MICROSCALE SENSOR STRUCTURE WITH BACKSIDE CONTACTS AND PACKAGING OF THE SAME
First Claim
1. A microscale sensor comprising:
- a device layer having a front side and a back side;
a support substrate at the back side of the device layer, the support substrate having contact openings for accessing a conductive backside surface at the back side of the device layer,wherein electrical connection to the device layer is not formed with a through-wafer via.
1 Assignment
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Accused Products
Abstract
A microscale sensor structure is provided that enables backside electrical connection to flush-mounted microscale sensors without through-wafer-vias (TWVs). A flush-mounted microscale sensor can be fabricated without TWVs by providing a sensor support substrate with openings for electrical connection access to the backside of a device layer. Backside electrical connection is made to the sensing element(s) of the device layer through the openings in the support substrate. Electrical isolation of the sensing element(s) from the support substrate is accomplished through use of an insulating support substrate and/or an insulating layer between the support substrate and the device layer.
5 Citations
20 Claims
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1. A microscale sensor comprising:
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a device layer having a front side and a back side; a support substrate at the back side of the device layer, the support substrate having contact openings for accessing a conductive backside surface at the back side of the device layer, wherein electrical connection to the device layer is not formed with a through-wafer via. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification