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METHOD AND APPARATUS FOR ASSEMBLING AND TESTING A MULTI-INTEGRATED CIRCUIT PACKAGE

  • US 20180144963A1
  • Filed: 11/23/2016
  • Published: 05/24/2018
  • Est. Priority Date: 11/23/2016
  • Status: Active Grant
First Claim
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1. A clamping assembly tray for packaging a semiconductor device, comprising:

  • a frame having a bottom surface and side walls extending from the bottom surface that define a cavity; and

    a compressible member disposed on the bottom surface of the frame within the cavity, where a top portion of the compressible member provides a support surface for supporting the semiconductor device, the support surface being between the bottom surface and a top edge of the side walls.

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