SEMICONDUCTOR DEVICE PACKAGE STRUCTURE

• US 20180138099A1
• Filed: 11/14/2016
• Published: 05/17/2018
• Est. Priority Date: 11/14/2016
• Status: Active Grant

• Current Assignee: Advanced Semiconductor Engineering Inc (ASE Technology Holding Co., Ltd.)
• Original Assignee: Advanced Semiconductor Engineering Inc (ASE Technology Holding Co., Ltd.)
• Inventors: FANG, Yu-An, Chen, Ying-Chung, Huang, Cheng-Ling
• Granted Patent: US 10,446,454 B2
• Time in Patent Office: Days
• CPC Class Codes: B81B 7/0032 Packages or encapsulation processes for packaging MEMS B81C1/00261; packaging of smart-MEMS B81C1/0023
• CPC Class Codes: B81B 7/0061 suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
• CPC Class Codes: B81C 1/00269 Bonding of solid lids or wafers to the substrate
• CPC Class Codes: B81C 1/00309 suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
• CPC Class Codes: H01L 21/6836 Wafer tapes, e.g. grinding or dicing support tapes adhesive tapes in general C09J7/20
• CPC Class Codes: H01L 2221/68331 of passive members, e.g. die mounting substrate
• CPC Class Codes: H01L 23/04 characterised by the shape of the container or parts, e.g. caps, walls
• CPC Class Codes: H01L 23/053 the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container

Abstract

A semiconductor device package comprises a carrier having a through hole. A lid is over the carrier and comprises a first side wall, a second side wall, and a connection wall. The second side wall is opposite the first side wall, and the connection wall is between the first side wall and the second side wall. The lid and the carrier form a plurality of chambers. The first side wall, the second side wall and the connection wall form a space to fluidly connect the plurality of chambers.

Claims

1. A semiconductor device package, comprising:

a carrier having a through hole;

a lid over the carrier, the lid comprising a first side wall, a second side wall opposite the first side wall, and a connection wall extending between the first side wall and the second side wall, the lid and the carrier forming a plurality of chambers, the first side wall, the second side wall and the connection wall forming a space to fluidly connect the plurality of chambers; and

an electronic component in one of the plurality of chambers;

wherein the through hole is configured to expel air or fluid from at least one of the plurality of chambers to an environment.

2. The semiconductor device package of claim 1, wherein the connection wall has a first height and the first side wall has a second height, and the first height is substantially the same as the second height.

5. The semiconductor device package of claim 1, further comprising a top plate over the first side wall, the second side wall and the connection wall, wherein the space is between the connection wall and the top plate.

6. The semiconductor device package of claim 5, further comprising an adhesive between the connection wall and the carrier.

7. The semiconductor device package of claim 1, wherein the through hole is spaced away from a bottom of the connection wall over the carrier by a distance (D2).

8. The semiconductor device package of claim 1, further comprising a third side wall extending between the first side wall and the second side wall, wherein the through hole is spaced away from a bottom of the third side wall over the carrier by a distance (D1).

9. The semiconductor device package of claim 1, wherein the through hole has a width from approximately 80 μ

m to approximately 200 μ

m.

21. The semiconductor device package of claim 1, wherein the plurality of chambers are fluidly in communication with an environment outside the semiconductor device package through the through hole.

24. The semiconductor device package of claim 5, further comprising an adhesive disposed between the top plate and the first side wall and the second side wall.

26. The semiconductor device package of claim 1, further comprising an adhesive disposed between the carrier and a bottom of each of the first and second side walls.

27. The semiconductor device package of claim 1, wherein the carrier and a bottom of the connection wall define a space that is in communication with at least two adjacent ones of the plurality of chambers.

28. The semiconductor device package of claim 27, wherein the space is in communication with the through hole via at least one of the plurality of chambers.

3-4. -4. (canceled)

10. A semiconductor device package, comprising:

a carrier having a through hole;

a lid over the carrier, the lid comprising;

a first side wall;

a second side wall opposite the first side wall;

a third side wall extending between the first side wall and the second side wall;

a fourth side wall opposite the third side wall and extending between the first side wall and the second side wall; and

a connection wall disposed between the third side wall and the fourth side wall and extending between the first side wall and the second side wall, wherein the first side wall, the second side wall, the third side wall, the connection wall, and the carrier form a first chamber, the first side wall, the second side wall, the fourth side wall, the connection wall, and the carrier form a second chamber, the first side wall, the second side wall and the connection wall form a space to fluidly connect the first chamber and the second chamber;

a first electronic component in the first chamber; and

a second electronic component in the second chamber;

wherein the through hole is configured to expel air or fluid from at least one of the first chamber or the second chamber to an environment.

11. The semiconductor device package of claim 10, wherein the connection wall has a first height and the first side wall has a second height, and the first height is substantially the same as the second height.

14. The semiconductor device package of claim 10, further comprising a transparent plate over the first side wall, the second side wall, the third side wall, the fourth side wall, and the connection wall, wherein the space is between the connection wall and the transparent plate.

15. The semiconductor device package of claim 14, further comprising an adhesive between the connection wall and the carrier.

16. The semiconductor device package of claim 10, wherein the through hole is spaced away from a bottom of the connection wall over the carrier by a distance (D2).

17. The semiconductor device package of claim 10, wherein the through hole is away from a bottom of the third side wall over the carrier by a distance (D1).

22. The semiconductor device package of claim 10, wherein the first chamber and the second chamber are fluidly in communication with an environment outside the semiconductor device package through the through hole.

25. The semiconductor device package of claim 14, further comprising an adhesive disposed between the transparent plate and the first side wall, the second side wall, the third side wall, and the fourth side wall.

12-13. -13. (canceled)

18. A semiconductor device package, comprising:

a carrier having a through hole;

a lid over the carrier, the lid comprising a first side wall, a second side wall opposite the first side wall, and a connection wall extending between the first side wall and the second side wall, wherein the lid and the carrier form a first chamber and a second chamber separated from the first chamber by the connection wall, and the through hole extends into the first chamber;

a first electronic component in the first chamber; and

a second electronic component in the second chamber,

wherein the first side wall, the second side wall and the connection wall form a space to fluidly connect the first chamber and the second chamber; and

wherein the through hole is configured to expel air or fluid from at least one of the first chamber or the second chamber to an environment.

19. The semiconductor device package of claim 18, further comprising a transparent plate over the first side wall, the second side wall and the connection wall, wherein the space is between the connection wall and the transparent plate.

23. The semiconductor device package of claim 18, wherein the first chamber and the second chamber are fluidly in communication with an environment outside the semiconductor device package through the through hole.

20. (canceled)