RESIN COMPOSITION, METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT USING THE SAME, AND SEMICONDUCTOR DEVICE
First Claim
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1. A resin composition, comprising:
- (A1) an alkali-soluble resin having a structural unit represented by general formula (1);
(A2) at least one resin selected from the group consisting of polyimides, polybenzoxazoles, polyamideimides, precursors thereof, and copolymers thereof, the resin having a substituent that reacts with a reactive group of the alkali-soluble resin; and
(B) a photosensitizer, whereinan amount of the resin (A2) is 310 to 2,000 parts by weight with respect to 100 parts by weight of the resin (A1),
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Abstract
Provided is a resin composition including: (A1) an alkali-soluble resin having a specific structural unit; (A2) at least one resin selected from the group consisting of polyimides, polybenzoxazoles, polyamideimides, precursors thereof, and copolymers thereof, the resin having a substituent that reacts with a reactive group of the alkali-soluble resin; and (B) a photosensitizer, in which the amount of the resin (A2) is 310 to 2,000 parts by weight with respect to 100 parts by weight of the resin (A1).
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12 Claims
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1. A resin composition, comprising:
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(A1) an alkali-soluble resin having a structural unit represented by general formula (1); (A2) at least one resin selected from the group consisting of polyimides, polybenzoxazoles, polyamideimides, precursors thereof, and copolymers thereof, the resin having a substituent that reacts with a reactive group of the alkali-soluble resin; and (B) a photosensitizer, wherein an amount of the resin (A2) is 310 to 2,000 parts by weight with respect to 100 parts by weight of the resin (A1), - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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Specification