NON-RECIPROCAL CIRCUIT ELEMENT, MANUFACTURING METHOD THEREFOR, AND COMMUNICATION DEVICE

• US 20180145389A1
• Filed: 03/17/2016
• Published: 05/24/2018
• Est. Priority Date: 03/25/2015
• Status: Active Grant

• Current Assignee: NEC Corporation
• Original Assignee: NEC Corporation
• Inventors: OGASAWARA, Tadayuki
• Granted Patent: US 10,601,097 B2
• Time in Patent Office: Days
• CPC Class Codes: H01P 1/38 Circulators
• CPC Class Codes: H01P 1/387 Strip line circulators
• CPC Class Codes: H01P 11/00 Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
• CPC Class Codes: H04B 1/40 Circuits

Abstract

The present invention addresses the problem of suppressing variation in the distance between a ferrimagnetic body and the side part of a conductive body cover, thereby suppressing variation in the reflection characteristic and isolation. Therefore, the present invention provides a non-reciprocal circuit element equipped with: a conductive cover provided on a substrate and covering a ferrimagnetic body provided on the substrate; the ferrimagnetic body, on at least the portion of which opposing the side part of the conductive body cover is formed a dielectric body that contacts or substantially contacts the side part of the conductive body cover; and a conductive body part provided on the substrate. Furthermore, the non-reciprocal circuit element is equipped with multiple connecting parts electrically connecting the conductive body part and each of multiple signal transmission wires on the substrate.

Claims

1. A non-reciprocal circuit element including:

a ferrimagnetic body that is provided on a base body and to which a magnetic field is applied;

a dielectric body that is formed on at least a part of a ferrimagnetic body side part that is a side part of the ferrimagnetic body;

a conductive body cover that covers the ferrimagnetic body, and makes contact with the dielectric body at a conductive body cover side part that is a portion of the conductive body cover, opposing the ferrimagnetic body side part;

a conductive body part that is provided on the base body; and

a plurality of connecting parts that electrically connect each of a plurality of signal transmission lines on the base body with the conductive body part.

2. The non-reciprocal circuit element according to claim 1, wherein the dielectric body is a dielectric body film.

3. The non-reciprocal circuit element according to claim 1, wherein the conductive body cover includes a plurality of conductive body cover side parts, and each of the plurality of conductive body cover side parts is in contact or substantial contact with the dielectric body opposing each of the plurality of conductive body cover side parts.

4. The non-reciprocal circuit element according to claim 1, wherein the dielectric body is formed in a substantially uniform manner.

5. The non-reciprocal circuit element according to claim 1, wherein the conductive body part also serves as the conductive body cover.

6. The non-reciprocal circuit element according to claim 1, wherein the conductive body cover is formed as a single body.

7. The non-reciprocal circuit element according to claim 1, wherein

the ferrimagnetic body is provided on a first face of the base body, and

the magnet is provided on a second face side of the base body, opposing the first face.

8. The non-reciprocal circuit element according to claim 1, wherein the dielectric body and the conductive body cover side part are firmly adhered to each other.

9. A communication device including:

a sending circuit that sends a high frequency signal;

a transferring circuit that includes the non-reciprocal circuit element according to claim 1, and transfers a high frequency signal from the sending circuit; and

a receiving circuit that receives the high frequency signal from the transferring circuit.

17. The non-reciprocal circuit element according to claim 1, wherein the conductive body cover side part is formed directly on the dielectric body.

18. The non-reciprocal circuit element according to claim 1, wherein the dielectric body is formed by a process of performing spray of a raw material for the dielectric body while rotating the ferrimagnetic body.

19. The non-reciprocal circuit element according to claim 1, wherein the conductive body cover side part is formed by a process including a process of spraying a raw material for the conductive body cover side part to a portion on which the conductive body cover side part is scheduled to be formed.

20. The non-reciprocal circuit element according to claim 1, wherein the conductive body cover side part is formed by a process including any one of vapor deposition, sputtering, and plating of a raw material for the conductive body cover side part on the dielectric body.

10. A method of manufacturing a non-reciprocal circuit element, including:

forming a conductive body cover for covering an upper face of a ferrimagnetic body;

forming a dielectric-body-attached ferrimagnetic body, by forming a dielectric body on at least a face of the ferrimagnetic body, opposing a side part of the conductive body cover;

providing, on a substrate, the dielectric-body-attached ferrimagnetic body, and the conductive body cover that covers an upper face of the dielectric-body-attached ferrimagnetic body, and is electrically connected with each of a plurality of signal transmission lines on the substrate; and

providing a magnet at a position for applying a magnetic field to the ferrimagnetic body.

11. The method of manufacturing a non-reciprocal circuit element, according to claim 10, wherein formation of the dielectric body is performed with spray of a raw material for the dielectric body while rotating the ferrimagnetic body.

12. A method of manufacturing a non-reciprocal circuit element, including:

providing a ferrimagnetic body on a base body;

forming a dielectric body on at least a part of a ferrimagnetic body side part that is a side part of the ferrimagnetic body; and

forming a conductive body cover side part that is a portion of a conductive body cover covering the ferrimagnetic body, opposing the ferrimagnetic body side part in such a way as to make contact with the dielectric body.

13. The method of manufacturing a non-reciprocal circuit element, according to claim 12, wherein the forming in such a way as to make contact is forming the conductive body cover side part directly on the dielectric body.

14. The method of manufacturing a non-reciprocal circuit element, according to claim 12, wherein the forming in such a way as to make contact includes a spraying a raw material for the conductive body cover side part to the dielectric body.

15. The method of manufacturing a non-reciprocal circuit element, according to claim 12, wherein the forming in such a way as to make contact is forming by using any one of vapor deposition, sputtering, and plating of a raw material for the conductive body cover side part on the dielectric body.

16. The method of manufacturing a non-reciprocal circuit element, according to claim 12, wherein the forming in such a way as to make contact is removing a raw material for the conductive body cover side part or an object formed from the raw material, by forming a to-be-removed object that is scheduled to be removed by a subsequent process at a portion on the ferrimagnetic material, on which the conductive body cover side part is not scheduled to be formed, forming the raw material thereon, and thereafter removing the to-be-removed object.