LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF

• US 20180138378A1
• Filed: 10/19/2017
• Published: 05/17/2018
• Est. Priority Date: 10/19/2016
• Status: Active Grant

• Current Assignee: Nichia Corporation
• Original Assignee: Genesis Photonics Inc.
• Inventors: Hung, Chin-Hua, Hung, Cheng-Wei, Lin, Yu-Feng, Chen, Cheng-Chuan
• Granted Patent: US 10,388,838 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 33/0075 comprising nitride compounds
• CPC Class Codes: H01L 33/26 Materials of the light emitting region
• CPC Class Codes: H01L 33/387 with a plurality of electrode regions in direct contact with the semiconductor body and being electrically interconnected by another electrode layer
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/642 characterized by the shape

Abstract

A light-emitting device includes a substrate, a light-emitting component, a translucent layer, an adhesive layer, a reflective layer and translucent encapsulant. The light-emitting component is disposed on the substrate. The adhesive layer is formed between the light-emitting component and the translucent layer. The reflective layer is formed above the substrate and covering a lateral surface of the light-emitting component, a lateral surface of the adhesive layer and a lateral surface of the translucent layer. The translucent encapsulant is formed on the substrate and encapsulating the light-emitting component, the translucent layer and the reflective layer.

Claims

1. A light-emitting device, comprises:

a substrate;

a light-emitting component disposed on the substrate;

a translucent layer;

an adhesive layer formed between the light-emitting component and the translucent layer;

a reflective layer formed above the substrate and covering a lateral surface of the light-emitting component, a lateral surface of the adhesive layer and a lateral surface of the translucent layer; and

a translucent encapsulant formed on the substrate and encapsulating the light-emitting component, the translucent layer and the reflective layer.

2. The light-emitting device according to claim 1, wherein the translucent encapsulant encapsulates a lateral surface of an electrode of the light-emitting component.

3. The light-emitting device according to claim 1, wherein the translucent encapsulant has an arc light-emitting surface extending to the substrate.

4. The light-emitting device according to claim 1, wherein the translucent encapsulant has an arc light-emitting surface and a flat lateral surface connecting the arc light-emitting surface and a lateral surface of the substrate, and the flat lateral surface and the lateral surface of the substrate are substantially flush with each other.

5. The light-emitting device according to claim 1, wherein the reflective layer has a first lateral surface and a second lateral surface, the second lateral surface of the reflective layer is recessed with respect to the first lateral surface, the translucent encapsulant covers the second lateral surface, and a lateral surface of the translucent encapsulant, the first lateral surface of the reflective layer and a lateral surface of the substrate are substantially flush with each other.

6. The light-emitting device according to claim 1, wherein the reflective layer has a first lateral surface extending to the substrate, the translucent encapsulant covers the first lateral surface, and a lateral surface of the translucent encapsulant and the first lateral surface of the reflective layer are substantially flush with each other.

7. The light-emitting device according to claim 1, wherein the light-emitting component, the translucent layer and the reflective layer form a light-emitting chip, the light-emitting device comprises a plurality of the light-emitting chips and a plurality of the translucent encapsulants, the light-emitting chips are disposed on the substrate, and each translucent encapsulant encapsulates the corresponding light-emitting chip.

8. The light-emitting device according to claim 1, wherein the translucent layer is a wavelength conversion layer comprising a high-density phosphor layer and a low-density phosphor layer.

9. The light-emitting device according to claim 1, wherein the translucent layer is a glass layer.

10. The light-emitting device according to claim 1, wherein the reflective layer and the light-emitting component 120 each has a lower surface, the light-emitting component has an electrode disposed the lower surface of the light-emitting component, and the lower surface of the reflective layer and the lower surface of the light-emitting component are substantially flush with each other.

11. A manufacturing method of a light-emitting device, comprises:

providing a substrate and a light-emitting component disposed on the substrate;

providing a translucent layer;

connecting the translucent layer with the light-emitting component by an adhesive layer;

forming a reflective layer above the substrate, wherein the reflective layer covers a lateral surface of the light-emitting component, a lateral surface of the adhesive layer and a lateral surface of the translucent layer; and

forming a translucent encapsulant on the substrate to encapsulate the light-emitting component, the translucent layer and the reflective layer.

12. The manufacturing method according to claim 11, wherein before the step of forming the reflective layer above the substrate, the manufacturing method further comprises:

forming a first singulation path passing through the translucent layer to form the lateral surface of the translucent layer;

wherein after the step of forming the reflective layer above the substrate, the manufacturing method further comprises;

forming a second singulation path passing through the reflective layer to form a light-emitting chip;

disposing the light-emitting chip on the substrate;

wherein in the step of forming the translucent encapsulant on the substrate to encapsulate the light-emitting component, the translucent layer and the reflective layer, the translucent encapsulant encapsulates the light-emitting chip.

13. The manufacturing method according to claim 12, wherein after the step of forming the translucent encapsulant on the substrate to encapsulate the light-emitting component, the translucent layer and the reflective layer, the manufacturing method further comprises:

forming a third singulation path passing through the substrate.

14. The manufacturing method according to claim 12, wherein after the step of forming the translucent encapsulant on the substrate to encapsulate the light-emitting component, the translucent layer and the reflective layer, the manufacturing method further comprises:

forming a third singulation path passing through the translucent encapsulant and the substrate, wherein the translucent encapsulant and the substrate each forms a lateral surface, and the lateral surface of the translucent encapsulant and the lateral surface of the substrate are substantially aligned or flush with each other.

15. The manufacturing method according to claim 11, wherein before the step of forming the reflective layer above the substrate, the manufacturing method further comprises:

forming a first singulation path passing through the reflective layer to form the lateral surface of the reflective layer;

wherein after the step of forming the reflective layer above the substrate, the manufacturing method further comprises;

forming a second singulation path passing through the reflective layer and the adhesive layer to form a light-emitting chip;

disposing the light-emitting chip on the substrate;

wherein in the step of forming the translucent encapsulant on the substrate to encapsulate the light-emitting component, the translucent layer and the reflective layer, the translucent encapsulant encapsulates the light-emitting chip.

16. The manufacturing method according to claim 15, wherein in the step of forming the second singulation path passing through the reflective layer and the adhesive layer to form the light-emitting chip and remove the adhesive layer formed on the lateral surface of the light-emitting component.