OPTICAL FINGERPRINT SENSOR PACKAGE
First Claim
1. An optical fingerprint recognition sensor package comprising:
- a carrier penetrated with a first cavity, the carrier having a peripheral region surrounding the first cavity, the peripheral region is provided with first conductive pads thereon;
an image sensor mounted in the first cavity and electrically connected to the first conductive pads by conductive wire bonding;
at least one LED (light emitting diode) mounted to correspond to the peripheral region of the carrier; and
a molding compound covering the peripheral region of the carrier, the image sensor, and the at least one LED, and filling the first cavity to fix the image sensor in the first cavity and expose a bottom of the image sensor to an external space.
1 Assignment
0 Petitions
Accused Products
Abstract
An optical fingerprint sensor package includes a carrier, an image sensor, at least one LED (light emitting diode), and a molding compound. The carrier is penetrated with a first cavity. The carrier has a peripheral region surrounding the first cavity. The peripheral region is provided with first conductive pads thereon. The image sensor is mounted in the first cavity and electrically connected to the first conductive pads by conductive wire bonding. The LED is mounted to correspond to the peripheral region of the carrier. The molding compound covers the peripheral region of the carrier, the image sensor, and the at least one LED, and fills the first cavity to fix the image sensor in the first cavity and expose the bottom of the image sensor to an external space.
-
Citations
11 Claims
-
1. An optical fingerprint recognition sensor package comprising:
-
a carrier penetrated with a first cavity, the carrier having a peripheral region surrounding the first cavity, the peripheral region is provided with first conductive pads thereon; an image sensor mounted in the first cavity and electrically connected to the first conductive pads by conductive wire bonding; at least one LED (light emitting diode) mounted to correspond to the peripheral region of the carrier; and a molding compound covering the peripheral region of the carrier, the image sensor, and the at least one LED, and filling the first cavity to fix the image sensor in the first cavity and expose a bottom of the image sensor to an external space. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
-
Specification