DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF

• US 20180146555A1
• Filed: 10/30/2017
• Published: 05/24/2018
• Est. Priority Date: 11/21/2016
• Status: Active Grant

• Current Assignee: InnoLux Corporation
• Original Assignee: InnoLux Corporation
• Inventors: Kuo, Chin-Cheng, Yang, Chia-Chun, Huang, Wen-Cheng
• Granted Patent: US 10,531,563 B2
• Time in Patent Office: Days
• CPC Class Codes: H05K 1/148 Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 2201/041 Stacked PCBs, i.e. having neither an empty space nor mounted components in between
• CPC Class Codes: H05K 2201/09027 Non-rectangular flat PCB, e.g. circular
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2201/10128 Display
• CPC Class Codes: H05K 2201/10522 Adjacent components
• CPC Class Codes: H05K 2203/0126 Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: H05K 3/303 Surface mounted components, e.g. affixing before soldering, aligning means, spacing means H05K3/32 takes precedence
• CPC Class Codes: H05K 3/361 Assembling flexible printed circuits with other printed circuits

Abstract

A display device and a manufacturing method thereof are provided. The display device includes a first substrate, a second substrate, a drive IC and a protection layer. The first substrate has a first region and a second region. The second substrate is correspondingly disposed on the first region. The drive IC is disposed on the second region. The protection layer is disposed enclosing the drive IC, and the protection layer has a maximum height larger than the height of the drive IC.

Claims

1. A display device, comprising:

a first substrate having a first region and a second region;

a second substrate correspondingly disposed on the first region;

a drive IC disposed on the second region; and

a protection layer disposed on the second region, wherein the protection layer is disposed enclosing the drive IC, and the protection layer has a maximum height larger than a maximum height of the drive IC.

2. The display device according to claim 1, wherein a top surface of the protection layer is higher than a top surface of the drive IC, a distance between the top surface of the protection layer and the top surface of the drive IC in a normal direction of the first substrate ranges from 0.01 mm to 0.35 mm.

3. The display device according to claim 2, wherein at least part of the top surface of the protection layer is curved.

4. The display device according to claim 2, wherein the protection layer covers at least part of the top surface of the drive IC.

5. The display device according to claim 1, wherein the protection layer comprises a recess corresponding to the driver IC.

6. The display device according to claim 1, wherein the protection layer comprises adhesives, epoxy resin or polyurethane.

7. The display device according to claim 1, further comprising:

a flexible circuit board and a printed circuit board, the drive IC is electrically connected to the printed circuit board through the flexible circuit board, and the flexible circuit board is disposed between the printed circuit board and the drive IC.

8. The display device according to claim 7, wherein the protection layer covers a portion of the flexible circuit board.

9. The display device according to claim 1, further comprising:

a plurality of drive ICs, a printed circuit board and a plurality of flexible circuit boards, the drive ICs are electrically connected to the printed circuit board through the flexible circuit boards, and the flexible circuit boards and the drive ICs are staggeredly disposed on the first substrate and along an extending direction of one lateral side of the second substrate.

10. The display device according to claim 1, further comprising:

a conductive adhesive layer disposed above the drive IC and the protection layer, wherein the conductive adhesive layer has a terminal portion disposed on the second substrate; and

an insulating layer disposed between the conductive adhesive layer and the protection layer, wherein the insulating layer and the protection layer are separated by a gap.

11. The display device according to claim 10, wherein the gap ranges from 0.01 mm to 0.25 mm.

12. The display device according to claim 1, further comprising:

a conductive adhesive layer disposed above the drive IC and the protection layer, wherein the conductive adhesive layer has a terminal portion disposed on the second substrate; and

an insulating layer disposed between the conductive adhesive layer and the protection layer, wherein the insulating layer contacts the protection layer.

13. A manufacturing method of a display device, comprising:

providing a first substrate having a first region and a second region;

disposing a second substrate on the first substrate, wherein the second substrate is disposed on the first substrate and overlapping the first region;

disposing a drive IC on the second region; and

disposing a protection layer on the second region, wherein the protection layer is disposed enclosing the drive IC, and the protection layer has a maximum height larger than a maximum height of the drive IC.

14. The manufacturing method of the display device according to claim 13, wherein disposing the protection layer on the second region of the first substrate comprises:

coating an adhesive in the second region.

15. The manufacturing method of the display device according to claim 13, further comprising:

disposing a plurality of drive ICs on the second region wherein the drive ICs are arranged along an extending direction of one lateral side of the second substrate;

disposing an adhesive on the first substrate, wherein the adhesive is disposed between the drive ICs and the second substrate; and

disposing the adhesive on the first substrate, wherein the adhesive is disposed on a side of the drive IC opposite to the second substrate.

16. The manufacturing method of the display device according to claim 13, wherein a shape of the second substrate is non-rectangular, the drive ICs are arranged along an extending direction of one lateral side of the second substrate, and the extending direction varies according to the shape of the second substrate edge.

17. The manufacturing method of the display device according to claim 13, wherein a top surface of the protection layer is higher than a top surface of the drive IC, a distance is between the top surface of the protection layer and the top surface of the drive IC in a normal direction of first substrate, and the distance ranges from 0.01 mm to 0.35 mm.

18. The manufacturing method of the display device according to claim 14, wherein at least part of the top surface of the protection layer is curved.

19. The manufacturing method of the display device according to claim 14, wherein the protection layer covers at least part of the top surface of the drive IC.

20. The manufacturing method of the display device according to claim 13, wherein the protection layer comprises a recess corresponding to the driver IC.