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OPTICAL FINGERPRINT SENSOR PACKAGE

  • US 20180144174A1
  • Filed: 12/19/2017
  • Published: 05/24/2018
  • Est. Priority Date: 11/23/2016
  • Status: Abandoned Application
First Claim
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1. An optical fingerprint recognition sensor package comprising:

  • a carrier penetrated with a first cavity, the carrier having a peripheral region surrounding the first cavity, the peripheral region is provided with first conductive pads thereon;

    an image sensor mounted in the first cavity and electrically connected to the first conductive pads by conductive wire bonding;

    at least one LED (light emitting diode) mounted to correspond to the peripheral region of the carrier; and

    a molding compound covering the peripheral region of the carrier, the image sensor, and the at least one LED, and filling the first cavity to fix the image sensor in the first cavity and expose a bottom of the image sensor to an external space.

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