negative output bus terminal to the first switching device; and

installing a housing about the switching device, wherein a metal flashing is disposed between the switching device and the housing to enable the metal flashing to capture an electric field generated during operation of the power model and to direct an induced current to the positive input bus terminal, the negative input bus terminal, or both.

18. The method of claim 17, comprising coupling a direct bonded copper (DBC) substrate to the switching device, wherein the DBC substrate comprises:

a ceramic tile;

a copper layer disposed on a first side of the ceramic tile, wherein the copper layer is configured to electrically couple the first switching device to the positive input bus, the negative input bus terminal, the positive output bus terminal, or the negative output bus terminal; and

a foil layer disposed on a second side of the ceramic tile, wherein the foil layer is configured to capture an electric field generated by selectively connecting and disconnecting the first switching device.

19. The method of claim 17, comprising coupling a circuit board to the first switching device, wherein:

the circuit board comprises an additional copper plane electrically connected to the positive input bus terminal, the negative input bus terminal, or both;

the first switching device is configured to generate an electric field when converting the input DC current into the output AC current that induces a current in the additional copper plane; and

the additional copper plane is configured to direct the current to the positive input bus terminal, the negative input bus terminal, or both.

20. The method of claim 17, comprising disposing a magnetic element about the positive input bus terminal, the negative input bus terminal, or both.