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SEMICONDUCTOR PACKAGE AND A METHOD OF MANUFACTURING THE SAME

  • US 20180151465A1
  • Filed: 04/19/2017
  • Published: 05/31/2018
  • Est. Priority Date: 11/30/2016
  • Status: Active Application
First Claim
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1. A method to manufacture a semiconductor package, comprising:

  • preparing a metal substrate;

    attaching semiconductor dies to the metal substrate at an interval;

    attaching a bonding film to the semiconductor dies;

    applying a mold material on the semiconductor dies and the metal substrate, and curing the mold material to form a mold member;

    grinding the mold member and the metal substrate to a thickness;

    removing the bonding film;

    attaching a redistribution layer to the semiconductor dies; and

    cutting between the semiconductor dies.

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