BONDING APPARATUS, BONDING SYSTEM, BONDING METHOD AND STORAGE MEDIUM

• US 20180158796A1
• Filed: 11/27/2017
• Published: 06/07/2018
• Est. Priority Date: 12/01/2016
• Status: Active Grant

• Current Assignee: Tokyo Electron Limited
• Original Assignee: Tokyo Electron Limited
• Inventors: OTSUKA, Yoshitaka, NAKAMITSU, Takashi, OMORI, Yosuke, SUGAKAWA, Kenji
• Granted Patent: US 10,438,920 B2
• Time in Patent Office: Days
• CPC Class Codes: B32B 15/01 all layers being exclusively metallic making layered metal workpieces by pressure cladding B23K20/22; making coatings with a metallic material characterised by its composition C23C30/00
• CPC Class Codes: B32B 2041/04 Detecting wrong registration, misalignment, deviation, failure
• CPC Class Codes: B32B 2457/14 Semiconductor wafers
• CPC Class Codes: B32B 37/0046 characterised by constructional aspects of the apparatus
• CPC Class Codes: B32B 37/10 characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
• CPC Class Codes: B32B 41/00 Arrangements for controlling or monitoring lamination processes; Safety arrangements
• CPC Class Codes: H01L 21/187 by direct bonding
• CPC Class Codes: H01L 21/2007 Bonding of semiconductor wafers to insulating substrates or to semiconducting substrates using an intermediate insulating layer H01L21/2011 takes precedence; bonding of semiconductor wafers to semiconductor wafers for junction formation H01L21/187
• CPC Class Codes: H01L 21/67092 Apparatus for mechanical treatment or grinding or cutting, see the relevant groups in subclasses B24B or B28D
• CPC Class Codes: H01L 21/67253 Process monitoring, e.g. flow or thickness monitoring
• CPC Class Codes: H01L 21/67259 Position monitoring, e.g. misposition detection or presence detection
• CPC Class Codes: H01L 21/67742 Mechanical parts of transfer devices robots in general in B25J
• CPC Class Codes: H01L 21/68 for positioning, orientation or alignment
• CPC Class Codes: H01L 21/6838 with gripping and holding devices using a vacuum; Bernoulli devices
• CPC Class Codes: H01L 2224/7515 Means for applying permanent coating, e.g. in-situ coating
• CPC Class Codes: H01L 2224/753 by means of pressure
• CPC Class Codes: H01L 2224/75302 Shape
• CPC Class Codes: H01L 2224/75305 comprising protrusions
• CPC Class Codes: H01L 2224/7531 of other parts
• CPC Class Codes: H01L 2224/7555 Mechanical means, e.g. for planarising, pressing, stamping
• CPC Class Codes: H01L 2224/7565 : Means for transporting the components to be connected
• CPC Class Codes: H01L 2224/75744 : in the lower part of the bonding apparatus, e.g. in the apparatus chuck
• CPC Class Codes: H01L 2224/75745 : in the upper part of the bonding apparatus, e.g. in the bonding head
• CPC Class Codes: H01L 2224/75901 : using a computer, e.g. fully- or semi-automatic bonding
• CPC Class Codes: H01L 2224/75981 : Apparatus chuck
• CPC Class Codes: H01L 2224/75986 : Auxiliary members on the pressing surface
• CPC Class Codes: H01L 2224/80009 : Pre-treatment of the bonding area
• CPC Class Codes: H01L 2224/80013 : Plasma cleaning
• CPC Class Codes: H01L 2224/80201 : Compression bonding
• CPC Class Codes: H01L 2224/80894 : Direct bonding, i.e. joining surfaces by means of intermolecular attracting interactions at their interfaces, e.g. covalent bonds, van der Waals forces
• CPC Class Codes: H01L 2224/80908 : involving monitoring, e.g. feedback loop
• CPC Class Codes: H01L 2224/83009 : Pre-treatment of the layer connector or the bonding area
• CPC Class Codes: H01L 2224/83201 : Compression bonding
• CPC Class Codes: H01L 2224/83894 : Direct bonding, i.e. joining surfaces by means of intermolecular attracting interactions at their interfaces, e.g. covalent bonds, van der Waals forces
• CPC Class Codes: H01L 2224/83908 : involving monitoring, e.g. feedback loop
• CPC Class Codes: H01L 24/75 : Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 24/80 : Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
• CPC Class Codes: H01L 24/83 : using a layer connector

Abstract

There is provided a bonding apparatus for bonding substrates together, which includes: a first holding part configured to adsorptively hold a first substrate by vacuum-drawing the first substrate on a lower surface of the first substrate; a second holding part provided below the first holding part and configured to adsorptively hold a second substrate by vacuum-drawing the second substrate on an upper surface of the second substrate; a pressing member provided in the first holding part and configured to press a central portion of the first substrate; and a plurality of substrate detection parts provided in the first holding part and configured to detect a detachment of the first substrate from the first holding part.

Claims

1. A bonding apparatus for bonding substrates together, comprising:

a first holding part configured to adsorptively hold a first substrate by vacuum-drawing the first substrate on a lower surface of the first substrate;

a second holding part provided below the first holding part and configured to adsorptively hold a second substrate by vacuum-drawing the second substrate on an upper surface of the second substrate;

a pressing member provided in the first holding part and configured to press a central portion of the first substrate; and

a plurality of substrate detection parts provided in the first holding part and configured to detect a detachment of the first substrate from the first holding part.

2. The bonding apparatus of claim 1, wherein the plurality of substrate detection parts are configured to irradiate a light onto the first substrate and to measure a reception amount of a reflected light reflected at the first substrate.

3. The bonding apparatus of claim 1, wherein the plurality of substrate detection parts are configured to measure an electrostatic capacitance between the substrate detection parts and the first substrate.

4. The bonding apparatus of claim 1, wherein the plurality of substrate detection parts are configured to measure a distance between the first holding part and the first substrate.

5. The bonding apparatus of claim 1, wherein the plurality of substrate detection parts are provided in the first holding part in a concentric relationship with the first holding part.

6. The bonding apparatus of claim 5, wherein the plurality of substrate detection parts are provided on at least one of a plurality of circumferences of the first holding part.

7. The bonding apparatus of claim 1, wherein the first holding part includes a plurality of suction portions configured to make contact with the first substrate and to adsorb the first substrate by vacuum-drawing the first substrate, and

the bonding apparatus further comprises a control part configured to control the plurality of suction portions based on a detection result of the plurality of substrate detection parts.

8. The bonding apparatus of claim 7, wherein the control part is configured to calculate a time difference between a timing at which one of the plurality of substrate detection parts detects the detachment of the first substrate and a timing at which another of the plurality of substrate detection parts detects the detachment of the first substrate, and is configured to control the plurality of suction portions so that the time difference falls within a predetermined threshold value.

9. The bonding apparatus of claim 1, further comprising:

a displacement meter configured to measure a displacement of the pressing member.

10. A bonding system provided with the bonding apparatus of claim 1, comprising:

a processing station provided with the bonding apparatus; and

a loading/unloading station configured to hold a plurality of first substrates, a plurality of second substrates or a plurality of laminated substrates each of which is obtained by bonding the first substrate and the second substrate, and configured to load and unload the plurality of first substrates, the plurality of second substrates or the plurality of laminated substrates into and from the processing station,

wherein the processing station includes;

a surface modifying apparatus configured to modify a surface of the first substrate or the second substrate to be bonded;

a surface hydrophilizing apparatus configured to hydrophilize the surface of the first substrate or the surface of the second substrate modified by the surface modifying apparatus; and

a transfer device configured to transfer the plurality of first substrates, the plurality of second substrates or the plurality of laminated substrates to the surface modifying apparatus, the surface hydrophilizing apparatus and the bonding apparatus, and

wherein the bonding apparatus is configured to bond the first substrate and the second substrate whose surfaces are hydrophilized by the surface hydrophilizing apparatus.

11. A bonding method for bonding substrates together, comprising:

arranging a first substrate held on a lower surface of a first holding part and a second substrate held on an upper surface of a second holding part so as to face each other;

subsequently, lowering a pressing member provided in the first holding part and configured to press a central portion of the first substrate, and causing the pressing member to press and bring the central portion of the first substrate and a central portion of the second substrate into contact with each other; and

subsequently, sequentially bonding the first substrate and the second substrate from the central portion of the first substrate toward an outer peripheral portion of the first substrate in a state in which the central portion of the first substrate and the central portion of the second substrate are in contact with each other,

wherein the bonding the first substrate and the second substrate includes detecting a detachment of the first substrate from the first holding part and inspecting a state of a bonding process, using a plurality of substrate detection parts provided in the first holding part.

12. The bonding method of claim 11, wherein the plurality of substrate detection parts are configured to irradiate a light onto the first substrate and to measure a reception amount of a reflected light reflected at the first substrate.

13. The bonding method of claim 11, wherein the plurality of substrate detection parts are configured to measure an electrostatic capacitance between the plurality of substrate detection parts and the first substrate.

14. The bonding method of claim 11, wherein the plurality of substrate detection parts are configured to measure a distance between the first holding part and the first substrate.

15. The bonding method of claim 11, wherein the first holding part includes a plurality of suction portions configured to make contact with the first substrate and to adsorptively hold the first substrate by vacuum-drawing the first substrate, and

the plurality of suction portions is controlled based on detection results of the plurality of substrate detection parts.

16. The bonding method of claim 15, further including:

calculating a time difference between a timing at which one of the plurality of substrate detection parts detects the detachment of the first substrate and a timing at which another of the plurality of substrate detection parts detects the detachment of the first substrate, and controlling the plurality of suction portions so that the time difference falls within a predetermined threshold value.

17. The bonding method of claim 11, wherein the bonding the first substrate and the second substrate further includes measuring a displacement of the pressing member by a displacement meter, and inspecting a state of a bonding process based on a measurement result obtained by the displacement meter and detection results obtained by the plurality of substrate detection parts.

18. A non-transitory computer-readable storage medium storing a program that operates on a computer of a control part configured to control a bonding apparatus so that the bonding method of claim 11 is executed by the bonding apparatus.