Air Cooled Wireless Charging Pad
First Claim
Patent Images
1. A charging pad comprising:
- a housing having a magnetics assembly housing part and an electronics assembly housing part;
an interface layer within the housing, the interface layer having a top side and a bottom side;
a magnetics assembly arranged below the bottom side of the interface layer within the magnetics assembly housing part; and
an electronics assembly arranged above the top side of the interface layer within the electronics assembly housing part.
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Accused Products
Abstract
A charging pad includes a housing, an interface layer, a magnetics assembly, and an electronics assembly. The housing has a magnetics assembly housing part and an electronics assembly housing part. The interface layer is within the housing. The magnetics assembly is arranged below the interface layer within the magnetics assembly housing part and the electronics assembly is arranged above the interface layer within the electronics assembly housing part.
17 Citations
20 Claims
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1. A charging pad comprising:
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a housing having a magnetics assembly housing part and an electronics assembly housing part; an interface layer within the housing, the interface layer having a top side and a bottom side; a magnetics assembly arranged below the bottom side of the interface layer within the magnetics assembly housing part; and an electronics assembly arranged above the top side of the interface layer within the electronics assembly housing part. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A charging pad for an electric vehicle, comprising:
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a magnetics assembly to wirelessly receive power from a charging source; an electronics assembly to convert the power wirelessly received by the magnetics assembly into electrical power for charging the electric vehicle; an interface layer separating the magnetics assembly and the electronics assembly; a magnetics assembly housing part having a floor portion spaced apart from the interface layer; an electronics assembly housing part having a ceiling portion spaced apart from the interface layer; wherein the magnetics assembly is arranged within the magnetics assembly housing part and is attached to the floor portion of the magnetics assembly housing part whereby heat generated by the magnetic assembly thermally conducts from the floor portion of the magnetics assembly housing part into an external environment; and wherein the electronics assembly is arranged within the electronics assembly housing part and is attached to the ceiling portion of the electronics assembly housing part whereby heat generated by the electronics assembly thermally conducts from the ceiling portion of the electronics assembly housing part into the external environment. - View Dependent Claims (15, 16, 17, 18, 19, 20)
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Specification