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PACKAGED SEMICONDUCTOR DEVICES WITH MULTI-USE INPUT CONTACTS AND RELATED METHODS

  • US 20180166378A1
  • Filed: 02/07/2018
  • Published: 06/14/2018
  • Est. Priority Date: 04/27/2016
  • Status: Active Grant
First Claim
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1. A packaged semiconductor device, comprising:

  • a first input contact configured to receive a first input voltage;

    a second input contact configured to receive a second input voltage;

    one or more comparing elements configured to compare the first input voltage with the second input voltage, and;

    one or more setting elements configured to set three operating parameters of the device in response to a comparison of the first input voltage and the second input voltage by the one or more comparing elements;

    wherein the three operating parameters are supplied to an electronic component coupled with the device; and

    wherein the three operating parameters are derived from no more input contacts than the first input contact and the second input contact.

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