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Coupling Structure for Inductive Device

  • US 20180131325A1
  • Filed: 01/09/2018
  • Published: 05/10/2018
  • Est. Priority Date: 11/08/2013
  • Status: Active Grant
First Claim
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1. An integrated circuit device comprising:

  • a first inductive device and a second inductive device separated by a first distance; and

    a first continuous conductive material surrounding but electrically separated from both the first inductive device and the second inductive device, wherein the first continuous conductive material renders a mutual inductance between the first inductive device and the second inductive device independent of the first distance.

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