SURFACE-MOUNT INDUCTOR

• US 20180174740A1
• Filed: 12/18/2017
• Published: 06/21/2018
• Est. Priority Date: 12/21/2016
• Status: Abandoned Application

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: MUNEUCHI, Keita
• Application Number:
  US15/845,143
• Publication Number:
  US 20180174740A1
• Time in Patent Office: Days
• CPC Class Codes: H01F 27/24 Magnetic cores
• CPC Class Codes: H01F 27/2828 Construction of conductive connections, of leads
• CPC Class Codes: H01F 27/2847 Sheets; Strips H01F27/2866 takes precedence
• CPC Class Codes: H01F 27/292 Surface mounted devices
• CPC Class Codes: H01F 27/327 Encapsulating or impregnating encapsulating coil and core H01F27/022

Abstract

A surface-mount inductor includes a coil formed by winding a conductive wire, and a molded body made of a sealing material containing a metal magnetic material and a resin with the coil incorporated therein. The coil includes a winding part and a lead-out part with an end portion of the lead-out part disposed inside the molded body. The molded body has an external electrode disposed on a mounting surface. The surface-mount inductor includes a conductor connecting the external electrode and the lead-out part. The conductor is at least partially buried in the molded body.

Claims

1. A surface-mount inductor comprising:

a coil, formed by winding a conductive wire, and including a winding part and a lead-out part with an end portion;

a molded body made of a sealing material containing a metal magnetic material and a resin with the coil incorporated therein, the molded body having an external electrode disposed on a mounting surface, and the end portion of the lead-out part of the coil being disposed inside the molded body; and

a conductor, at least partially buried in the molded body, and connecting the external electrode and the lead-out part.

2. The surface-mount inductor according to claim 1, wherein the conductor is entirely buried in the molded body.

3. The surface-mount inductor according to claim 1, wherein the conductor has a surface partially exposed from the molded body.

4. The surface-mount inductor according to claim 1, wherein the lead-out part has a connecting portion thinner than the conductive wire, and the connecting portion is connected to the conductor.

5. The surface-mount inductor according to claim 2, wherein the lead-out part has a connecting portion thinner than the conductive wire, and the connecting portion is connected to the conductor.

6. The surface-mount inductor according to claim 3, wherein the lead-out part has a connecting portion thinner than the conductive wire, and the connecting portion is connected to the conductor.

7. The surface-mount inductor according to claim 1, wherein a winding axis of the coil is orthogonal to the mounting surface.

8. The surface-mount inductor according to claim 2, wherein a winding axis of the coil is orthogonal to the mounting surface.

9. The surface-mount inductor according to claim 3, wherein a winding axis of the coil is orthogonal to the mounting surface.

10. The surface-mount inductor according to claim 4, wherein a winding axis of the coil is orthogonal to the mounting surface.

11. The surface-mount inductor according to claim 5, wherein a winding axis of the coil is orthogonal to the mounting surface.

12. The surface-mount inductor according to claim 6, wherein a winding axis of the coil is orthogonal to the mounting surface.

13. The surface-mount inductor according to claim 1, wherein the molded body defines a hole therein, and at least a portion of the conductor is disposed in the hole.

14. The surface-mount inductor according to claim 13, wherein the hole extends orthogonal to the mounting surface.

15. The surface-mount inductor according to claim 13, wherein the hole traverses the lead-out part.

16. The surface-mount inductor according to claim 13, wherein the hole extends from the mounting surface to a hole end inside the molded body, and the lead-out part is exposed to the hole at a location between the mounting surface and the hole end.

17. The surface-mount inductor according to claim 13, wherein the hole extends from the mounting surface to a hole end inside the molded body, and the lead-out part is exposed to the hole at the hole end.

18. The surface-mount inductor according to claim 1, wherein the molded body defines a groove therein extending along the mounting surface, and at least a portion of the conductor is disposed in the groove.

19. The surface-mount inductor according to claim 18, wherein the lead-out part is exposed to the groove.

20. The surface-mount inductor according to claim 1, wherein the conductor is disposed directly under the external electrode.