SMART MOTOR DRIVER ARCHITECTURE WITH BUILT-IN MEMS SENSOR BASED EARLY DIAGNOSIS OF FAULTS
First Claim
1. A system in package (SiP), comprising:
- at least one integrated circuit die implementing a micro-electro-mechanical-systems (MEMS) sensor;
a least one integrated circuit die implementing a control circuit for a motor;
a support substrate having a top surface and a bottom surface, with first pads on the top surface and second pads on the bottom surface, the first and second pads interconnected by interconnect wiring;
wherein the at least one integrated circuit die implementing the MEMS sensor is mounted to the top surface and electrically connected to ones of said first pads;
wherein the at least one integrated circuit die implementing the control circuit for the motor body is also mounted to the top surface and electrically connected to ones of said first pads; and
an encapsulant body which encapsulates the at least one integrated circuit die implementing the MEMS sensor and the at least one integrated circuit die implementing the control circuit for the motor.
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Accused Products
Abstract
A system in package encloses a sensor and motor driver circuit. In an implementation, the sensor is an integrated circuit micro-electro-mechanical-systems (MEMS) sensor and the driver circuit is a motor driver circuit. Non-motor winding data information is sensed by the MEMS sensor and processed for the purpose of characterizing known fault patterns for motors; characterizing normal operation of the motor; and evaluating continued operation of the motor to detect abnormal motor behavior and instances of motor fault. The motor is driven using PWM control and the information output by the MEMS sensor is sampled at sampling times having a fixed timing relationship relative to the PWM control signals.
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Citations
31 Claims
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1. A system in package (SiP), comprising:
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at least one integrated circuit die implementing a micro-electro-mechanical-systems (MEMS) sensor; a least one integrated circuit die implementing a control circuit for a motor; a support substrate having a top surface and a bottom surface, with first pads on the top surface and second pads on the bottom surface, the first and second pads interconnected by interconnect wiring; wherein the at least one integrated circuit die implementing the MEMS sensor is mounted to the top surface and electrically connected to ones of said first pads; wherein the at least one integrated circuit die implementing the control circuit for the motor body is also mounted to the top surface and electrically connected to ones of said first pads; and an encapsulant body which encapsulates the at least one integrated circuit die implementing the MEMS sensor and the at least one integrated circuit die implementing the control circuit for the motor. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A method, comprising:
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operating a plurality of faulty motors having different known fault patterns over a range of motor operating speeds; sensing non-motor winding data information relating to each of the plurality of faulty motors using one or more micro-electro-mechanical-systems (MEMS) sensors; and processing the non-motor winding data information to generate a library of non-motor winding data information correlated to the known fault patterns. - View Dependent Claims (15, 16, 17, 18, 19, 20, 21, 22, 23, 24)
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25. A system, comprising:
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a micro-electro-mechanical-systems (MEMS) sensor; and a control circuit for a motor configured to generate PWM control signals; wherein the MEMS sensor includes a sample and hold circuit, wherein the sample and hold circuit is configured to perform a sampling operation on information output from the MEMS sensor in response to a control signal, and wherein said control signal is generated by the control circuit with a fixed timing relationship relative to the PWM control signals. - View Dependent Claims (26, 27, 28, 29, 30, 31)
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Specification