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MICROSCALE SENSOR STRUCTURE WITH BACKSIDE CONTACTS AND PACKAGING OF THE SAME

  • US 20180159017A1
  • Filed: 12/04/2017
  • Published: 06/07/2018
  • Est. Priority Date: 12/06/2016
  • Status: Active Grant
First Claim
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1. A microscale sensor comprising:

  • a device layer having a front side and a back side;

    a support substrate at the back side of the device layer, the support substrate having contact openings for accessing a conductive backside surface at the back side of the device layer,wherein electrical connection to the device layer is not formed with a through-wafer via.

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