Pressure-sensitive adhesive strip

• US 20180163099A1
• Filed: 08/11/2017
• Published: 06/14/2018
• Est. Priority Date: 12/09/2016
• Status: Abandoned Application

• Current Assignee: Tesa SE (maxingvest GmbH & Co. KGaA)
• Original Assignee: Tesa SE (maxingvest GmbH & Co. KGaA)
• Inventors: BLAZEJEWSKI, Anna, BURMEISTER, Axel, PETERSEN, Anika
• Application Number:
  US15/674,801
• Publication Number:
  US 20180163099A1
• Time in Patent Office: Days
• CPC Class Codes: B32B 5/20 foamed in situ
• CPC Class Codes: C08K 9/10 Encapsulated ingredients
• CPC Class Codes: C08L 2203/20 use in electrical or conductive gadgets
• CPC Class Codes: C08L 2205/20 Hollow spheres
• CPC Class Codes: C08L 53/02 of vinyl-aromatic monomers and conjugated dienes
• CPC Class Codes: C08L 91/00 Compositions of oils, fats or waxes; Compositions of derivatives thereof
• CPC Class Codes: C09J 153/02 Vinyl aromatic monomers and conjugated dienes
• CPC Class Codes: C09J 2203/326 for bonding electronic components such as wafers, chips or semiconductors
• CPC Class Codes: C09J 2301/408 additives as essential feature of the adhesive layer
• CPC Class Codes: C09J 2301/412 presence of microspheres
• CPC Class Codes: C09J 2467/006 in the substrate
• CPC Class Codes: C09J 7/387 Block-copolymers

Abstract

The invention relates to a pressure-sensitive adhesive strip comprising at least one layer SK1, preferably exactly one layer SK1, of a self-adhesive composition based on a vinylaromatic block copolymer composition foamed with microballoons, where the mean diameter of the voids formed by the microballoons in the self-adhesive composition layer SK1 is 45 to 110 μm.

Claims

1. A pressure-sensitive adhesive strip comprising a layer SK1, of a self-adhesive composition based on a vinylaromatic block copolymer composition foamed with microballoons, where voids formed by the microballoons in layer SK1 have a mean diameter of 45 to 110 μ

m.

2. The pressure-sensitive adhesive strip as claimed in claim 1,

consisting of layer SK1.

3. The pressure-sensitive adhesive strip as claimed in claim 2, wherein

layer SK1 has a thickness of 45 to 5000 μ

m.

4. The pressure-sensitive adhesive strip as claimed in claim 1,

further comprising a layer F of a film carrier, where layer SK1 is arranged on a surfaces of layer F.

5. The pressure-sensitive adhesive strip as claimed in claim 4,

further comprising a layer SK2 composed of a self-adhesive composition based on a vinylaromatic block copolymer composition arranged on an opposite surface of layer F from the layer SK1.

6. The pressure-sensitive adhesive strip as claimed in claim 4, wherein

the film carrier layer has a thickness between 5 and 125 μ

m.

and layer SK1 and layer SK2, when present, independently have a thickness between 45 and 1000 μ

m.

7. The pressure-sensitive adhesive strip as claimed in claim 5,

having a symmetric construction with respect to-layer composition, in that the foamed vinylaromatic block copolymer compositions of layers SK1 and SK2 are chemically identical.

8. The pressure-sensitive adhesive strip as claimed in claim 5,

having a structurally symmetric construction, in that layers SK1 and SK2 are of the same thickness and/or have the same density.

9. The pressure-sensitive adhesive strip as claimed in claim 1, wherein

layer SK1 is based on vinylaromatic block copolymers comprising polymer blocks (i) predominantly formed from vinylaromatics (A blocks), and (ii) predominantly formed by polymerization of 1,3-dienes (B blocks).

10. The pressure-sensitive adhesive strip as claimed in claim 1, wherein

the vinylaromatic block copolymer is at least one synthetic rubber in the form of a block copolymer having an A-B, A-B-A, (A-B)_n, (A-B)_nX or (A-B-A)_nX structure,

in which

A blocks are independently a polymer formed by polymerization of at least one vinylaromatic,

B blocks are independently a polymer formed by polymerization of conjugated dienes having 4 to 18 carbon atoms, or a partly hydrogenated derivative of such a polymer,

X is the radical of a coupling reagent or initiator, and

n is an integer ≥

2.

11. The pressure-sensitive adhesive strip as claimed in claim 9, wherein

the vinylaromatics for formation of the A block include styrene, α

-methylstyrene and/or styrene derivatives.

12. The pressure-sensitive adhesive strip as claimed in claim 9, wherein

monomer for forming the B block is selected from the group consisting of butadiene, isoprene, ethylbutadiene, phenylbutadiene, piperylene, pentadiene, hexadiene, ethylhexadiene, dimethylbutadiene, and a mixture thereof.

13. The pressure-sensitive adhesive strip as claimed in claim 1, wherein

proportion of the vinylaromatic block copolymers, based on overall self-adhesive composition layer SK1, totals at least 20% by weight, and at most 75% by weight.

14. The pressure-sensitive adhesive strip as claimed in claim 1, wherein

layer SK1 is formed on basis of vinylaromatic block copolymer and tackifying resin.

15. The pressure-sensitive adhesive strip as claimed in claim 14, wherein

layer SK1 includes 20% to 60% by weight of tackifying resin, based on the total weight of the self-adhesive composition layer.

16. The pressure-sensitive adhesive strip as claimed in claim 14, wherein

the tackifying resin, to an extent of at least 75% by weight, is hydrocarbon resin or terpene resin or a mixture thereof.

17. The pressure-sensitive adhesive strip as claimed in claim 1, wherein

proportion of the microballoons in the foamed layer SK1 is up to 12% by weight, based on overall composition of layer SK1.

18. The pressure-sensitive adhesive strip as claimed in claim 1, wherein

mean diameter of the voids formed by the microballoons in the foamed layer SK1 is 60 to 100 μ

m.

19. The pressure-sensitive adhesive strip as claimed in claim 1, wherein

layer SK1 consists of the following composition:

20. The pressure-sensitive adhesive strip as claimed in claim 1, wherein

layer SK1 consists of the following composition:

21. The pressure-sensitive adhesive strip as claimed in claim 1, wherein

layer SK1 consists of the following composition:

22. The pressure-sensitive adhesive strip as claimed in claim 1, wherein

layer SK1 has an absolute density of 400 to 990 kg/m³, and/or a relative density of 0.35 to 0.99.

23. The pressure-sensitive adhesive strip as claimed in claim 4, wherein

the film carrier is non-extensible.

24. The pressure-sensitive adhesive strip as claimed in claim 4, wherein

the film carrier is extensible.

25. A method for bonding components of accumulators or electronic devices, the method comprising application of a pressure-sensitive adhesive strip according to claim 1 to a substrate.