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SMART MOTOR DRIVER ARCHITECTURE WITH BUILT-IN MEMS SENSOR BASED EARLY DIAGNOSIS OF FAULTS

  • US 20180167016A1
  • Filed: 02/09/2017
  • Published: 06/14/2018
  • Est. Priority Date: 12/12/2016
  • Status: Active Grant
First Claim
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1. A system in package (SiP), comprising:

  • at least one integrated circuit die implementing a micro-electro-mechanical-systems (MEMS) sensor;

    a least one integrated circuit die implementing a control circuit for a motor;

    a support substrate having a top surface and a bottom surface, with first pads on the top surface and second pads on the bottom surface, the first and second pads interconnected by interconnect wiring;

    wherein the at least one integrated circuit die implementing the MEMS sensor is mounted to the top surface and electrically connected to ones of said first pads;

    wherein the at least one integrated circuit die implementing the control circuit for the motor body is also mounted to the top surface and electrically connected to ones of said first pads; and

    an encapsulant body which encapsulates the at least one integrated circuit die implementing the MEMS sensor and the at least one integrated circuit die implementing the control circuit for the motor.

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