OPTICAL FINGERPRINT SENSOR PACKAGE

• US 20180144174A1
• Filed: 12/19/2017
• Published: 05/24/2018
• Est. Priority Date: 11/23/2016
• Status: Abandoned Application

• Current Assignee: Tron Intelligence Inc.
• Original Assignee: Tron Intelligence Inc.
• Inventors: TZU, DA-CHING, LIN, RUEY-JIANN
• Application Number:
  US15/846,364
• Publication Number:
  US 20180144174A1
• Time in Patent Office: Days
• CPC Class Codes: G06V 40/1318 using electro-optical elements or layers, e.g. electroluminescent sensing
• CPC Class Codes: H01L 2224/16245 the item being metallic
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/29294 with a principal constituent of the material being a liquid not provided for in groups H01L2224/292 - H01L2224/29291
• CPC Class Codes: H01L 2224/29339 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/32227 the layer connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48157 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48177 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/83862 Heat curing
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 24/32 of an individual layer connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 25/165 : Containers
• CPC Class Codes: H01L 25/167 : comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 27/14618 : Containers
• CPC Class Codes: H01L 27/14636 : Interconnect structures
• CPC Class Codes: H01L 27/14678 : Contact-type imagers
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/18165 : of a wire bonded chip
• CPC Class Codes: H01L 31/167 : the light sources and the devices sensitive to radiation all being semiconductor devices characterised by potential barriers
• CPC Class Codes: H05K 1/181 : associated with surface mounted components
• CPC Class Codes: H05K 2201/10106 : Light emitting diode [LED]
• CPC Class Codes: H05K 2201/10151 : Sensor

Abstract

An optical fingerprint sensor package includes a carrier, an image sensor, at least one LED (light emitting diode), and a molding compound. The carrier is penetrated with a first cavity. The carrier has a peripheral region surrounding the first cavity. The peripheral region is provided with first conductive pads thereon. The image sensor is mounted in the first cavity and electrically connected to the first conductive pads by conductive wire bonding. The LED is mounted to correspond to the peripheral region of the carrier. The molding compound covers the peripheral region of the carrier, the image sensor, and the at least one LED, and fills the first cavity to fix the image sensor in the first cavity and expose the bottom of the image sensor to an external space.

Claims

1. An optical fingerprint recognition sensor package comprising:

a carrier penetrated with a first cavity, the carrier having a peripheral region surrounding the first cavity, the peripheral region is provided with first conductive pads thereon;

an image sensor mounted in the first cavity and electrically connected to the first conductive pads by conductive wire bonding;

at least one LED (light emitting diode) mounted to correspond to the peripheral region of the carrier; and

a molding compound covering the peripheral region of the carrier, the image sensor, and the at least one LED, and filling the first cavity to fix the image sensor in the first cavity and expose a bottom of the image sensor to an external space.

2. The optical fingerprint sensor package according to claim 1, wherein the at least one LED is mounted on the peripheral region of the carrier through an adhesive by surface-mount technology (SMT).

3. The optical fingerprint sensor package according to claim 2, wherein the adhesive is a red glue or a silver paste.

4. The optical fingerprint sensor package according to claim 2, wherein a height of a bottom of the at least one LED is higher than a height of a top of the image sensor.

5. The optical fingerprint sensor package according to claim 1, wherein the peripheral region of the carrier is further provided with second conductive pads thereon and penetrated with at least one second cavity, the at least one LED is mounted in the at least one second cavity of the peripheral region, the molding compound fills the at least one second cavity to fix the at least one LED in the at least one second cavity and expose a bottom of the at least one LED to the external space, and the at least one LED is electrically connected to the second conductive pads by conductive wire bonding.

6. The optical fingerprint sensor package according to claim 5, wherein the at least one second cavity further comprises a plurality of second cavities, and the at least one LED further comprises a plurality of LEDs (light emitting diodes) respectively mounted in the plurality of second cavities.

7. The optical fingerprint sensor package according to claim 5, wherein a height of a top of the carrier is higher than a height of a top of the at least one LED.

8. The optical fingerprint sensor package according to claim 1, wherein the carrier is a substrate or a lead frame.

9. The optical fingerprint sensor package according to claim 1, wherein the at least one LED comprises a plurality of LEDs (light emitting diodes).

10. The optical fingerprint sensor package according to claim 1, wherein the at least one LED is an infrared (IR) LED.

11. The optical fingerprint sensor package according to claim 1, wherein the image sensor is a charge-coupled device (CCD) or a complementary metal-oxide-semiconductor (CMOS).