SEMICONDUCTOR PACKAGE AND A METHOD OF MANUFACTURING THE SAME
First Claim
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1. A method to manufacture a semiconductor package, comprising:
- preparing a metal substrate;
attaching semiconductor dies to the metal substrate at an interval;
attaching a bonding film to the semiconductor dies;
applying a mold material on the semiconductor dies and the metal substrate, and curing the mold material to form a mold member;
grinding the mold member and the metal substrate to a thickness;
removing the bonding film;
attaching a redistribution layer to the semiconductor dies; and
cutting between the semiconductor dies.
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Accused Products
Abstract
A method to manufacture a semiconductor package includes: preparing a metal substrate; attaching semiconductor dies to the metal substrate at an interval; attaching a bonding film to the semiconductor dies; applying a mold material on the semiconductor dies and the metal substrate, and curing the mold material to form a mold member; grinding the mold member and the metal substrate to a thickness; removing the bonding film; attaching a redistribution layer to the semiconductor dies; and cutting between the semiconductor dies.
3 Citations
20 Claims
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1. A method to manufacture a semiconductor package, comprising:
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preparing a metal substrate; attaching semiconductor dies to the metal substrate at an interval; attaching a bonding film to the semiconductor dies; applying a mold material on the semiconductor dies and the metal substrate, and curing the mold material to form a mold member; grinding the mold member and the metal substrate to a thickness; removing the bonding film; attaching a redistribution layer to the semiconductor dies; and cutting between the semiconductor dies. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A semiconductor package, comprising:
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a semiconductor die comprising a first surface and a second surface; a redistribution layer attached to the first surface and extending outside of an outer periphery of the semiconductor die; a metal substrate attached to the second surface; and a mold member surrounding sides of the semiconductor die, and disposed on the metal substrate. - View Dependent Claims (11, 12, 13, 14, 15)
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16. A method to manufacture a semiconductor package, comprising:
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attaching semiconductor dies to a first side of a metal substrate so that the semiconductor dies are spaced apart on the first side; forming a mold member in areas between the semiconductor dies and on the metal substrate; grinding the mold member and the metal substrate to reduce a thickness of the mold member and the metal substrate; attaching a redistribution layer to the semiconductor dies; and cutting in an area between adjacent semiconductor dies among the semiconductor dies to separate the adjacent semiconductor dies. - View Dependent Claims (17, 18, 19, 20)
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Specification