BONDING APPARATUS, BONDING SYSTEM, BONDING METHOD AND STORAGE MEDIUM
First Claim
1. A bonding apparatus for bonding substrates together, comprising:
- a first holding part configured to adsorptively hold a first substrate by vacuum-drawing the first substrate on a lower surface of the first substrate;
a second holding part provided below the first holding part and configured to adsorptively hold a second substrate by vacuum-drawing the second substrate on an upper surface of the second substrate;
a pressing member provided in the first holding part and configured to press a central portion of the first substrate; and
a plurality of substrate detection parts provided in the first holding part and configured to detect a detachment of the first substrate from the first holding part.
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Accused Products
Abstract
There is provided a bonding apparatus for bonding substrates together, which includes: a first holding part configured to adsorptively hold a first substrate by vacuum-drawing the first substrate on a lower surface of the first substrate; a second holding part provided below the first holding part and configured to adsorptively hold a second substrate by vacuum-drawing the second substrate on an upper surface of the second substrate; a pressing member provided in the first holding part and configured to press a central portion of the first substrate; and a plurality of substrate detection parts provided in the first holding part and configured to detect a detachment of the first substrate from the first holding part.
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Citations
18 Claims
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1. A bonding apparatus for bonding substrates together, comprising:
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a first holding part configured to adsorptively hold a first substrate by vacuum-drawing the first substrate on a lower surface of the first substrate; a second holding part provided below the first holding part and configured to adsorptively hold a second substrate by vacuum-drawing the second substrate on an upper surface of the second substrate; a pressing member provided in the first holding part and configured to press a central portion of the first substrate; and a plurality of substrate detection parts provided in the first holding part and configured to detect a detachment of the first substrate from the first holding part. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A bonding method for bonding substrates together, comprising:
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arranging a first substrate held on a lower surface of a first holding part and a second substrate held on an upper surface of a second holding part so as to face each other; subsequently, lowering a pressing member provided in the first holding part and configured to press a central portion of the first substrate, and causing the pressing member to press and bring the central portion of the first substrate and a central portion of the second substrate into contact with each other; and subsequently, sequentially bonding the first substrate and the second substrate from the central portion of the first substrate toward an outer peripheral portion of the first substrate in a state in which the central portion of the first substrate and the central portion of the second substrate are in contact with each other, wherein the bonding the first substrate and the second substrate includes detecting a detachment of the first substrate from the first holding part and inspecting a state of a bonding process, using a plurality of substrate detection parts provided in the first holding part. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18)
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Specification