CONNECTOR WITH CAPACITIVE CROSSTALK COMPENSATION TO REDUCE ALIEN CROSSTALK

• US 20180131138A1
• Filed: 09/11/2017
• Published: 05/10/2018
• Est. Priority Date: 03/15/2013
• Status: Active Grant

• Current Assignee: CommScope Technologies, LLC (CommScope Holding Company, Inc.), CommScope Connectivity UK Limited (TE Connectivity Limited)
• Original Assignee: CommScope Technologies, LLC (CommScope Holding Company, Inc.), CommScope Connectivity UK Limited (TE Connectivity Limited)
• Inventors: Bopp, Steven Richard, Hammond, JR., Bernard Harold
• Granted Patent: US 10,170,861 B2
• Time in Patent Office: Days
• CPC Class Codes: H01R 13/6466 on substrates, e.g. printed circuit boards [PCB]
• CPC Class Codes: H01R 24/64 for high frequency, e.g. RJ 45
• CPC Class Codes: H01R 4/2433 one part of the base being movable to push the cable into the slot

Abstract

The present disclosure relates to a telecommunications connector having cross-talk compensations, and a method of managing alien crosstalk in such a connector. In one example, the telecommunications connector includes electrical conductors arranged in differential pairs and a circuit board with conductive layers that provide a cross-talk compensation arrangement for applying capacitance between the electrical conductors. The circuit board includes conductive paths that provide capacitive coupling and a conductive plate that intensifies capacitive coupling of the electrical conductors. In another example, the telecommunications connector is used with a twisted pair system. Capacitances applied by the crosstalk compensation arrangement between electrical conductors associated with the pairs are provided such that, for each differential pair, a magnitude of an overall capacitance at a first electrical conductor of a differential pair is approximately equal to a magnitude of an overall capacitance at a second electrical conductor of the differential pair.

Claims

1. A telecommunications connector comprising:

a plurality of electrical conductors arranged in differential pairs;

a circuit board having a plurality of conductive layers, the plurality of conductive layers including a first conductive layer, a second conductive layer and a third conductive layer, the second conductive layer being positioned between the first and third conductive layers, the circuit board including a cross-talk compensation arrangement for applying capacitance between at least some of the electrical conductors, the cross-talk compensation arrangement including a plurality of open-ended conductive paths that provide a first capacitive coupling at a first discrete capacitive coupling location at the first conductive layer and a second capacitive coupling at a second discrete capacitive coupling location at the third conductive layer, the second conductive layer including a conductive plate positioned between the first and second discrete capacitive coupling locations, the conductive plate including a first surface that faces toward the first discrete capacitive coupling location and an opposite second surface that faces toward the second discrete capacitive coupling location, wherein the conductive plate and the first and second discrete capacitive coupling locations are relatively positioned such that;

a) the first surface is adapted to reflect radiant energy from the first discrete capacitive coupling location back towards the first discrete capacitive coupling location to intensify the first capacitive coupling; and

b) the second surface is adapted to reflect radiant energy from the second discrete capacitive coupling location back towards the second discrete capacitive coupling location to intensify the second capacitive coupling.