FINGERPRINT SENSING MODULE AND METHOD FOR MANUFACTURING THE FINGERPRINT SENSING MODULE
First Claim
1. A fingerprint sensing module comprising:
- a fingerprint sensor device having a sensing array arranged on a first side of the device, the sensing array comprising an array of fingerprint sensing elements, wherein said fingerprint sensor device comprises connection pads for connecting said fingerprint sensor device to external circuitry;
a fingerprint sensor device cover structure arranged to cover said fingerprint sensor device, said cover structure having a first side configured to be touched by a finger, thereby forming a sensing surface of said sensing module, and a second side facing said sensing array, wherein said cover structure comprises conductive traces arranged on the second side of the cover structure, for electrically connecting said fingerprint sensing module to external circuitry, and wherein a surface area of said cover structure is larger than a surface area of said sensor device;
wherein said fingerprint sensor device further comprises wire-bonds electrically connecting said connection pads of said fingerprint sensor device to said conductive traces of said cover structure.
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Accused Products
Abstract
There is provided a fingerprint sensing module comprising a fingerprint sensor device having a sensing array arranged on a first side of the device. The fingerprint sensor device also comprises connection pads for connecting the fingerprint sensor device to external circuitry and a fingerprint sensor device cover structure, the cover structure having a first side configured to be touched by a finger, and a second side facing the sensing array, wherein the cover structure comprises conductive traces, arranged on the second side, for electrically connecting the fingerprint sensor module to external circuitry, and wherein a surface area of the cover structure is larger than a surface area of the sensor device. Moreover, the fingerprint sensor device comprises wire-bonds electrically connecting the connection pads of the fingerprint sensing device to the conductive traces of the cover structure.
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Citations
21 Claims
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1. A fingerprint sensing module comprising:
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a fingerprint sensor device having a sensing array arranged on a first side of the device, the sensing array comprising an array of fingerprint sensing elements, wherein said fingerprint sensor device comprises connection pads for connecting said fingerprint sensor device to external circuitry; a fingerprint sensor device cover structure arranged to cover said fingerprint sensor device, said cover structure having a first side configured to be touched by a finger, thereby forming a sensing surface of said sensing module, and a second side facing said sensing array, wherein said cover structure comprises conductive traces arranged on the second side of the cover structure, for electrically connecting said fingerprint sensing module to external circuitry, and wherein a surface area of said cover structure is larger than a surface area of said sensor device; wherein said fingerprint sensor device further comprises wire-bonds electrically connecting said connection pads of said fingerprint sensor device to said conductive traces of said cover structure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 21)
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18. A method for manufacturing a fingerprint sensing module comprising:
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providing a fingerprint sensor device having a sensing array arranged on a first side of the device, the sensing array comprising an array of fingerprint sensing elements, wherein said fingerprint sensor device comprises connection pads for connecting said fingerprint sensor device to external circuitry; providing a fingerprint sensor device cover structure comprising conductive traces, arranged on the second side of the cover structure, for electrically connecting said fingerprint sensing module to the external circuitry; attaching said fingerprint sensor device to said cover structure; electrically connecting said fingerprint sensor device by means of wire bonding between said connections pads and said conductive traces. - View Dependent Claims (19, 20)
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Specification